JPH0242496U - - Google Patents
Info
- Publication number
- JPH0242496U JPH0242496U JP1988121338U JP12133888U JPH0242496U JP H0242496 U JPH0242496 U JP H0242496U JP 1988121338 U JP1988121338 U JP 1988121338U JP 12133888 U JP12133888 U JP 12133888U JP H0242496 U JPH0242496 U JP H0242496U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- chassis
- printed wiring
- heat conduction
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例を示し、同図ａはそ
の一部破断正面図、同図ｂはその断面図、第２図
はプリント配線基板の拡大断面図、第３図は熱伝
導板の拡大斜視図、第４図は３層に構成したプリ
ント配線基板を示す拡大断面図、第５図は従来の
放熱構造を示し、同図ａはその一部破断正面図、
同図ｂはその断面図である。
１……取付面、２……シヤーシ、３……プリン
ト配線基板、４……貫通ボルト、５……カラー、
６……電子部品、６Ａ……放熱を必要とする電子
部品、７……カバー、８……放熱ブロツク、９…
…固定ねじ、１０……絶縁基板、１１……信号用
パターン、１２……熱伝導用パターン、１３……
熱伝導板、１４……固定ねじ、１５……ストレス
リリーフ、１６，１７……穴。
Figure 1 shows an embodiment of the present invention, Figure a is a partially cutaway front view, Figure b is a sectional view, Figure 2 is an enlarged sectional view of a printed wiring board, and Figure 3 is a thermal conduction FIG. 4 is an enlarged sectional view showing a three-layer printed wiring board, FIG. 5 shows a conventional heat dissipation structure, and FIG.
Figure b is a sectional view thereof. 1... Mounting surface, 2... Chassis, 3... Printed wiring board, 4... Penetration bolt, 5... Color,
6...Electronic component, 6A...Electronic component that requires heat radiation, 7...Cover, 8...Heat radiation block, 9...
... Fixing screw, 10 ... Insulating board, 11 ... Signal pattern, 12 ... Heat conduction pattern, 13 ...
Heat conduction plate, 14... Fixing screw, 15... Stress relief, 16, 17... Hole.
Claims (1)
くとも放熱が必要とされる電子部品を搭載するプ
リント配線基板と、このプリント基板の少なくと
も一箇所を前記シヤーシに接続させる熱伝導板と
を備え、前記プリント配線基板は多層に構成する
と共に、その層間にはプリント基板のシヤーシ接
続箇所にまで延長される熱伝導用パターンを形成
し、前記熱伝導板は一部で前記プリント配線基板
の熱伝導用パターンに熱的に接続し、他部で前記
シヤーシに熱的に接続され、かつこれらの部位間
にストレスリリーフを設けたことを特徴とするプ
リント配線基板の放熱構造。 The printed wiring board is internally supported by a chassis provided in a device, etc., and has at least electronic components that require heat dissipation mounted thereon, and a heat conductive plate that connects at least one part of the printed circuit board to the chassis. The wiring board is composed of multiple layers, and between the layers, a heat conduction pattern is formed that extends to the chassis connection point of the printed circuit board, and a part of the heat conduction plate is connected to the heat conduction pattern of the printed wiring board. 1. A heat dissipation structure for a printed wiring board, characterized in that one part is thermally connected to the chassis at another part, and a stress relief is provided between these parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121338U JPH0242496U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121338U JPH0242496U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242496U true JPH0242496U (en) | 1990-03-23 |
Family
ID=31368255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121338U Pending JPH0242496U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242496U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS3924162Y1 (en) * | 1961-10-12 | 1964-08-19 | ||
| JPS6331575B2 (en) * | 1979-09-27 | 1988-06-24 | Bentorei Uiibingu Mashiinarii Ltd |
-
1988
- 1988-09-16 JP JP1988121338U patent/JPH0242496U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS3924162Y1 (en) * | 1961-10-12 | 1964-08-19 | ||
| JPS6331575B2 (en) * | 1979-09-27 | 1988-06-24 | Bentorei Uiibingu Mashiinarii Ltd |