JPH0243025U - - Google Patents
Info
- Publication number
- JPH0243025U JPH0243025U JP12093588U JP12093588U JPH0243025U JP H0243025 U JPH0243025 U JP H0243025U JP 12093588 U JP12093588 U JP 12093588U JP 12093588 U JP12093588 U JP 12093588U JP H0243025 U JPH0243025 U JP H0243025U
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic delay
- sloped side
- pads
- hybrid
- piezoelectric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案による超音波遅延線装置の一実
施例を示す正面図、第２図は該実施例の遅延媒体
にリード線を接続した状態を示す斜視図、第３図
は該実施例のハイブリツドＩＣ上のパツドとリー
ド線の接続部を示す断面図、第４図は該実施例の
側面断面図、第５図は従来装置を示す正面図であ
る。
FIG. 1 is a front view showing an embodiment of an ultrasonic delay line device according to the present invention, FIG. 2 is a perspective view showing a state in which a lead wire is connected to the delay medium of the embodiment, and FIG. 3 is a perspective view of the embodiment. FIG. 4 is a side sectional view of this embodiment, and FIG. 5 is a front view of a conventional device.
Claims (1)
出力圧電素子を固着し、超音波遅延媒体と、その
周辺回路をまとめたハイブリツドＩＣとをパツケ
ージ内に並べて組み込んでなる超音波遅延線装置
において、前記ハイブリツドＩＣの基板に、前記
遅延媒体の傾斜辺に対応した傾斜辺を設け、該基
板表面に傾斜辺に沿つて複数個のパツドを整列さ
せて配設し、これらのパツドと前記入出力圧電素
子の電極とを、中間部を折り曲げた同一形状およ
びサイズの複数本のリード線により、各リード線
の両端部を半田付けして接続したことを特徴とす
る超音波遅延線装置。 An ultrasonic delay line device in which an input/output piezoelectric element is fixed to the inclined side of a plate-shaped ultrasonic delay medium, and the ultrasonic delay medium and a hybrid IC that includes its peripheral circuit are installed side by side in a package. In this step, a sloped side corresponding to the sloped side of the delay medium is provided on the substrate of the hybrid IC, a plurality of pads are arranged and arranged along the sloped side on the surface of the substrate, and these pads and the input pad are arranged in a line along the sloped side. 1. An ultrasonic delay line device characterized in that an electrode of an output piezoelectric element is connected to a plurality of lead wires having the same shape and size with the middle portion bent and both ends of each lead wire soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12093588U JPH0243025U (en) | 1988-09-15 | 1988-09-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12093588U JPH0243025U (en) | 1988-09-15 | 1988-09-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243025U true JPH0243025U (en) | 1990-03-26 |
Family
ID=31367491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12093588U Pending JPH0243025U (en) | 1988-09-15 | 1988-09-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243025U (en) |
-
1988
- 1988-09-15 JP JP12093588U patent/JPH0243025U/ja active Pending
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