JPH02309601A - Structure of chip parts and mounting method of chip parts - Google Patents
Structure of chip parts and mounting method of chip partsInfo
- Publication number
- JPH02309601A JPH02309601A JP13048889A JP13048889A JPH02309601A JP H02309601 A JPH02309601 A JP H02309601A JP 13048889 A JP13048889 A JP 13048889A JP 13048889 A JP13048889 A JP 13048889A JP H02309601 A JPH02309601 A JP H02309601A
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- chip
- short side
- concave portion
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はチップ部品の構造及びチップ部品の取付方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure of a chip component and a method of attaching a chip component.
〔従来の技術）
従来のチップ部品の構造は、第３図に示す如く、例えば
チップ抵抗器６の場合、直方体のケース７の一平面に抵
抗皮膜８を形成した後、短片側の両端部に電極９を形成
したものであった。[Prior Art] As shown in FIG. 3, the structure of a conventional chip component is, for example, in the case of a chip resistor 6, a resistive film 8 is formed on one plane of a rectangular parallelepiped case 7, and then a resistive film 8 is formed on both ends of the short side. The electrode 9 was formed thereon.
従って、このチップ抵抗器をプリント配線板に実装する
場合、平面的に載置することしか出来ず、機器の回路が
複雑になりチップ部品の数が多くなるに従ってプリント
配線板の数を増したり、プリント配線板を大型化せざる
を得なかった。Therefore, when mounting this chip resistor on a printed wiring board, it is only possible to mount it on a flat surface, and as the circuit of the device becomes more complex and the number of chip components increases, the number of printed wiring boards must be increased. Printed wiring boards had to be made larger.
本発明は上記従来の欠点を解決し、プリント配線板上の
部品の集積度を高めることができるチップ部品の構造及
びチップ部品の取付方法を提供することを目的としてい
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a chip component structure and a chip component mounting method that can solve the above-mentioned conventional drawbacks and increase the degree of integration of components on a printed wiring board.
上記課題を解決するために本発明では、略長方形の平面
を有する直方体であって、短辺側の両端部にハンダ付用
の電極を有し、一平面に前記短辺と略平行に少なくとも
同短辺の長さと同等以上の幅の溝を設けて、凹状部を形
成し、間溝の深さを前記チップ部品の厚みの少なくとも
半分以上としたことを特徴とするチップ部品の構造とし
た。In order to solve the above problems, the present invention is a rectangular parallelepiped with a substantially rectangular plane, has electrodes for soldering at both ends of the short side, and has electrodes for soldering on one plane substantially parallel to the short side and at least the same size. The structure of the chip component is characterized in that a groove having a width equal to or more than the length of the short side is provided to form a concave part, and the depth of the groove is at least half the thickness of the chip component.
そして、前記チップ部品の凹状部に抵抗、または、−コ
ンデンサ、または、インダクタ、または、ダイオードま
たは、ジャンパー用の導体を形成した。そして、略長方
形の平面を有する直方体であって、短辺側の両端部にハ
ンダ付用の電極を有し、一平面に前記短辺と略平行に少
なくとも同短辺の長さと同等以上の幅の溝を設け、凹状
部を形成した二つのチップ部品の溝を対向させ、かつ、
互いに直交させて重ね合わせ、プリント配線板上に重ね
合わせた二つのチップ部品を載置せしめたのち、同プリ
ント配線板の銅箔と同チップ部品の電極との間をハンダ
付けするチップ部品の取付方法とした。Then, a resistor, a capacitor, an inductor, a diode, or a conductor for a jumper was formed in the concave portion of the chip component. The rectangular parallelepiped has a substantially rectangular plane, has electrodes for soldering at both ends of the short side, and has a width on one plane substantially parallel to the short side at least equal to or greater than the length of the short side. the grooves of the two chip components each having a concave portion facing each other, and
Attachment of chip components by placing two stacked chip components on a printed wiring board so that they are perpendicular to each other, and then soldering between the copper foil of the printed wiring board and the electrodes of the chip component. method.
