JPH0238736U - - Google Patents

Info

Publication number
JPH0238736U
JPH0238736U JP1988116284U JP11628488U JPH0238736U JP H0238736 U JPH0238736 U JP H0238736U JP 1988116284 U JP1988116284 U JP 1988116284U JP 11628488 U JP11628488 U JP 11628488U JP H0238736 U JPH0238736 U JP H0238736U
Authority
JP
Japan
Prior art keywords
substrate
loop
power supply
wire
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988116284U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0638426Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988116284U priority Critical patent/JPH0638426Y2/ja
Publication of JPH0238736U publication Critical patent/JPH0238736U/ja
Application granted granted Critical
Publication of JPH0638426Y2 publication Critical patent/JPH0638426Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988116284U 1988-09-02 1988-09-02 多電源素子用パッケージ Expired - Lifetime JPH0638426Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988116284U JPH0638426Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988116284U JPH0638426Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Publications (2)

Publication Number Publication Date
JPH0238736U true JPH0238736U (2) 1990-03-15
JPH0638426Y2 JPH0638426Y2 (ja) 1994-10-05

Family

ID=31358681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988116284U Expired - Lifetime JPH0638426Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Country Status (1)

Country Link
JP (1) JPH0638426Y2 (2)

Also Published As

Publication number Publication date
JPH0638426Y2 (ja) 1994-10-05

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