JPH0243579Y2 - - Google Patents

Info

Publication number
JPH0243579Y2
JPH0243579Y2 JP1986026918U JP2691886U JPH0243579Y2 JP H0243579 Y2 JPH0243579 Y2 JP H0243579Y2 JP 1986026918 U JP1986026918 U JP 1986026918U JP 2691886 U JP2691886 U JP 2691886U JP H0243579 Y2 JPH0243579 Y2 JP H0243579Y2
Authority
JP
Japan
Prior art keywords
laser
mark sensor
copying
arm
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986026918U
Other languages
Japanese (ja)
Other versions
JPS62142483U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986026918U priority Critical patent/JPH0243579Y2/ja
Publication of JPS62142483U publication Critical patent/JPS62142483U/ja
Application granted granted Critical
Publication of JPH0243579Y2 publication Critical patent/JPH0243579Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 〈産業上の利用分野〉 本考案はレーザ加工機の改良に関するものであ
る。
[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to improvement of a laser processing machine.

〈従来の技術〉 従来レーザによつて加工材表面へ彫刻加工をす
るには、彫刻加工しようとするパターンに沿う細
溝をあけたマスクを設け、これを平面的に移動す
るテーブル上においた加工材にかぶせ、上からレ
ーザを照射する方法をとつていた。
<Conventional technology> Conventionally, in order to engrave the surface of a workpiece using a laser, a mask with narrow grooves along the pattern to be engraved is provided, and the mask is placed on a table that moves in a plane. The method used was to cover the material and irradiate the laser from above.

しかしこの方法では、少量生産の場合にはマス
クの製作費によつてコストアツプするという大き
な欠点がある。
However, this method has a major drawback in that the cost increases due to the cost of manufacturing the mask when producing in small quantities.

〈考案が解決しようとする問題点と、その手段〉 本考案は、上記の欠点を解消するために提案し
たレーザ加工機で、従来のマスクに代えてマーク
センサとホト倣い装置により加工材の動きを制御
して彫刻加工しようとするものである。
<Problems to be solved by the invention and their means> This invention is a laser processing machine proposed to eliminate the above-mentioned drawbacks.Instead of the conventional mask, the movement of the workpiece is controlled by a mark sensor and a photo copying device. This is an attempt to control and carve.

〈実施例〉 以下に本考案の実施例を図面に基いて説明す
る。第1図に示すようにベース1上X軸モータ2
によつて左右方向へ移動する移動台3を配し、該
移動台3上にY軸モータ4によつて前後方向に移
動するテーブル5を設ける。テーブル5の一側か
ら外方へ突出するアーム6を設け、このアーム6
にホト倣い装置7とマークセンサ8とを取付け
る。
<Examples> Examples of the present invention will be described below based on the drawings. As shown in Figure 1, the X-axis motor 2 on the base 1
A movable table 3 that moves in the left-right direction by a Y-axis motor 4 is provided on the movable table 3. An arm 6 protruding outward from one side of the table 5 is provided, and this arm 6
Attach the photo copying device 7 and mark sensor 8 to.

ホト倣い装置7は、第3図に示す原理図のよう
に倣いヘツド9から倣い図面10を照射する。倣
い図面10には左右方向への移動を繰り返しなが
ら直交する方向へ除々に移つて全図面上を走査
し、且つ終点から始点へもどる一筆書きの走査線
11を描く。そして、この走査線11からの反射
光を2つのフオトセル12,12で受光し、両方
の受光量が等しくないときは、両受光量が等しく
なるように倣いヘツド9を動かすべく、ステアリ
ング・サーボ・モータ13により軌道修正して、
ヘツド9を走査線11に沿つて移動させる。また
フオトセル12,12からは、ヘツド9の向きに
応じた信号がシンクロ・リゾルバー14に送ら
れ、シンクロ・リゾルバー14はその信号の方向
ベクトル15をX軸ベクトル16とY軸ベクトル
17とに分解して(第4図参照)、両ベクトルに
応じたX軸信号とY軸信号とを発する。X軸信号
はベース1のX軸モータ2を、Y軸信号は移動台
3のY軸モータ4を制御して、テーブル5を走査
線11に沿つて動かす。
The photocopying device 7 irradiates a copying drawing 10 from a copying head 9 as shown in the principle diagram shown in FIG. On the copying drawing 10, a scanning line 11 is drawn in one stroke, repeatedly moving in the left and right directions, gradually moving in the orthogonal direction, scanning the entire drawing, and returning from the end point to the starting point. Then, the reflected light from this scanning line 11 is received by two photocells 12, 12, and if the amounts of both received light are not equal, the steering servo, 12, etc. The motor 13 corrects the trajectory,
Head 9 is moved along scanning line 11. Further, from the photocells 12, 12, a signal corresponding to the direction of the head 9 is sent to the synchro resolver 14, and the synchro resolver 14 decomposes the direction vector 15 of the signal into an X-axis vector 16 and a Y-axis vector 17. (see FIG. 4), and generates an X-axis signal and a Y-axis signal corresponding to both vectors. The X-axis signal controls the X-axis motor 2 of the base 1, and the Y-axis signal controls the Y-axis motor 4 of the moving table 3 to move the table 5 along the scanning line 11.

マークセンサ8は加工図面18に検知光線を当
て、加工図面18上の暗の部分すなわち線図19
の部分でオンし、その以外の部分でオフする信号
を出力する。
The mark sensor 8 illuminates the processing drawing 18 with a detection light beam, and detects the dark area on the processing drawing 18, that is, the line drawing 19.
Outputs a signal that turns on at the part and turns off at the other parts.

