JPH0241473U - - Google Patents
Info
- Publication number
- JPH0241473U JPH0241473U JP11861088U JP11861088U JPH0241473U JP H0241473 U JPH0241473 U JP H0241473U JP 11861088 U JP11861088 U JP 11861088U JP 11861088 U JP11861088 U JP 11861088U JP H0241473 U JPH0241473 U JP H0241473U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- main body
- board main
- discarded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例のプリント基板の平
面図、第２図は第１図のプリント基板の構成を示
す図、第３図は第１図のプリント基板のパターン
形成に使用するマスクを示す図、第４図は部品の
自動実装を説明する図、第５図は従来の１例のプ
リント基板の平面図、第６図は第５図のプリント
基板の構成を示す図、第７図はプリント基板のパ
ターン形成に使用するマスクを示す図、第８図は
エツチングの際のテープ貼着状態を示す図である
。
図において、５，６は自動部品実装装置、７，
８はＣＣＤカメラ（プリント基板位置決め用光学
的認識手段）、９〜１３は電子部品、２１は上面
板、２１ａはベース、２２は中間板、２３は下面
板、２８，２９はプリント基板本体予定部分、３
０，３１は配線パターン、３３は撮影範囲、４０
はプリント基板、４１は認識マーク、４２は捨て
板部分、４５はマスク、４６は周囲部分、４７は
小さい矩形部分、５０は溝、を示す。
Figure 1 is a plan view of a printed circuit board according to an embodiment of the present invention, Figure 2 is a diagram showing the configuration of the printed circuit board of Figure 1, and Figure 3 is a mask used for patterning the printed circuit board of Figure 1. FIG. 4 is a diagram for explaining automatic mounting of components, FIG. 5 is a plan view of an example of a conventional printed circuit board, FIG. 6 is a diagram showing the configuration of the printed circuit board in FIG. 5, and FIG. The figure shows a mask used to form a pattern on a printed circuit board, and FIG. 8 shows a state in which a tape is attached during etching. In the figure, 5 and 6 are automatic component mounting equipment, 7,
8 is a CCD camera (optical recognition means for positioning the printed circuit board), 9 to 13 are electronic components, 21 is the upper plate, 21a is the base, 22 is the intermediate plate, 23 is the lower plate, 28 and 29 are the planned parts of the printed circuit board body. ,3
0, 31 is the wiring pattern, 33 is the shooting range, 40
41 is a printed circuit board, 41 is a recognition mark, 42 is a waste board portion, 45 is a mask, 46 is a surrounding portion, 47 is a small rectangular portion, and 50 is a groove.
Claims (1)
あり、部品が実装された後に分割されてプリント
基板本体を構成するプリント基板本体予定部分２
８，２９を中央部分に有し、周囲部分に上記プリ
ント基板本体予定部分を分割して取り出した後に
廃棄される捨て板部分３２を有するものであつて
、上記プリント基板本体予定部分を分割する前の
状態で自動部品実装装置に供給されて上記プリン
ト基板本体予定部分に部品を実装されるプリント
基板において、 上記捨て板部分３２のうち、上記自動部品実装
装置５，６のプリント基板位置決め用光学的認識
手段７，８の撮影範囲３３内に、該手段により認
識されうる認識マーク４１を設けてなる構成のプ
リント基板。[Claims for Utility Model Registration] Printed circuit board main body planned portion 2, which has a multilayer structure with standard external dimensions (L x W) and is divided after components are mounted to form the printed circuit board main body.
8 and 29 in the center, and a discarded board part 32 on the periphery that is discarded after dividing and taking out the intended part of the printed circuit board main body, and before dividing the intended part of the printed circuit board main body. In the printed circuit board that is supplied to the automatic component mounting apparatus in the state shown in FIG. A printed circuit board having a configuration in which a recognition mark 41 that can be recognized by the recognition means 7 and 8 is provided within the photographing range 33 of the recognition means 7 and 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11861088U JPH0241473U (en) | 1988-09-09 | 1988-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11861088U JPH0241473U (en) | 1988-09-09 | 1988-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241473U true JPH0241473U (en) | 1990-03-22 |
Family
ID=31363105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11861088U Pending JPH0241473U (en) | 1988-09-09 | 1988-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241473U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005107343A1 (en) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and method for mounting component on the printed wiring board |
-
1988
- 1988-09-09 JP JP11861088U patent/JPH0241473U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005107343A1 (en) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and method for mounting component on the printed wiring board |
| JP2005317753A (en) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Ind Co Ltd | Printed wiring board and method of attaching components to the printed wiring board |
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