JPH0241861A - Oscillating grinding device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] A. Industrial application field The present invention applies to grinding tools such as diamond grindstones.

The present invention relates to an oscillating grinding device that performs groove processing by oscillating the workpiece in its width direction relative to the workpiece.

B. Conventional technology In conventional groove machining using a diamond grindstone, as shown in FIG. 7, a diamond grindstone 50 is rotated at high speed around an axis It is being processed.

In this conventional groove machining, the position of the diamond whetstone 50 in the width direction is constant when machining one groove, but when machining a large number of grooves, both sides of the diamond whetstone 50 wear out, resulting in a width of 1li5L. becomes narrower and falls out of tolerance. As a countermeasure against this problem, there is a method in which (D) the diamond grindstone 50 is replaced after several grooves have been machined. As shown in A1, shift the diamond grindstone 50 to the right side and perform groove machining (hatching R1) again.
Furthermore, there is also a method in which the diamond grinding wheel 50 is shifted to the left as indicated by arrow A2 to perform groove machining (hatching R2), thereby machining the groove to a width within tolerance using the diamond grinding wheel 50 that is worn in the width direction.

C1 Problems to be Solved by the Invention However, in the method (2), it takes time to replace the diamond grindstone 50, resulting in poor work efficiency.

Furthermore, there is a possibility that the pitch between the grooves may shift due to the accuracy with which the grindstone is mounted when replacing the grindstone. In addition, (the false method requires grooving two or three times for each groove, which is inefficient. Furthermore, the accuracy of the pitch between grooves is also poor.

An object of the present invention is to provide an oscillating grinding device that can efficiently process groove pitches with high accuracy without replacing the diamond grindstone.

00 Means for Solving the Problems The oscillating grinding device according to the present invention grinds a disc-shaped grinding tool, a motor that rotationally drives the grinding tool, a table on which a work is placed, and the grinding tool and the table. The above-mentioned problem is solved by providing a swinging means for relatively swinging the tool by a predetermined amount in the width direction of the tool. A means for adjusting the amount of shaking may be provided.

E0 action: For example, a workpiece is processed with a grinding tool while swinging the grinding tool by a predetermined amount in the width direction of the table with respect to the table. Therefore, when machining a large number of grooves of the same width, if the grinding tool is oscillated by an amount corresponding to the amount of wear, a large number of grooves with a desired tolerance can be machined without changing the tool. As a result, work efficiency improves.

By swinging evenly on both sides with respect to the center of machining, the accuracy of the machining pitch of grooves, etc. will be improved. Furthermore, if the amount of oscillation III can be adjusted so that the amount of oscillation corresponds to the amount of tool wear, the number of machining operations that can be performed with one tool will be dramatically increased.

F6 example An embodiment will be described based on FIGS. 1 to 6.

FIG. 1(a) is a front view of the oscillating grinding device, and FIG. 1(b) is a side view thereof. A Y-direction feed table 2 is installed on a frame 1, and an X-direction feed table 3 is further installed on the Y-direction feed table 2. The Y- and X-direction tables 2 and 3 are driven in the Y- and X-directions by driving well-known feeding mechanisms using a Y-direction pulse motor 4Y and an X-direction pulse motor 4X, respectively. On the other hand, Fram 1
An arm 6 that moves up and down in the Z direction by a Z direction pulse motor 4Z is provided on the pillar 5 erected.

A spindle motor 7 is provided at the tip of this arm 6, and a disc-shaped diamond grindstone 8 is attached to an output shaft 7a of this spindle motor 7. The workpiece WK is placed and fixed on the X-direction table 3-, and while the X-direction table 3 is oscillated in the X-direction, the Y-direction table 2 is sent in the Y-direction to machine a groove of a predetermined width and length. .

FIG. 2 is a control block diagram of the oscillating grinding device shown in FIG. 1. The microprocessor 21 receives X, Y signals via an input/output interface 22.