テーブル5の上方にレーザ発振器20と、その
レーザを発射するビームベンダ21とを配する。
A laser oscillator 20 and a beam bender 21 that emits the laser are arranged above the table 5.

つぎに動作を説明する。倣い図面10をホト倣
い装置7の下に、加工図面18をマークセンサ8
の下に、加工材Aをテーブル5上におく。加工図
面18には彫刻しようとする模様を線図19とし
て描いておく。この状態でスタートすると、ホト
倣い装置7は走査線11に沿つて左右動し、これ
と同一アーム上にあるマークセンサ8も同一運動
をする。マークセンサ8は加工図面18の線図1
9部分でオンし、他部分ではオフする制御信号を
発する。レーザ発振器20は、この信号によりオ
ンオフ動作して、ビーベンダ21からレーザを発
する。加工材Aはこのレーザにより穿設加工され
て、加工図面18に応じた彫刻をなされる。倣い
ヘツド9が倣い図面10を一回走査したところ
で、彫刻は完成し、倣いヘツド9は始点に戻る。
Next, the operation will be explained. The copying drawing 10 is placed under the photocopying device 7, and the processing drawing 18 is placed under the mark sensor 8.
Place the workpiece A on the table 5 below. In the processing drawing 18, a pattern to be engraved is drawn as a line diagram 19. When started in this state, the photocopying device 7 moves left and right along the scanning line 11, and the mark sensor 8 on the same arm also makes the same movement. The mark sensor 8 is shown in line diagram 1 of the processing drawing 18.
It emits a control signal that turns on at 9 parts and turns off at other parts. The laser oscillator 20 is turned on and off by this signal, and the bender 21 emits a laser beam. The workpiece A is perforated by this laser and engraved according to the processing drawing 18. When the copying head 9 scans the copying drawing 10 once, the engraving is completed and the copying head 9 returns to the starting point.

〈考案の効果〉 本考案は以上説明したように構成したので、つ
ぎの効果を有する。
<Effects of the invention> Since the present invention is constructed as described above, it has the following effects.

(1) 加工材を載置するテーブルと、倣い図面に沿
つて動くホト倣い装置と、加工図面の明暗に応
じたオンオフ信号を出すマークセンサとを一体
的に構成し、オンオフ信号によつて制御される
レーザにより加工材を彫刻加工するため、従来
装置のようにレーザを制御するマスクを作成す
る手間を省略した。
(1) A table on which the workpiece is placed, a photocopying device that moves along the copying drawing, and a mark sensor that outputs on/off signals according to the brightness of the processing drawing are integrated, and are controlled by the on/off signal. Since the workpiece is engraved using a laser, the work of creating a mask to control the laser, which is required in conventional equipment, is eliminated.

(2) マークセンサを、加工図面上に描いた走査線
に沿つて動くホト倣い装置によつて動かすよう
にしたため、走査用プログラムが不要となつ
た。
(2) Since the mark sensor is moved by a photocopying device that moves along the scanning line drawn on the processing drawing, a scanning program is no longer necessary.

(3) マークセンサをホト倣い装置によつて走査移
動させるため、加工図面が一筆状に制限され
ず、自由に描ける。
(3) Since the mark sensor is scanned and moved by a photo copying device, the processing drawing is not limited to a single stroke and can be drawn freely.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のレーザ加工機を示す正面図、
第2図は同要部を示す平面図、第3図はホト倣い
装置の原理を示す説明図、第4図は同ベクトル分
解の説明図である。 5……テーブル、7……ホト倣い装置、6……
アーム、8……マークセンサ、10……倣い図
面、18……加工図面、20……レーザ発振器。
Figure 1 is a front view showing the laser processing machine of the present invention;
FIG. 2 is a plan view showing the main parts, FIG. 3 is an explanatory diagram showing the principle of the photocopying device, and FIG. 4 is an explanatory diagram of vector decomposition. 5...Table, 7...Photo copying device, 6...
Arm, 8... Mark sensor, 10... Copy drawing, 18... Machining drawing, 20... Laser oscillator.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 平面的に移動するテーブルの一側からアームを
突設し、該アームに倣い図面に沿つて移動するホ
ト倣い装置と加工図面の明暗に応じてオンオフ信
号を発するマークセンサとを取付け、且つテーブ
ルの上方に配したレーザ発振器をこの制御信号に
よつて制御するレーザ加工機。
An arm is provided protruding from one side of a table that moves in a plane, and a photocopying device that moves along the drawing and a mark sensor that emits an on/off signal depending on the brightness of the processing drawing are attached to the arm. A laser processing machine that uses this control signal to control a laser oscillator placed above.
JP1986026918U 1986-02-26 1986-02-26 Expired JPH0243579Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986026918U JPH0243579Y2 (en) 1986-02-26 1986-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986026918U JPH0243579Y2 (en) 1986-02-26 1986-02-26

Publications (2)

Publication Number Publication Date
JPS62142483U JPS62142483U (en) 1987-09-08
JPH0243579Y2 true JPH0243579Y2 (en) 1990-11-20

Family

ID=30828460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986026918U Expired JPH0243579Y2 (en) 1986-02-26 1986-02-26

Country Status (1)

Country Link
JP (1) JPH0243579Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860188U (en) * 1971-11-09 1973-07-31

Also Published As

Publication number Publication date
JPS62142483U (en) 1987-09-08

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