JPH0270459U - - Google Patents
Info
- Publication number
- JPH0270459U JPH0270459U JP1988150394U JP15039488U JPH0270459U JP H0270459 U JPH0270459 U JP H0270459U JP 1988150394 U JP1988150394 U JP 1988150394U JP 15039488 U JP15039488 U JP 15039488U JP H0270459 U JPH0270459 U JP H0270459U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- wiring board
- sides
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図Ａ乃至Ｈは本考案の一実施例を製造順に
示した縦断面図、第２図は従来例の縦断面図であ
る。 １……金属薄板、２……金属ケース（１をしぼ
り加工したもの）、３……基材、４……配線導体
、５……ミーリングキヤビテイ、６……プレス加
工孔、７，１１……半導体素子、８，１２……ボ
ンデイングワイヤ、９，１３……樹脂止め枠、１
０，１４……封止樹脂。
示した縦断面図、第２図は従来例の縦断面図であ
る。 １……金属薄板、２……金属ケース（１をしぼ
り加工したもの）、３……基材、４……配線導体
、５……ミーリングキヤビテイ、６……プレス加
工孔、７，１１……半導体素子、８，１２……ボ
ンデイングワイヤ、９，１３……樹脂止め枠、１
０，１４……封止樹脂。
Claims (1)
- プリント回路配線基板の両面に半導体素子を実
装する構造の半導体装置において、前記プリント
回路配線基板の半導体素子搭載位置に貫通孔を設
け、該貫通孔の中間位置に金属製の薄板を埋め込
み、その金属薄板の両面上に半導体素子をそれぞ
れ搭載したことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988150394U JPH0270459U (ja) | 1988-11-18 | 1988-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988150394U JPH0270459U (ja) | 1988-11-18 | 1988-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270459U true JPH0270459U (ja) | 1990-05-29 |
Family
ID=31423498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988150394U Pending JPH0270459U (ja) | 1988-11-18 | 1988-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270459U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284653A (ja) * | 1991-03-13 | 1992-10-09 | Kyocera Corp | 半導体素子収納用パッケージ |
-
1988
- 1988-11-18 JP JP1988150394U patent/JPH0270459U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284653A (ja) * | 1991-03-13 | 1992-10-09 | Kyocera Corp | 半導体素子収納用パッケージ |