Motor drive circuits 23X, 23Y, 23Z for the Z-direction pulse motors 4X, 4Y, 4Z, a relay 24 for the spindle motor 7, and a counter 25 for counting the number of grooves machined.
are connected to each other.

In this embodiment, as shown in FIGS. 3(a) and 3(b), the surface of a rectangular workpiece WK made of ceramics is coated with a groove pitch of 1 (n+n+), a depth of 0.5 (mm), and a width of 0.5 mm.
The explanation will be given assuming that 1000 grooves 51 of 20±0.02 (mm) are to be machined.

Prior to starting groove machining, the diamond grinding wheel 8 was ground for 1000 millimeters without replacing it by the conventional machining method explained in Fig. 7.
The grooves of the book were preliminarily machined, and the relationship between the groove width and the number of grooves machined as shown in Fig. 4 was measured.

It is understood that when the number of grooves machined is 400 and 700, the wear amount of the diamond grindstone 8 is 0.02 mm and 0.05 mm, respectively.

Now, assuming that the width of the diamond whetstone 8 is equal to the width of the whetstone 8 during preliminary machining, the grooves will be processed without rocking the diamond whetstone 8 until the 400th groove, as in the past, and the grooves 401 to 700 will be
Up to the main point, as shown in Fig. 3(b), the diamond whetstone 8 is divided into left and right sides with respect to its center CL by 0.02 mm.
0.20 mm (0.01 mm to the left, 0.01 mm to the right), and from the 701st to the 1000th line, 0.05 mm of left and right shots are processed separately.
1000 grooves of ±0.02 (mm) can be machined without replacing the grindstone. Therefore, the following machining procedure is programmed into the microprocessor 21 to perform the machining. Note that the width of the diamond grindstone 8 is generally made within ±0.005 mm.

By programming with preliminary machining data, it is possible to machine grooves with widths within dimensional tolerances.

FIG. 5 is a flowchart showing an example of the processing procedure for groove machining.

In step S1, only the Y-direction table 2 is fed at a predetermined feed rate without swinging the diamond grindstone 8 to perform groove machining. In step S2, it is determined whether or not one groove machining has been completed, and if it is affirmative, the count value C of the counter 25 is incremented by +1 in step S3, and in step S4, the count value C of the counter 25 is incremented in the X direction by the table 3
is sent by one pitch. In the next step S5,
It is determined whether the count value C of the counter 25 has reached 400 or not, and the following steps 81 to S4 are repeatedly executed until the determination is affirmative. If step S5 is affirmed, 401
The process advances to step S6 to start the actual 0-groove machining.

In step S6, the Y-direction table 2 is rotated while the X-direction table 3 is oscillated by 0.02 mm based on the preliminary machining data.
Send the machine to perform groove machining. Steps S7 to S9 are similar to steps 82 to S4 described above, and in step S1o it is determined whether the count value C of the counter 25 has reached 700, and one or more steps 86 to S9 are repeated until the answer is affirmative. Execute. If step S10 is affirmed, 701
Proceed to step Sll to start the actual 0 groove machining.

In step Sll, groove machining is performed by moving the Y-direction table 2 while swinging the X-direction table 3 by 0.05 mm based on the preliminary machining data. And step 8 above
Steps 812 to S14 are executed in the same manner as steps 2 to S4, and in step S15, the count value C of the counter 25 is 100.
Determine whether it has reached 0 or not. Repeat steps 811 to S14 until the answer is affirmed, and step S1
If 5 is affirmed, this procedure ends.

According to such a processing procedure, as shown in FIG.
Until the 400th run, there is no rocking in the X direction, and the motion is 0.20±0.0 as shown in graph A. A groove satisfying O2n1m is machined. In addition, from the 401st to the 700th diamond grinding wheel 8, the wear amount in the width direction of the diamond grinding wheel 8 is 0.02 m, which corresponds to the wear amount in the width direction.
Grooving is performed while swinging the workpiece WK by m in the X direction, and a groove satisfying 0.20+0.02 mm as shown in graph B is machined. Furthermore, 701-1. Until OOO main entrance.