上記構成によれば、略長方形の平面を有する直方体の短
辺側の両端部にハンダ付用の電極を設け、一平面に短辺
と略平行に少なくとも同短辺の長さと同等以上の幅の溝
を設は凹状部を形成したので、二つのチップ部品の、溝
を対向させ、かつ、互いに直交させて重ね合わせ、プリ
ント配線板上に重ね合わせた二つのチップ部品を載置せ
しめたとき、二つのチップ部品の短辺側の両端部に設け
たハンダ付用の電極がプリント配線板の銅箔に当接して
ハンダ付けすることができる。According to the above configuration, electrodes for soldering are provided at both ends of the short side of a rectangular parallelepiped having a substantially rectangular plane, and a width at least equal to or more than the length of the short side is provided on one plane substantially parallel to the short side. Since the grooves were formed and the concave portions were formed, when the two chip components were placed one on top of the other with the grooves facing each other and perpendicular to each other, and the two stacked chip components were placed on the printed wiring board, Soldering electrodes provided at both ends of the short sides of the two chip components can contact the copper foil of the printed wiring board to perform soldering.
以下、本発明の一実施例を図面を参照しながら説明する
。An embodiment of the present invention will be described below with reference to the drawings.
第１図において、■はチップ抵抗器で、このチップ抵抗
器１は、アルミナ製で略長方形の平面を有する直方体の
ケース２と、抵抗皮膜３と、電極４とで構成されている
。ケース２の表面には溝２１が設けられ、凹状部２２が
形成されている。In FIG. 1, ``■'' is a chip resistor, and this chip resistor 1 is composed of a rectangular parallelepiped case 2 made of alumina and having a substantially rectangular plane, a resistive film 3, and an electrode 4. A groove 21 is provided on the surface of the case 2, and a concave portion 22 is formed.
この溝２１は、ケース２の短辺と平行に形成さ瓢短辺の
長さと同等以上の幅と、ケース２の厚みの半分以上の深
さを有している。抵抗皮膜３は、凹状部２２の裏側に形
成されている。この抵抗皮膜３の表面には絶縁皮膜等を
設けることもできる。This groove 21 is formed parallel to the short side of the case 2 and has a width equal to or more than the length of the short side of the gourd, and a depth equal to or more than half the thickness of the case 2. The resistive film 3 is formed on the back side of the concave portion 22. An insulating film or the like can also be provided on the surface of this resistance film 3.
電極４は、抵抗皮膜３の両端と接合し、ケース２の短辺
側の両端部に形成されている。The electrodes 4 are connected to both ends of the resistive film 3 and are formed at both ends of the short side of the case 2 .
以上の構成において、次にこのチップ抵抗器のプリント
配線板への取付方法を第２図を用いて説明量ると、先ず
、回路基板５の銅箔５１に挟まれた所定の位置に接着剤
を塗布する０次に、一番目のチップ抵抗器１を溝２１を
上向きにして、かつ、両端の電極４が夫々対応するプリ
ント配線板５の銅箔５１と正しく当接するようにプリン
ト配線板５上に載置し加熱して仮り止めする０次に、前
記一番目のチップ抵抗器１の溝２１の中央部に接着剤を
塗布したのち、二番目のチップ抵抗器１を溝２１を下向
きにして、前記一番目のチップ抵抗器１の溝２１と対向
させ、かつ、互いに直交させて重ね合わせ加熱して仮り
止めする。そして、プリント配線板５の銅箔５１面を溶
融したハンダに浸し、前記二つのチップ抵抗器１の夫々
の電極４と対応する夫々の銅箔５１との間をハンダ付け
することに依って取付けを完了する。In the above configuration, the method of attaching this chip resistor to a printed wiring board will be explained using FIG. Next, place the first chip resistor 1 on the printed wiring board 5 so that the groove 21 faces upward and the electrodes 4 at both ends are in correct contact with the copper foils 51 of the corresponding printed wiring board 5. Next, apply adhesive to the center of the groove 21 of the first chip resistor 1, and then place the second chip resistor 1 with the groove 21 facing downward. Then, they are placed facing the groove 21 of the first chip resistor 1 and perpendicular to each other, heated, and temporarily fixed. Then, the copper foil 51 side of the printed wiring board 5 is immersed in molten solder, and the electrodes 4 of the two chip resistors 1 are attached to the corresponding copper foils 51 by soldering. complete.
