JPH0241456U - - Google Patents
Info
- Publication number
- JPH0241456U JPH0241456U JP11798688U JP11798688U JPH0241456U JP H0241456 U JPH0241456 U JP H0241456U JP 11798688 U JP11798688 U JP 11798688U JP 11798688 U JP11798688 U JP 11798688U JP H0241456 U JPH0241456 U JP H0241456U
- Authority
- JP
- Japan
- Prior art keywords
- guard band
- transistor
- electrode pad
- semiconductor device
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
第1図aおよび第1図bは、本考案実施例の半
導体装置を示す図、第2図aおよび第2図bは従
来例の半導体装置を示す図である。
1…n型シリコン基板、T1…pチヤネルトラ
ンジスタ、2…pウエル、T2…nチヤネルトラ
ンジスタ、3…アルミニウム配線層、4a,14
a…ソース領域、4b,14b…ドレイン領域、
5,15…ゲート絶縁膜、6,16…ゲート電極
、7,17…ガードバンド、9…電極パツド、1
0…第2の配線層、11…層間絶縁膜、20…第
3の配線層、31…ポリシリコン層、32…表面
酸化膜。
1A and 1B are views showing a semiconductor device according to an embodiment of the present invention, and FIGS. 2A and 2B are views showing a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1...n-type silicon substrate, T1...p channel transistor, 2...p well, T2...n channel transistor, 3...aluminum wiring layer, 4a, 14
a... Source region, 4b, 14b... Drain region,
5, 15... Gate insulating film, 6, 16... Gate electrode, 7, 17... Guard band, 9... Electrode pad, 1
0... Second wiring layer, 11... Interlayer insulating film, 20... Third wiring layer, 31... Polysilicon layer, 32... Surface oxide film.
Claims (1)
のトランジスタの周囲を囲むように、このトラン
ジスタのチヤネルとは逆導電型の拡散層からなる
ガードバンドを形成すると共にこのガードバンド
の外側に該トランジスタの外部接続用電極パツド
を形成してなる半導体装置において、 該電極パツドに接続された配線層と該ガードバ
ンドとの交差部にポリシリコン層を界在せしめた
ことを特徴とする半導体装置。[Claims for Utility Model Registration] It includes a silicon gate MOS transistor, and a guard band consisting of a diffusion layer having a conductivity type opposite to that of the channel of the transistor is formed so as to surround the transistor, and a guard band is formed outside the guard band. A semiconductor device formed with an electrode pad for external connection of the transistor, characterized in that a polysilicon layer is interposed at the intersection of the wiring layer connected to the electrode pad and the guard band. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11798688U JPH0241456U (en) | 1988-09-09 | 1988-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11798688U JPH0241456U (en) | 1988-09-09 | 1988-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241456U true JPH0241456U (en) | 1990-03-22 |
Family
ID=31361941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11798688U Pending JPH0241456U (en) | 1988-09-09 | 1988-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241456U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08162539A (en) * | 1994-06-15 | 1996-06-21 | Hyundai Electron Ind Co Ltd | Data output buffer |
| WO2009075149A1 (en) * | 2007-12-10 | 2009-06-18 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6273760A (en) * | 1985-09-27 | 1987-04-04 | Toshiba Corp | Semiconductor device |
| JPS63192249A (en) * | 1987-02-05 | 1988-08-09 | Nec Ic Microcomput Syst Ltd | Semiconductor integrated circuit device |
-
1988
- 1988-09-09 JP JP11798688U patent/JPH0241456U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6273760A (en) * | 1985-09-27 | 1987-04-04 | Toshiba Corp | Semiconductor device |
| JPS63192249A (en) * | 1987-02-05 | 1988-08-09 | Nec Ic Microcomput Syst Ltd | Semiconductor integrated circuit device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08162539A (en) * | 1994-06-15 | 1996-06-21 | Hyundai Electron Ind Co Ltd | Data output buffer |
| WO2009075149A1 (en) * | 2007-12-10 | 2009-06-18 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
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