JPH0351868U - - Google Patents
Info
- Publication number
- JPH0351868U JPH0351868U JP11317789U JP11317789U JPH0351868U JP H0351868 U JPH0351868 U JP H0351868U JP 11317789 U JP11317789 U JP 11317789U JP 11317789 U JP11317789 U JP 11317789U JP H0351868 U JPH0351868 U JP H0351868U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic circuit
- semiconductor integrated
- utility
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の一実施例を示す透視図。
１……半導体集積回路、２……基板、３……配
線パターン、４……リード線、５……パツド、６
……電子部品。
線パターン、４……リード線、５……パツド、６
……電子部品。
Claims (1)
- 電子回路基板において、前記電子回路基板に実
装されている半導体集積回路の表面に、回路パタ
ーンを形成することを特徴とする実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11317789U JPH0351868U (ja) | 1989-09-27 | 1989-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11317789U JPH0351868U (ja) | 1989-09-27 | 1989-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351868U true JPH0351868U (ja) | 1991-05-20 |
Family
ID=31661599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11317789U Pending JPH0351868U (ja) | 1989-09-27 | 1989-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351868U (ja) |
-
1989
- 1989-09-27 JP JP11317789U patent/JPH0351868U/ja active Pending