また、上述した取付方法の他の例として、一番目のチッ
プ抵抗器１と二番目のチップ抵抗器１とを予め組合わせ
て仮り止めしたものを、プリント配線板５上に載置し加
熱して仮止めしてもよい。In addition, as another example of the above-mentioned mounting method, the first chip resistor 1 and the second chip resistor 1 are assembled in advance and temporarily fastened together, and then placed on the printed wiring board 5 and heated. It may be temporarily fixed.
一方、チップコンデンサ、チップインダクタ、等につい
ても、上述した凹状部２２に夫々コンデンサ、または、
インダクタ、等を形成したもので、その他の構成は上述
のものと略同−である。On the other hand, regarding chip capacitors, chip inductors, etc., each capacitor or
An inductor, etc. are formed, and the other configurations are approximately the same as those described above.
（発明の効果〕
以上のように本発明によれば、二つのチップ部品の、溝
を対向させ、かつ、互いに直交させて重ね合わせ、プリ
ント配線板上に載置せしめてハンダ付けすることができ
るので、プリント配線板上の部品の集積度を高め、機器
の小型化、および、コスト低下に寄与することができる
。(Effects of the Invention) As described above, according to the present invention, two chip components can be stacked with their grooves facing each other and orthogonal to each other, placed on a printed wiring board, and soldered. Therefore, the degree of integration of components on the printed wiring board can be increased, contributing to miniaturization of equipment and cost reduction.
第１図は本発明の一実施例を示すチップ抵抗器の斜視図
、第２図は同チップ抵抗器を重ね合わせてプリント配線
板上に載置した状態を示す一部省略斜視図、第３図は従
来例を示すチップ抵抗器の斜視図である。
１・・・チップ抵抗器、２・・・ケース、３・・・抵抗
皮膜、４・・・電極、２１・・・溝、２２・・・凹状部
。FIG. 1 is a perspective view of a chip resistor showing an embodiment of the present invention, FIG. 2 is a partially omitted perspective view showing the same chip resistor stacked on top of each other and placed on a printed wiring board, and FIG. The figure is a perspective view of a conventional chip resistor. DESCRIPTION OF SYMBOLS 1... Chip resistor, 2... Case, 3... Resistance film, 4... Electrode, 21... Groove, 22... Recessed part.
Claims (8)
の両端部にハンダ付用の電極を有し、一平面に前記短辺
と略平行に少なくとも同短辺の長さと同等以上の幅の溝
を設け、凹状部を形成したことを特徴とするチップ部品
の構造。(1) A rectangular parallelepiped with a substantially rectangular plane, having electrodes for soldering at both ends of the short side, and having a length on one plane substantially parallel to the short side at least equal to or longer than the length of the same short side. A structure of a chip component characterized by providing a wide groove and forming a concave portion.
も半分以上であることを特徴とする請求項（１）記載の
チップ部品の構造。(2) The structure of a chip component according to claim 1, wherein the depth of the groove is at least half the thickness of the chip component.
特徴とする請求項（１）記載のチップ部品の構造。(3) The structure of the chip component according to claim (1), wherein a resistor is formed in the concave portion of the chip component.
ことを特徴とする請求項（１）記載のチップ部品の構造
。(4) The structure of the chip component according to claim (1), wherein a capacitor is formed in the concave portion of the chip component.
ことを特徴とする請求項（１）記載のチップ部品の構造
。(5) The structure of the chip component according to claim (1), wherein an inductor is formed in the concave portion of the chip component.
