JPH024263U - - Google Patents
Info
- Publication number
- JPH024263U JPH024263U JP1988081807U JP8180788U JPH024263U JP H024263 U JPH024263 U JP H024263U JP 1988081807 U JP1988081807 U JP 1988081807U JP 8180788 U JP8180788 U JP 8180788U JP H024263 U JPH024263 U JP H024263U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit elements
- leads
- lead frame
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームの上面図、第
２図は本考案のリードフレームを用い、組立ての
行つた場合の透視図、第３図は実施例２の上面図
である。
１……アイランド１、２……アイランド２、３
……インナーリード、４……アウターリード、５
……タツプ専用リード、６……タイバー、７……
封入樹脂、８……集積回路素子１、９……集積回
路素子２、１０……金属細線。
FIG. 1 is a top view of the lead frame of the present invention, FIG. 2 is a perspective view of the lead frame of the present invention after assembly, and FIG. 3 is a top view of Embodiment 2. 1...Island 1, 2...Island 2, 3
...Inner lead, 4...Outer lead, 5
...Tap dedicated lead, 6...Tie bar, 7...
Encapsulating resin, 8... integrated circuit elements 1, 9... integrated circuit elements 2, 10... thin metal wires.
Claims (1)
搭載部を有し、さらに集積回路素子間のボンデイ
ングを行う為のリードを個別に有し、このリード
はタイバーに接続されるも外部に導出されていな
いことを特徴とするリードフレーム。 It has multiple mounting parts for mounting multiple integrated circuit elements, and also has individual leads for bonding between integrated circuit elements, and these leads are connected to tie bars but are not led out to the outside. A lead frame that is not characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988081807U JPH024263U (en) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988081807U JPH024263U (en) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024263U true JPH024263U (en) | 1990-01-11 |
Family
ID=31306577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988081807U Pending JPH024263U (en) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024263U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010598U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS5010597U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS52105910U (en) * | 1976-02-09 | 1977-08-12 | ||
| JPS55112585U (en) * | 1979-02-02 | 1980-08-07 | ||
| JPS5627407U (en) * | 1979-08-08 | 1981-03-14 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010967A (en) * | 1973-05-28 | 1975-02-04 | ||
| JPS5029163A (en) * | 1973-07-17 | 1975-03-25 |
-
1988
- 1988-06-20 JP JP1988081807U patent/JPH024263U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010967A (en) * | 1973-05-28 | 1975-02-04 | ||
| JPS5029163A (en) * | 1973-07-17 | 1975-03-25 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010598U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS5010597U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS52105910U (en) * | 1976-02-09 | 1977-08-12 | ||
| JPS55112585U (en) * | 1979-02-02 | 1980-08-07 | ||
| JPS5627407U (en) * | 1979-08-08 | 1981-03-14 |