JPH0235452U - - Google Patents
Info
- Publication number
- JPH0235452U JPH0235452U JP11397988U JP11397988U JPH0235452U JP H0235452 U JPH0235452 U JP H0235452U JP 11397988 U JP11397988 U JP 11397988U JP 11397988 U JP11397988 U JP 11397988U JP H0235452 U JPH0235452 U JP H0235452U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- semiconductor
- semiconductor element
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は、本考案による半導体装置の一実施例
を示す斜視図。第２図は、第１図に示す半導体装
置の側面図。第３図は、本考案による半導体装置
の他の実施例を示す斜視図。第４図は、第３図に
示す半導体装置の半導体素子との接続を示す側面
図。第５図は、第３図に示す半導体装置の半導体
素子との接続を示す正面図。第６図は、従来の半
導体装置の例を示す斜視図。
１……回路基板、１ａ……導体、２……半導体
素子、２ａ，２ｂ……半導体素子の端子、３……
放熱板、４，６，６ａ，６ｂ，７ａ……ねじ、５
ａ，５ｂ，９，１１……コネクタ、５ｃ……配線
、６ｂ，７ｂ……なつと、７……電子部品、８…
…ピン、８ａ，８ｂ，１２ａ，１２ｂ……リード
線、１０……スペーサ、１２……接続金具、１５
……穴部。
FIG. 1 is a perspective view showing an embodiment of a semiconductor device according to the present invention. FIG. 2 is a side view of the semiconductor device shown in FIG. 1. FIG. 3 is a perspective view showing another embodiment of the semiconductor device according to the present invention. FIG. 4 is a side view showing the connection of the semiconductor device shown in FIG. 3 to a semiconductor element. FIG. 5 is a front view showing the connection of the semiconductor device shown in FIG. 3 to a semiconductor element. FIG. 6 is a perspective view showing an example of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Circuit board, 1a... Conductor, 2... Semiconductor element, 2a, 2b... Terminal of semiconductor element, 3...
Heat sink, 4, 6, 6a, 6b, 7a...Screw, 5
a, 5b, 9, 11...Connector, 5c...Wiring, 6b, 7b...Natsuto, 7...Electronic component, 8...
... Pin, 8a, 8b, 12a, 12b ... Lead wire, 10 ... Spacer, 12 ... Connection fitting, 15
...Anabe.
Claims (1)
基板を半導体素子端子に、直接ねじ止め又は半田
付けにより接続することを特徴とする半導体装置
。 ２ パワー用半導体素子の周辺回路を実装した回
路基板に半導体素子の端子を貫通する穴を設け、
半導体素子を取り付けた放熱板に支柱により取り
付け、回路基板の穴を貫通した半導体素子の端子
と回路基板導体間は金具を介し接続したことを特
徴とする半導体装置。[Claims for Utility Model Registration] 1. A semiconductor device characterized in that a circuit board on which a peripheral circuit of a power conductor element is mounted is directly connected to a semiconductor element terminal by screwing or soldering. 2. A hole is provided through the terminal of the semiconductor element in the circuit board on which the peripheral circuit of the power semiconductor element is mounted,
1. A semiconductor device, characterized in that the semiconductor device is attached to a heat sink to which a semiconductor device is attached by a support, and the terminals of the semiconductor device passing through holes in the circuit board and the circuit board conductor are connected via metal fittings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11397988U JPH0235452U (en) | 1988-08-29 | 1988-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11397988U JPH0235452U (en) | 1988-08-29 | 1988-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235452U true JPH0235452U (en) | 1990-03-07 |
Family
ID=31354309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11397988U Pending JPH0235452U (en) | 1988-08-29 | 1988-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235452U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1080647C (en) * | 1995-10-30 | 2002-03-13 | 新日本制铁株式会社 | Color electrostatic recording apparatus |
-
1988
- 1988-08-29 JP JP11397988U patent/JPH0235452U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1080647C (en) * | 1995-10-30 | 2002-03-13 | 新日本制铁株式会社 | Color electrostatic recording apparatus |