ことを特徴とする請求項（１）記載のチップ部品の構造
。(6) The structure of the chip component according to claim (1), wherein a diode is formed in the concave portion of the chip component.
形成したことを特徴とする請求項（１）記載のチップ部
品の構造。(7) The structure of the chip component according to claim (1), wherein a conductor for a jumper is formed in the concave portion of the chip component.
の両端部にハンダ付用の電極を有し、一平面に前記短辺
と略平行に少なくとも同短辺の長さと同等以上の幅の溝
を設け、凹状部を形成した二つのチップ部品の、溝を対
向させ、かつ、互いに直交させて重ね合わせ、プリント
配線板上に重ね合わせた二つのチップ部品を載置せしめ
たのち同プリント配線板の銅箔と同チップ部品の電極と
の間をハンダ付けしたことを特徴とするチップ部品の取
付方法。(8) A rectangular parallelepiped with a substantially rectangular plane, having electrodes for soldering at both ends of the short side, and having a length on one plane substantially parallel to the short side at least equal to or longer than the length of the same short side. Two chip components each having a width groove and a concave portion formed therein are stacked with the grooves facing each other and perpendicular to each other, and the two stacked chip components are placed on a printed wiring board. A method for attaching a chip component, characterized by soldering between the copper foil of a printed wiring board and the electrode of the chip component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13048889A JPH02309601A (en) | 1989-05-24 | 1989-05-24 | Structure of chip parts and mounting method of chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13048889A JPH02309601A (en) | 1989-05-24 | 1989-05-24 | Structure of chip parts and mounting method of chip parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02309601A true JPH02309601A (en) | 1990-12-25 |
Family
ID=15035458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13048889A Pending JPH02309601A (en) | 1989-05-24 | 1989-05-24 | Structure of chip parts and mounting method of chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02309601A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515416U (en) * | 1991-07-31 | 1993-02-26 | 日本電気株式会社 | Surface mount components |
| US11641717B2 (en) | 2021-08-30 | 2023-05-02 | International Business Machines Corporation | Soldering of end chip components in series |
-
1989
- 1989-05-24 JP JP13048889A patent/JPH02309601A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515416U (en) * | 1991-07-31 | 1993-02-26 | 日本電気株式会社 | Surface mount components |
| US11641717B2 (en) | 2021-08-30 | 2023-05-02 | International Business Machines Corporation | Soldering of end chip components in series |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4495546A (en) | Hybrid integrated circuit component and printed circuit board mounting said component | |
| JP2789406B2 (en) | Circuit board | |
| JPH02309601A (en) | Structure of chip parts and mounting method of chip parts | |
| JP2512828B2 (en) | Chip component mounting method | |
| JPS60109296A (en) | Method of connecting printed circuit board | |
| JP2636332B2 (en) | Printed board | |
| JPH01102990A (en) | Small electronic parts mounting circuit | |
| JPH02159791A (en) | Surface mounting method for electronic components | |
| JPH084696Y2 (en) | Hybrid integrated circuit | |
| JP2003309354A (en) | Connection method of printed wiring board and printed wiring board | |
| JPS6020300Y2 (en) | printed wiring board | |
| JPS631093A (en) | Board device for mounting electronic components | |
| JPH0443437B2 (en) | ||
| JPS6236316Y2 (en) | ||
| JPS6163083A (en) | High density mounting substrate | |
| JPS59180470U (en) | Printed circuit board connection structure | |
| JPS60201692A (en) | Wiring circuit device | |
| JP2969977B2 (en) | Multiple chip parts | |
| JP3038144B2 (en) | Circuit board | |
| JPS60107817A (en) | Mounting structure of chip type electronic part | |
| JPS63156390A (en) | Hybrid integrated circuit components | |
| JPH027598A (en) | Elements for hybrid integrated circuits | |
| JPS58173887A (en) | Board unit | |
| JPH09199669A (en) | Printed wiring board module | |
| JPS60236282A (en) | Electronic circuit board |