JPH024432Y2

JPH024432Y2 -

Info

Publication number: JPH024432Y2
Application number: JP1981012054U
Authority: JP
Priority date: 1981-01-29
Filing date: 1981-01-29
Publication date: 1990-02-01
Also published as: JPS57124947U

Description

【考案の詳細な説明】本考案は継電器のシール構造に関するものであ
る。[Detailed Description of the Invention] The present invention relates to a seal structure for a relay.

継電器構成部品を巻枠に取付けカバーに納めた
継電器のシール構造としては、従来は第１図の如
きものが多い。 Conventionally, many seal structures for relays in which relay components are attached to a winding frame and housed in a cover are as shown in FIG. 1.

１は鉄心、２は巻線、３は接極子、４は継鉄、
５は固定接点ばね、６は可動接点ばね、７は巻枠
下つば、８は巻枠上つば、９はカバー、１０は端
子板、１１は可動ばね端子、１２は固定ばね端
子、１３は巻線端子、１４はシール剤を注入固化
させたシール層である。 1 is the iron core, 2 is the winding, 3 is the armature, 4 is the yoke,
5 is a fixed contact spring, 6 is a movable contact spring, 7 is a lower collar of the winding frame, 8 is an upper collar of the winding frame, 9 is a cover, 10 is a terminal plate, 11 is a movable spring terminal, 12 is a fixed spring terminal, 13 is a winding The wire terminal 14 is a sealing layer in which a sealing agent is injected and solidified.

シール層１４は端子板１０の板面全体を被覆し
ているのでシール剤の使用量が多くなると共に端
子板１０にシール層１４が重畳するため継電器の
高さがその分だけ高くなる等の欠点がある。 Since the sealing layer 14 covers the entire surface of the terminal board 10, the amount of sealant used increases, and since the sealing layer 14 overlaps the terminal board 10, the height of the relay increases accordingly. There is.

考案はこれらの欠点を除き、しかもシール効果
を損ねないで（シール層の厚みは変えないで）継
電器の高さを低くできるように構成したものであ
る。 The idea was to eliminate these drawbacks and to make it possible to reduce the height of the relay without impairing the sealing effect (without changing the thickness of the sealing layer).

第２図は本考案の一実施例を示す縦断面図で、
１５は鉄心、１６は巻線、１７は接極子、１８は
継鉄、１９は固定接点ばね、２０は可動接点ば
ね、２１は巻枠下つば、２２は可動ばね端子、２
３は固定ばね端子、２４は巻線端子である。 FIG. 2 is a longitudinal sectional view showing an embodiment of the present invention.
15 is an iron core, 16 is a winding, 17 is an armature, 18 is a yoke, 19 is a fixed contact spring, 20 is a movable contact spring, 21 is a lower collar of the winding frame, 22 is a movable spring terminal, 2
3 is a fixed spring terminal, and 24 is a winding terminal.

巻枠下つば２１の輪郭は矩形でカバー２６内に
挿入した場合に三方にてカバー２６内面に密接
し、継鉄１８側はカバー２６との間に空隙部を残
している。シール板２５は第５図および第６図に
示すように閉塞部２５ａと被覆部２５ｂとからな
り、シール板２５を継電器の端子面に被せれば閉
塞部２５ａが継鉄１８とカバー２６との間の前記
空隙部を閉塞し、被覆部２５ｂは巻枠下つば２１
に重畳して中央部を覆う。この状態が第３図の底
面図である。カバー２６と被覆部２５ｂとの間に
形成される凹部にシール剤を注入固化させれば、
第４図の通りシール層２７は端子２２，２３，２
４周辺部とカバー２６近接部をシールし、被覆部
２５ｂを残しているので従来よりシール剤の使用
量が少なくなつている。２５ｃは可動ばね端子２
２を挿通する穴、２８は巻枠下つば２１が係止す
るカバー内の突起である。 The outline of the lower flange 21 of the winding frame is rectangular, and when inserted into the cover 26, it comes into close contact with the inner surface of the cover 26 on three sides, leaving a gap between the yoke 18 side and the cover 26. As shown in FIGS. 5 and 6, the sealing plate 25 consists of a closing part 25a and a covering part 25b. When the sealing plate 25 is placed over the terminal surface of the relay, the closing part 25a connects the yoke 18 and the cover 26. The covering portion 25b closes the gap between the winding frame lower flange 21.
overlap to cover the center. This state is shown in the bottom view of FIG. If the sealant is injected into the recess formed between the cover 26 and the covering part 25b and solidified,
As shown in FIG. 4, the sealing layer 27 is
4 and the vicinity of the cover 26, leaving the covering portion 25b, the amount of sealant used is smaller than in the past. 25c is movable spring terminal 2
The hole 28 through which the winding frame lower flange 21 is inserted is a protrusion in the cover into which the lower flange 21 of the winding frame is engaged.

以上説明したように本考案によればシール剤の
使用量が従来より少く、またシール層２７は巻枠
下つば２１の面に直接形成され従来のように端子
板を介在させないので端子板の分だけ継電器の高
さを低くすることが出来る。 As explained above, according to the present invention, the amount of sealant used is smaller than before, and since the sealing layer 27 is formed directly on the surface of the lower flange 21 of the winding frame without intervening the terminal plate as in the conventional case, This allows the height of the relay to be lowered.

[Brief explanation of drawings]

第１図は従来例の側断面図、第２図は本考案実
施例の縦断面図、第３図はそのシール前の底面
図、第４図はシール後の底面図、第５図はシール
板２５の上面斜視図、第６図はシール板２５の下
面斜視図である。１，１５……鉄心、２，１６……巻線、３，１
７……接極子、４，１８……継鉄、５，１９……
固定接点ばね、６，２０……可動接点ばね、７，
２１……巻枠下つば、９，２６……カバー、２５
……シール板、２５ａ……閉塞部、２５ｂ……被
覆部。 Fig. 1 is a side sectional view of the conventional example, Fig. 2 is a longitudinal sectional view of the embodiment of the present invention, Fig. 3 is a bottom view before sealing, Fig. 4 is a bottom view after sealing, and Fig. 5 is a seal. FIG. 6 is a top perspective view of the plate 25, and FIG. 6 is a bottom perspective view of the seal plate 25. 1,15... Iron core, 2,16... Winding wire, 3,1
7... Armature, 4, 18... Yoke, 5, 19...
Fixed contact spring, 6, 20...Movable contact spring, 7,
21... Lower brim of winding frame, 9, 26... Cover, 25
...Seal plate, 25a...Closing part, 25b... Covering part.

Claims

[Scope of utility model registration request]

In the seal structure of an electromagnetic relay in which relay components are fixed to a winding frame and housed in a cover, the outline of the terminal lead-out surface of the winding frame is aligned with the inner circumference of the cover, leaving a part of the inner surface of the cover, and the remaining gap is A sealing plate consisting of a closing part to be closed and a covering part covering a surface of the terminal leading-out surface of the winding frame other than around the terminal is stacked on the terminal leading-out surface, and the closing part and the terminal leading-out surface not covered by the seal plate are overlapped. A seal structure for an electromagnetic relay characterized by sealing by injecting a sealant.