0, 0 corresponding to the amount of wear in the width direction of the diamond grinding wheel 8
Grooving is performed while swinging the workpiece WK by 5 mm, and a groove satisfying 0.20±0.02 mm as shown in graph C is machined.

Therefore, without replacing the diamond grinding wheel 8,
1000 grooves of 0±0.02 (mm) can be machined, improving work efficiency, and since only one diamond grindstone is required, processing costs can be reduced. Furthermore, since there is no need to replace the grindstone, the accuracy of the pitch between grooves is also improved.

Note that the diamond grinding wheel 8 side may be oscillated, and instead of being oscillated by a pulse motor, it may be oscillated by another method such as an electrostrictive element. Furthermore, although the above description has been made using a dedicated oscillating grinding device, the X-direction oscillating device may be attached to a general-purpose grinding device.

Furthermore, the amount of oscillation during groove machining was changed to two stages using the grinding wheel wear amount of 400 and 700 grooves, but for example, 50
, 100, 150-900, 950 The number of stages for switching the oscillation amount may be subdivided, such as switching the oscillation amount using the wear amount of the 0th grindstone, or may be increased for each grindstone. In this case, the tolerances can be made even tighter. The number of pieces to be machined is not limited to 1000, and a disc-shaped grinding tool other than a diamond grindstone may be used, and the object to be machined is not limited to the groove shown in FIG. 3. Furthermore, in the groove machining described above, the wear amount of the diamond grinding wheel 8 is predicted through preliminary machining, and the rocking start timing and the rocking layer are controlled based on the predicted value. The width may be constantly detected by a sensor and the detected value may be fed back to the swing amount. In this case, it is preferable to determine the feedback value in consideration of the processing dimensions and their tolerances.

Further, although a case has been described in which a groove approximately equal to the width of the grindstone 8 is processed, the present invention can also be applied to the processing of a groove or a recess that is wider than the width of the grindstone, and in some cases, the groove may be oscillated from the beginning of processing. That is, it may be oscillated for all machining.

G0 Effects of the Invention Since the present invention is constructed as described above, the work efficiency can be improved, processing costs can be reduced, and accuracy can also be improved.

[Brief explanation of the drawing]

Figures 1 to 6 are for explaining one embodiment, and Figure 1 shows the overall configuration of the oscillating grinding device, with (a) being a front view and (b)
) is a side view, Fig. 2 is its control circuit diagram, Fig. 3(a) is a front view of the workpiece, Fig. 3(b) is an enlarged sectional view of the groove, and Fig. 4 shows the number of grooves machined in preliminary machining. Graph showing the groove width, Figure 5 is flowchart 1-1 6 showing the swing machining procedure
The figure shows the number of ifl processed in this process and ii'11! It is a graph showing width. 7 and 8 respectively explain the conventional example, and FIG. 7 is a diagram showing the relationship between the groove and the diamond grinding wheel, and FIG.
The figure is a diagram illustrating forming a groove with a predetermined tolerance by performing groove processing multiple times. 2: Y-direction table 3: X-direction table 4X: X-direction pulse motor 4Y: Y-direction pulse motor 4Z: Z-direction pulse motor 7: Spindle motor 8: Diamond grinding wheel 21: Microprocessor 25: Counter 51: Groove Patent Applicant Stock Shimadzu Corporation Patent Attorney Fuyuki Nagai Figure 1 (a) Figure 2 Figure 1 (b) Y direction tabletop Figure 3 Figure 5 Figure 4 Figure 6 Number of grooves machined

Claims (1)

[Claims] 1) A disc-shaped grinding tool, a motor that rotationally drives the grinding tool, a table on which a work is placed, and the grinding tool and the table are relative to each other by a predetermined amount in the width direction of the grinding tool. An oscillating grinding device characterized by comprising a oscillating means for oscillating the device. 2) The oscillating grinding device according to claim 1, wherein the oscillating means has means for adjusting the amount of oscillation thereof.