JPH024242U - - Google Patents
Info
- Publication number
- JPH024242U JPH024242U JP8322988U JP8322988U JPH024242U JP H024242 U JPH024242 U JP H024242U JP 8322988 U JP8322988 U JP 8322988U JP 8322988 U JP8322988 U JP 8322988U JP H024242 U JPH024242 U JP H024242U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- mold
- pid control
- semiconductor element
- heaters
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000009529 body temperature measurement Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Control Of Temperature (AREA)
Description
第１図はこの考案の一実施例による半導体素子
用樹脂封止装置の金型温度制御部の構成を示すブ
ロツク図、第２図はゲイン＝１、オフセツト＝０
での目標温度と金型表面温度との関係を示す図、
第３図は従来の半導体素子用樹脂封止装置の金型
温度制御部の構成を示すブロツク図である。
１……金型、２，２ａ，２ｂ……温度センサ、
３，３ａ，３ｂ……ヒータ、４……アンプ、５…
…Ａ／Ｄ変換回路、７……偏差検出器、８……Ｐ
ＩＤ制御部、９……通電率変換手段、１０……出
力トランジスタ部、１１……ヒータコントローラ
、１２……ヒータドライブ回路、１３……目標温
度補正回路。
Fig. 1 is a block diagram showing the configuration of a mold temperature control section of a resin sealing device for semiconductor devices according to an embodiment of this invention, and Fig. 2 shows a configuration in which gain = 1 and offset = 0.
A diagram showing the relationship between target temperature and mold surface temperature,
FIG. 3 is a block diagram showing the structure of a mold temperature control section of a conventional resin sealing apparatus for semiconductor elements. 1... Mold, 2, 2a, 2b... Temperature sensor,
3, 3a, 3b...heater, 4...amplifier, 5...
...A/D conversion circuit, 7...Deviation detector, 8...P
ID control unit, 9... Energization rate conversion means, 10... Output transistor unit, 11... Heater controller, 12... Heater drive circuit, 13... Target temperature correction circuit.
Claims (1)
脂封止する上、下金型と、各金型内の各個所に分
散して設けられたヒータと、上記ヒータと対で設
けられた温度センサと、上記温度センサの温度と
金型表面温度との温度差の補正を行なう目標温度
補正手段と、上記金型温度測定結果と補正された
目標金型温度との偏差によりＰＩＤ制御を行なう
ＰＩＤ制御部と、ＰＩＤ制御出力を所定期間にお
ける通電率に変換する通電率変換手段とを備えた
ことを特徴とする半導体素子用樹脂封止装置。 Upper and lower molds for resin-sealing a semiconductor element formed on a lead frame, heaters distributed at various locations within each mold, and a temperature sensor provided in pairs with the heaters; a target temperature correction means for correcting the temperature difference between the temperature of the temperature sensor and the mold surface temperature; and a PID control section for performing PID control based on the deviation between the mold temperature measurement result and the corrected target mold temperature. 1. A resin sealing apparatus for a semiconductor element, comprising: energization rate converting means for converting a PID control output into an energization rate for a predetermined period.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8322988U JPH0644099Y2 (en) | 1988-06-22 | 1988-06-22 | Resin sealing device for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8322988U JPH0644099Y2 (en) | 1988-06-22 | 1988-06-22 | Resin sealing device for semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH024242U true JPH024242U (en) | 1990-01-11 |
| JPH0644099Y2 JPH0644099Y2 (en) | 1994-11-14 |
Family
ID=31307955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8322988U Expired - Lifetime JPH0644099Y2 (en) | 1988-06-22 | 1988-06-22 | Resin sealing device for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644099Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482405U (en) * | 1990-11-28 | 1992-07-17 |
-
1988
- 1988-06-22 JP JP8322988U patent/JPH0644099Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482405U (en) * | 1990-11-28 | 1992-07-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644099Y2 (en) | 1994-11-14 |