JPH0443437B2 - - Google Patents
Info
- Publication number
- JPH0443437B2 JPH0443437B2 JP25158483A JP25158483A JPH0443437B2 JP H0443437 B2 JPH0443437 B2 JP H0443437B2 JP 25158483 A JP25158483 A JP 25158483A JP 25158483 A JP25158483 A JP 25158483A JP H0443437 B2 JPH0443437 B2 JP H0443437B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- type electronic
- electronic component
- lead pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000006071 cream Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- -1 coils Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、角型六面体で形成されるチツプ型電
子部品（抵抗、コンデンサー、コイル、半導体
等）の実装構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a mounting structure for chip-type electronic components (resistors, capacitors, coils, semiconductors, etc.) formed of prismatic hexahedrons.
従来の角型六面体で形成されるチツプ型電子部
品（以下、チツプ部品）の実装構造を第１図（特
公昭）に断面図で示す。同図Ａのように、従来の
チツプ部品の実装構造は、回路基板１上にハンダ
クリーム２ａ，２ｂを印刷し、その上にチツプ部
品３を、六面体の最も面積が大きい面素体面４
ａ，４ｂを上・下面になるような安定した形で搭
載し、その後リフロー炉等によりハンダ付を行う
構造である。５ａ，５ｂは外部電極を示す。同図
Ｂは、ハンダ付けされた状態を示す断面図であ
り、６ａ，６ｂはハンダクリーム５ａ，５ｂが硬
化したハンダを示す。また、この他の従来例とし
ては、回路基板上に接着剤を塗布し、接着剤でチ
ツプ部品を固定してからハンダバスを通し、ハン
ダ付を行う方法もある。
A cross-sectional view of the mounting structure of a conventional chip-type electronic component (hereinafter referred to as a chip component) formed of a square hexahedron is shown in FIG. 1 (Tokukosho). As shown in Figure A, the conventional chip component mounting structure is to print solder cream 2a, 2b on a circuit board 1, and then place the chip component 3 on the hexahedral surface 4, which is the largest area of the hexahedron.
This is a structure in which parts a and 4b are mounted in a stable manner with the upper and lower sides facing each other, and then soldered using a reflow oven or the like. 5a and 5b indicate external electrodes. FIG. 6B is a sectional view showing the soldered state, and 6a and 6b show the solder in which the solder creams 5a and 5b have hardened. Another conventional method involves applying an adhesive onto a circuit board, fixing the chip components with the adhesive, and then passing the chips through a solder bus for soldering.
以上の述べたいずれの従来例においても、角型
六面体のもつとも広い面積を有する素体面を上・
下面としてハンダ付け実装を行なう構成のため、
多数個を同一の回路基板に実装する場合には実装
面積を最大必要とし、又、配線用リードパターン
面積にも限度があり、電子機器の軽薄短小化から
の高密度実装の要請に充分対応できないという欠
点を有している。 In all of the conventional examples described above, the element surface, which has the widest area of the rectangular hexahedron, is
Because it is configured to be soldered and mounted on the bottom surface,
When mounting a large number of devices on the same circuit board, the maximum mounting area is required, and the lead pattern area for wiring is also limited, making it impossible to meet the demands for high-density mounting as electronic devices become lighter, thinner, and smaller. It has the following drawbacks.
本発明は以上の欠点を解消し、チツプ部品の実
装において、従来の実装面積と比較して約50％の
高密度化を可能とする実装構造を提供するもので
ある。
The present invention eliminates the above-mentioned drawbacks and provides a mounting structure that enables a higher density of chip components by about 50% compared to the conventional mounting area.
本発明のチツプ型電子部品の実装構造は、角型
多面体で形成されるチツプ型電子部品が各々の前
記多面体のもつとも広い面積を有する素体面を回
路基板に対して垂直に接合されると共に、前記チ
ツプ型電子部品の挿通される案内孔を有するプリ
ント基板からなる補助板に位置決め支持され、前
記回路基板および前記補助板のリードパターンと
前記チツプ型電子部品とが、電気的に接続されて
なることを特徴とする。
In the mounting structure of a chip-type electronic component of the present invention, a chip-type electronic component formed of a square polyhedron is joined perpendicularly to a circuit board with the element surface having the widest area of each polyhedron, and Positioned and supported by an auxiliary board made of a printed circuit board having a guide hole through which a chip-type electronic component is inserted, and the lead pattern of the circuit board and the auxiliary board and the chip-type electronic component are electrically connected. It is characterized by
以下、本発明について実施例にもとづき詳細に
説明する。
Hereinafter, the present invention will be explained in detail based on examples.
