JPH0233443U - - Google Patents
Info
- Publication number
- JPH0233443U JPH0233443U JP1988110661U JP11066188U JPH0233443U JP H0233443 U JPH0233443 U JP H0233443U JP 1988110661 U JP1988110661 U JP 1988110661U JP 11066188 U JP11066188 U JP 11066188U JP H0233443 U JPH0233443 U JP H0233443U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- frame
- notch
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Description
第１図はこの考案の半導体装置の一実施例を示
す平面図および斜視図、第２図は従来の半導体装
置を示す斜視図である。 １……基板、２……半導体素子、３……金属細
線、４……枠板、５……切欠部、７……封止樹脂
、９……溝。
す平面図および斜視図、第２図は従来の半導体装
置を示す斜視図である。 １……基板、２……半導体素子、３……金属細
線、４……枠板、５……切欠部、７……封止樹脂
、９……溝。
Claims (1)
- 【実用新案登録請求の範囲】 基板上に半導体素子が直接搭載され、その素子
の電極部は基板上の配線パターンに金属細線によ
り配線され、その配線部と素子部を囲むように枠
板が基板表面に配置され、この枠板の一部には切
欠部が設けられ、この切欠部から枠板内側に充填
された封止樹脂により前記配線部および素子部が
覆われる半導体装置において、 枠板内側から枠板外側に通じる空気抜き用の溝
を基板表面に形成したことを特徴とする半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110661U JPH0233443U (ja) | 1988-08-25 | 1988-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110661U JPH0233443U (ja) | 1988-08-25 | 1988-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233443U true JPH0233443U (ja) | 1990-03-02 |
Family
ID=31348022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988110661U Pending JPH0233443U (ja) | 1988-08-25 | 1988-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233443U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149926A (ja) * | 2005-11-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 筐体構造とこれを用いた情報機器 |
-
1988
- 1988-08-25 JP JP1988110661U patent/JPH0233443U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149926A (ja) * | 2005-11-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 筐体構造とこれを用いた情報機器 |