JPH024253U - - Google Patents

Info

Publication number
JPH024253U
JPH024253U JP8213288U JP8213288U JPH024253U JP H024253 U JPH024253 U JP H024253U JP 8213288 U JP8213288 U JP 8213288U JP 8213288 U JP8213288 U JP 8213288U JP H024253 U JPH024253 U JP H024253U
Authority
JP
Japan
Prior art keywords
heat sink
electrode
semiconductor element
support device
locking protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8213288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8213288U priority Critical patent/JPH024253U/ja
Publication of JPH024253U publication Critical patent/JPH024253U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の半導体素子支持装置の1実施
例の要部の正面図、第2図は第1図の半導体素子
の側面図、第3図は全体の装置の正面図である。 1……固定側ヒートシンク、2……半導体素子
、3,5……半導体素子の電極、4……可動側ヒ
ートシンク、12……締付ボルト、14……係止
突起、15,16……外周フイン、17……係止
孔。
FIG. 1 is a front view of essential parts of one embodiment of the semiconductor device support device of the present invention, FIG. 2 is a side view of the semiconductor device shown in FIG. 1, and FIG. 3 is a front view of the entire device. DESCRIPTION OF SYMBOLS 1... Fixed side heat sink, 2... Semiconductor element, 3, 5... Electrode of semiconductor element, 4... Movable side heat sink, 12... Tightening bolt, 14... Locking protrusion, 15, 16... Outer periphery Fin, 17...Latching hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固定側ヒートシンクに平形半導体素子の一方の
電極を当てがい、前記素子の他方の電極に可動側
ヒートシンクを当てがい、前記可動側ヒートシン
クを押圧して前記素子を前記ヒートシンク間に支
持した半導体素子支持装置において、前記固定側
ヒートシンクに係止突起を形成し、前記素子の前
記一方の電極の外周フインに前記係止突起に係止
する係止孔を形成した半導体素子支持装置。
A semiconductor element support device in which one electrode of a flat semiconductor element is applied to a fixed heat sink, a movable heat sink is applied to the other electrode of the element, and the element is supported between the heat sinks by pressing the movable heat sink. In the semiconductor element support device, a locking protrusion is formed on the fixed side heat sink, and a locking hole that locks on the locking protrusion is formed on the outer peripheral fin of the one electrode of the element.
JP8213288U 1988-06-21 1988-06-21 Pending JPH024253U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8213288U JPH024253U (en) 1988-06-21 1988-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8213288U JPH024253U (en) 1988-06-21 1988-06-21

Publications (1)

Publication Number Publication Date
JPH024253U true JPH024253U (en) 1990-01-11

Family

ID=31306898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8213288U Pending JPH024253U (en) 1988-06-21 1988-06-21

Country Status (1)

Country Link
JP (1) JPH024253U (en)

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