JPH0243743A - Semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention provides a semiconductor substrate having electrodes on both sides thereof, which is housed in a container, and which is fixed to a conductive bottom plate of the container on one electrode surface and on the other surface. The electrode body connected to the electrode relates to a semiconductor device that is used by being brought into pressure contact with an external connection body on the outside above the container.

[Conventional technology]

When connecting the semiconductor device 1 to an external circuit, methods such as screwing to an external conductor plate, screwing, brazing, screwing to an external connection conductor, brazing, caulking, etc. are used. In addition, flat pressure contact may be used. FIG. 2 shows an example of such a semiconductor device, in which a semiconductor substrate 1 is housed in a container consisting of a metal bottom plate 2 which also serves as a cooling body and a resin side wall 3, and the electrodes on the lower surface of the substrate 1 are connected to the bottom plate 2 and the upper surface. The electrode is soldered to an electrode body 4, and resin 5 is cast so that the upper part of the electrode body 4 is exposed. When using this semiconductor device, it is sandwiched between the lower connecting conductor plate and the upper connecting conductor, and the load of 150 kg/ca is applied via the upper connecting conductor.
By applying a pressure of "+" to the electrode body 4, it is connected to the upper and lower connecting conductors by pressurized contact.

[Problem to be solved by the invention]

However, when the semiconductor device shown in FIG. 2 is used, for example, as a semiconductor device that conducts intermittent energization, the temperature rises between the semiconductor substrate l and the bottom plate 2 due to the heating of the electric power I, or between the semiconductor substrate l and the fi This method has the drawback that fatigue occurs in the soldered portion between the conductors, which tends to cause deterioration of characteristics. In order to avoid this drawback, it is possible to pressurize the internal parts, but this requires special materials and high processing precision.
It cannot be adopted for low-cost semiconductor devices. Furthermore, the second
In the semiconductor device shown in the figure, the pressure that applies the electric bridge body 4 is applied directly to the center of the semiconductor substrate 1, so if the parallelism between the upper surface of the bottom plate 2 and the lower surface of the electric bridge body 4 is not sufficient, the semiconductor Unbalanced loads were applied to the substrate, which could also cause characteristic deterioration.

An object of the present invention is to provide a semiconductor device that eliminates the above-mentioned drawbacks and does not cause uneven loads on the semiconductor substrate due to pressure applied for connection with external conductors, and also causes less thermal fatigue of internal solder parts. It is in.

(Means for Solving the Problems) In order to solve the above problems, the semiconductor device 1 of the present invention has a plurality of semiconductor substrates arranged in two parallel rows with an interval on the bottom plate of a container consisting of a conductive bottom plate and a side wall. The electrodes on the bottom surface of the semiconductor substrate are fixed to the bottom plate, and the electrodes on the top surface are fixed to the electrode plates that are common to the top surface electrodes of the semiconductor substrates in other rows and are arranged in a direction perpendicular to the direction in which the substrates are arranged. One pressure body located directly above the gap between the semiconductor substrates in both rows covers each 1i
It is assumed that the pressurizing body is fixed to the center of the pressurizing body, and the container is filled with resin with the upper part of the pressurizing body exposed.

[Effect]

Since the semiconductor substrate is divided into multiple parts, the brazing area of each board is small, and thermal fatigue is also likely to occur. is applied to each semiconductor substrate at both ends of the bridge body, which has an elastic resin under the center, so even if the parallelism between the bottom surface of the pressure body and the top surface of the bottom plate is not sufficient, A large unbalanced load will not occur on the semiconductor Vi.

〔Example〕

FIG. 1 is a cross-sectional view of a semiconductor device according to an embodiment of the present invention, 7g
FIG. 3 is a perspective view of a portion on the bottom plate of the container, and parts common to those in FIG. 2 are given the same reference numerals. In this semiconductor device, the semiconductor substrate l is divided into six pieces, arranged in two rows, and placed on the bottom surface on the metal bottom plate 2 of the container! The bridge is soldered. On the other hand, an electrode plate 6 having a thickness of 0.5 lu, which is common to the upper surface electrode of the opposing semiconductor substrate, is soldered to the upper surface electric bridge. Therefore, the three Ti plates 6 are arranged in parallel in a direction perpendicular to the arrangement direction of the semiconductor substrates l. Furthermore, a columnar pressurizing body 7 having a height of 5 cranes is soldered onto the center portion of each electrode plate 6. This pressurizing body 7 is located directly above the gap between the semiconductor substrates 1 in both rows.

Therefore, even if pressure is applied downward to the upper surface of the pressurizing body 7 exposed on the casting resin 5 filled in the container, the force is not directly applied to the semiconductor substrate 1! It is distributed and applied to the resin layer 5 and the semiconductor substrate 1 via the scraping plate 6, and further applied to the bottom plate 2. In this structure, each semiconductor substrate 1 is connected in parallel between the pressurizing body 7 and the bottom plate 2, and if semiconductor substrates of the same type are used, a semiconductor device having the same function as a single large-area semiconductor substrate can be obtained. However, it is also possible to manufacture a semiconductor device in which different semiconductor elements are connected in parallel using different types of semiconductor element substrates. However, even in that case, the thickness of each substrate needs to be the same.

〔Effect of the invention〕

According to the present invention, a plurality of semiconductor substrates are arranged in two rows on the bottom plate of a container, electrode plates are fixed to the upper electrodes of the opposing substrates in each row, and the center portion of each electrode plate is pressed with one pressure. By fixing it to the body, the structure is such that the pressure applied to the pressurizing body outside the container is not directly applied to the semiconductor substrate. This structure disperses the heat generating parts, prevents deterioration of the solder parts that are soldered to the electrodes on both sides of the semiconductor substrate due to thermal fatigue, and also prevents characteristic deterioration due to unbalanced loads on the semiconductor substrate.
1-.

A highly reliable semiconductor device can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention, and FIG.
The figure is a sectional view of a conventional semiconductor device, and FIG. 3 is a perspective view of the portion above the bottom plate of the container of the device of FIG. l Semiconductor substrate, : container bottom plate, 3 : container side wall, 5 : casting resin, 6 : electrode plate, pressurizing body. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1) A plurality of semiconductor substrates are arranged in two rows with parallel spacing on the bottom plate of a container consisting of a conductive bottom plate and side walls, and the electrodes on the bottom surface of the semiconductor substrates are connected to the bottom plate, and the electrodes on the top surface are connected to the other opposing rows. A pressurizing body is attached to each electrode plate that is common to the electrodes on the top surface of the semiconductor substrates and is arranged in a direction perpendicular to the arrangement direction of the substrates, and is located directly above the gap between the semiconductor substrates in both rows. What is claimed is: 1. A semiconductor device, characterized in that the semiconductor device is fixed to a central portion, and a container is filled with resin with the upper part of the pressurizing body exposed.