JPH0256440U - - Google Patents
Info
- Publication number
- JPH0256440U JPH0256440U JP1988135715U JP13571588U JPH0256440U JP H0256440 U JPH0256440 U JP H0256440U JP 1988135715 U JP1988135715 U JP 1988135715U JP 13571588 U JP13571588 U JP 13571588U JP H0256440 U JPH0256440 U JP H0256440U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- utility
- scope
- back surface
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の第１の実施例の平面図、第２
図は第１図の部分拡大図、第３図は本考案の第２
の実施例の平面図である。 １……ウエハー、２……溝、３……荒らし部。
図は第１図の部分拡大図、第３図は本考案の第２
の実施例の平面図である。 １……ウエハー、２……溝、３……荒らし部。
Claims (1)
- 半導体素子の裏面に溝を有することを特徴とす
る半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135715U JPH0256440U (ja) | 1988-10-17 | 1988-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135715U JPH0256440U (ja) | 1988-10-17 | 1988-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256440U true JPH0256440U (ja) | 1990-04-24 |
Family
ID=31395591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988135715U Pending JPH0256440U (ja) | 1988-10-17 | 1988-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256440U (ja) |
-
1988
- 1988-10-17 JP JP1988135715U patent/JPH0256440U/ja active Pending