JPH024263U - - Google Patents

Info

Publication number
JPH024263U
JPH024263U JP1988081807U JP8180788U JPH024263U JP H024263 U JPH024263 U JP H024263U JP 1988081807 U JP1988081807 U JP 1988081807U JP 8180788 U JP8180788 U JP 8180788U JP H024263 U JPH024263 U JP H024263U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit elements
leads
lead frame
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988081807U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988081807U priority Critical patent/JPH024263U/ja
Publication of JPH024263U publication Critical patent/JPH024263U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案のリードフレームの上面図、第
２図は本考案のリードフレームを用い、組立ての
行つた場合の透視図、第３図は実施例２の上面図
である。 １……アイランド１、２……アイランド２、３
……インナーリード、４……アウターリード、５
……タツプ専用リード、６……タイバー、７……
封入樹脂、８……集積回路素子１、９……集積回
路素子２、１０……金属細線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数個の集積回路素子を搭載するための複数の
    搭載部を有し、さらに集積回路素子間のボンデイ
    ングを行う為のリードを個別に有し、このリード
    はタイバーに接続されるも外部に導出されていな
    いことを特徴とするリードフレーム。
JP1988081807U 1988-06-20 1988-06-20 Pending JPH024263U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988081807U JPH024263U (ja) 1988-06-20 1988-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988081807U JPH024263U (ja) 1988-06-20 1988-06-20

Publications (1)

Publication Number Publication Date
JPH024263U true JPH024263U (ja) 1990-01-11

Family

ID=31306577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988081807U Pending JPH024263U (ja) 1988-06-20 1988-06-20

Country Status (1)

Country Link
JP (1) JPH024263U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010598U (ja) * 1973-05-23 1975-02-03
JPS5010597U (ja) * 1973-05-23 1975-02-03
JPS52105910U (ja) * 1976-02-09 1977-08-12
JPS55112585U (ja) * 1979-02-02 1980-08-07
JPS5627407U (ja) * 1979-08-08 1981-03-14

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010967A (ja) * 1973-05-28 1975-02-04
JPS5029163A (ja) * 1973-07-17 1975-03-25

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010967A (ja) * 1973-05-28 1975-02-04
JPS5029163A (ja) * 1973-07-17 1975-03-25

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010598U (ja) * 1973-05-23 1975-02-03
JPS5010597U (ja) * 1973-05-23 1975-02-03
JPS52105910U (ja) * 1976-02-09 1977-08-12
JPS55112585U (ja) * 1979-02-02 1980-08-07
JPS5627407U (ja) * 1979-08-08 1981-03-14

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