第２図は、本発明に関するチツプ部品の一例と
する積層チツプコンデンサーの斜視図であり、該
チツプ部品７は角型六面体のセラミツク素体８
（以下、素体８と称す）と該素体８の両端面に設
けられた外部電極９ａ，９ｂとから構成されてい
る。 FIG. 2 is a perspective view of a laminated chip capacitor as an example of a chip component according to the present invention, and the chip component 7 is made of a rectangular hexahedral ceramic body 8.
(hereinafter referred to as the element body 8) and external electrodes 9a and 9b provided on both end faces of the element body 8.
第３図は、チツプ部品７の回路基板への実装例
を示す断面図であり、第４図は実装方法を説明す
るための斜視図である。 FIG. 3 is a sectional view showing an example of mounting the chip component 7 on a circuit board, and FIG. 4 is a perspective view for explaining the mounting method.
第３図によれば、本発明は、角型六面体で構成
されるチツプ部品７の、該六面体のもつとも広い
面積を有する素体面８ａ，８ｂ（第４図に示す）
が、回路基板１０に対して垂直にハンダ付けによ
り接合されていることと、さらにチツプ部品７
が、該チツプ部品７の案内孔１１を有するポリイ
ミド、ガラス入りエポキシ等の耐熱性プリント基
板から成る補助板１２に位置決めされ、支持され
ていることと、さらに、該補助板１２上に形成さ
れたリードパターン１３とチツプ部品７がハンダ
１４でハンダ付けされている。以上の構成を特徴
とするチツプ部品の実装構造である。 According to FIG. 3, the present invention provides element surfaces 8a and 8b (shown in FIG. 4) of a chip component 7 composed of a rectangular hexahedron, which has the largest area of the hexahedron.
is vertically connected to the circuit board 10 by soldering, and furthermore, the chip component 7 is connected vertically to the circuit board 10 by soldering.
is positioned and supported by an auxiliary plate 12 made of a heat-resistant printed circuit board made of polyimide, glass-filled epoxy, etc., which has a guide hole 11 of the chip component 7, and furthermore, a Lead pattern 13 and chip component 7 are soldered together with solder 14. This is a chip component mounting structure characterized by the above configuration.
第４図により実装方法を説明する。先ず、前記
従来例と同様、回路基板１０上のリードパターン
表面にハンダクリームを印刷する。次に回路基板
１０に植設されているスペーサー１５を介してチ
ツプ部品７の案内孔１１およびリードパターン１
３を有する補助板１２を固定し、その案内孔１１
にチツプ部品７を供給する。供給されたチツプ部
品７は案内孔１１に沿つて回路基板１０上に落下
し、素体面８ａ，８ｂを垂直にして位置決めされ
る。次に、補助板１２のリードパターン１３と電
子部品７の外部電極９間にデイスペンサー等でハ
ンダクリームを吐出する。この状態でリフロ炉を
通すことによりハンダクリームが溶融・硬化し、
同図のようにハンダ１４による固着が完了するも
のである。 The mounting method will be explained with reference to FIG. First, like the conventional example, solder cream is printed on the surface of the lead pattern on the circuit board 10. Next, the guide hole 11 of the chip component 7 and the lead pattern 1 are inserted through the spacer 15 embedded in the circuit board 10.
3 and fix the auxiliary plate 12 having the guide hole 11.
The chip parts 7 are supplied to. The supplied chip component 7 falls onto the circuit board 10 along the guide hole 11 and is positioned with the element surfaces 8a and 8b perpendicular. Next, solder cream is discharged between the lead pattern 13 of the auxiliary plate 12 and the external electrode 9 of the electronic component 7 using a dispenser or the like. In this state, the solder cream is melted and hardened by passing it through a reflow oven.
As shown in the figure, fixing by the solder 14 is completed.
以上本発明によれば、角型六面体のもつとも広
い面積を有する素体面が回路基板に垂直に実装さ
れること、また補助板にも配線用リードパターン
を形成することができるため、実装面積において
従来の約50％の高密度化が可能となる。さらにま
た、補助板を設けることによりチツプ部品の位置
ずれ、シヨートが防止でき、より信頼性の高い実
装が得られる。
As described above, according to the present invention, the element surface of the rectangular hexahedron, which has a large area, is mounted perpendicularly to the circuit board, and the wiring lead pattern can also be formed on the auxiliary board. It is possible to increase the density by approximately 50%. Furthermore, by providing the auxiliary plate, it is possible to prevent chip components from shifting and shooting, resulting in more reliable mounting.
