JPH0244336U - - Google Patents
Info
- Publication number
- JPH0244336U JPH0244336U JP12404388U JP12404388U JPH0244336U JP H0244336 U JPH0244336 U JP H0244336U JP 12404388 U JP12404388 U JP 12404388U JP 12404388 U JP12404388 U JP 12404388U JP H0244336 U JPH0244336 U JP H0244336U
- Authority
- JP
- Japan
- Prior art keywords
- metal wiring
- insulating layer
- semiconductor device
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体素子の一実施例を示す
平面図、第２図は第１図のＡ―Ａ線断面図、第３
図は他の実施例を示す平面図、第４図は第３図の
Ａ―Ａ線断面図、第５図は第３図のＢ―Ｂ線断面
図、第６図は従来の半導体素子を示す平面図、第
７図は第６図のＡ―Ａ線断面図である。 １……絶縁膜段差、２……金属配線、３……下
部絶縁膜又は動作層、４……上部絶縁膜、５……
絶縁膜突部。
平面図、第２図は第１図のＡ―Ａ線断面図、第３
図は他の実施例を示す平面図、第４図は第３図の
Ａ―Ａ線断面図、第５図は第３図のＢ―Ｂ線断面
図、第６図は従来の半導体素子を示す平面図、第
７図は第６図のＡ―Ａ線断面図である。 １……絶縁膜段差、２……金属配線、３……下
部絶縁膜又は動作層、４……上部絶縁膜、５……
絶縁膜突部。
Claims (1)
- 段差を有する絶縁層を金属配線が横切る半導体
素子において、金属配線の下部絶縁層の段差部に
狭い突起を設けることを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12404388U JPH0244336U (ja) | 1988-09-21 | 1988-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12404388U JPH0244336U (ja) | 1988-09-21 | 1988-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244336U true JPH0244336U (ja) | 1990-03-27 |
Family
ID=31373436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12404388U Pending JPH0244336U (ja) | 1988-09-21 | 1988-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244336U (ja) |
-
1988
- 1988-09-21 JP JP12404388U patent/JPH0244336U/ja active Pending