第１図Ａ，Ｂは、従来例を示す断面図。第２図
はチツプ型電子部品の斜視図。第３図は本発明の
実施例を示す断面図。第４図は本発明の実施例を
示す斜視図。
７……チツプ部品、８……素体、８ａ，８ｂ…
…もつとも広い面積を有する素体面、９……外部
電極、１０……回路基板、１１……案内孔、１２
……補助板、１３……リードパターン、１４……
ハンダ、１５……スペーサー。
FIGS. 1A and 1B are sectional views showing a conventional example. FIG. 2 is a perspective view of a chip-type electronic component. FIG. 3 is a sectional view showing an embodiment of the present invention. FIG. 4 is a perspective view showing an embodiment of the present invention. 7...Chip parts, 8...Element body, 8a, 8b...
...Element surface having a wide area, 9...External electrode, 10...Circuit board, 11...Guiding hole, 12
... Auxiliary board, 13 ... Lead pattern, 14 ...
Solder, 15...Spacer.
Claims (1)
各々の前記多面体のもつとも広い面積を有する素
体面を回路基板に対して垂直に接合されると共
に、前記チツプ型電子部品の挿通される案内孔を
有するプリント基板からなる補助板に位置決め支
持され、前記回路基板および前記補助板のリード
パターンと前記チツプ型電子部品とが、電気的に
接続されてなることを特徴とするチツプ型電子部
品の実装構造。1 A chip-type electronic component formed of a square polyhedron is joined perpendicularly to a circuit board with the element surface having the widest area of each polyhedron, and a guide hole into which the chip-type electronic component is inserted is formed. A mounting structure for a chip-type electronic component, characterized in that the chip-type electronic component is positioned and supported by an auxiliary board made of a printed circuit board, and the chip-type electronic component is electrically connected to the lead pattern of the circuit board and the auxiliary board. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25158483A JPS60140786A (en) | 1983-12-27 | 1983-12-27 | Mounting structure for chip type electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25158483A JPS60140786A (en) | 1983-12-27 | 1983-12-27 | Mounting structure for chip type electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60140786A JPS60140786A (en) | 1985-07-25 |
| JPH0443437B2 true JPH0443437B2 (en) | 1992-07-16 |
Family
ID=17224984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25158483A Granted JPS60140786A (en) | 1983-12-27 | 1983-12-27 | Mounting structure for chip type electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60140786A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232682A (en) * | 1985-08-03 | 1987-02-12 | 株式会社 ニフコ | Improvement in integration density for 3-d circuit structural body |
| JP2006210779A (en) * | 2005-01-31 | 2006-08-10 | Victor Co Of Japan Ltd | Board assembly |
| JP2020155512A (en) * | 2019-03-19 | 2020-09-24 | 日本電気株式会社 | Interposer, junction structure, and mounting method |
-
1983
- 1983-12-27 JP JP25158483A patent/JPS60140786A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60140786A (en) | 1985-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61263209A (en) | Decoupling capacitor and formation thereof | |
| JPH0443437B2 (en) | ||
| JP2642922B2 (en) | Printed wiring board | |
| JPH02134890A (en) | Circuit element mounting board | |
| JPH0542803B2 (en) | ||
| JPH1140918A (en) | Ceramics element, component-mounting board and wiring board | |
| JPH08162767A (en) | Ball grid array package mounting structure | |
| JP2636332B2 (en) | Printed board | |
| JP2792958B2 (en) | Hybrid integrated circuit device | |
| JP2501678Y2 (en) | Circuit board device | |
| JPS5994493A (en) | Circuit board device with electronic components | |
| JPS631093A (en) | Board device for mounting electronic components | |
| JPS58105587A (en) | circuit board | |
| JPH0125491Y2 (en) | ||
| JPH04119689A (en) | printed wiring board | |
| JPS6236316Y2 (en) | ||
| JPH02305208A (en) | Surface mount part | |
| JPS60143618A (en) | Electronic part | |
| JPH01191491A (en) | multiplex circuit board | |
| JPH04243187A (en) | Printed circuit board | |
| JPH0128714Y2 (en) | ||
| JPH04249078A (en) | Printed wiring board connection terminal device | |
| JPH02309601A (en) | Structure of chip parts and mounting method of chip parts | |
| JPS63107101A (en) | Square chip type electronic component | |
| JPH0590728A (en) | Hybrid integrated circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |