JPH0244345U - - Google Patents
Info
- Publication number
- JPH0244345U JPH0244345U JP1988122654U JP12265488U JPH0244345U JP H0244345 U JPH0244345 U JP H0244345U JP 1988122654 U JP1988122654 U JP 1988122654U JP 12265488 U JP12265488 U JP 12265488U JP H0244345 U JPH0244345 U JP H0244345U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- cooling
- cooling module
- aln
- ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Description
第１図、第２図は本考案の一実施例の断面図で
ある。
３……冷却構造体。
1 and 2 are cross-sectional views of an embodiment of the present invention. 3... Cooling structure.
Claims (1)
パツケージが冷却構造体に機械的に固定されてい
ることを特徴とする半導体用冷却モジユール。 ２ 前記セラミツクス製パツケージの冷却側は熱
伝導率が１５０ｗ／ｍ・Ｋ以上のＡｌＮセラミツ
クス、あるいは、ＳｉＣセラミツクスであること
を特徴とする実用新案登録請求の範囲第１項記載
の半導体用冷却モジユール。 ３ 前記冷却構造体は銅からなり、前記ＡｌＮセ
ラミツクスとの接触面に複数の溝をもつことを特
徴とする実用新案登録請求の範囲第１項または第
２項記載の半導体用冷却モジユール。 ４ 前記ＡｌＮセラミツクスと前記冷却構造体と
の間には熱伝導率が１ｗ／ｍ・Ｋ以上の熱伝導媒
体が介されて固定されていることを特徴とする実
用新案登録請求の範囲第１項、第２項または第３
項に記載の半導体用冷却モジユール。 ５ 前記熱伝導媒体がグリースであることを特徴
とする実用新案登録請求の範囲第４項記載の半導
体用冷却モジユール。[Claims for Utility Model Registration] 1. A semiconductor cooling module characterized in that a ceramic package containing a plurality of semiconductor elements is mechanically fixed to a cooling structure. 2. The semiconductor cooling module according to claim 1, wherein the cooling side of the ceramic package is made of AlN ceramics or SiC ceramics having a thermal conductivity of 150 w/m·K or more. 3. The cooling module for a semiconductor according to claim 1 or 2, wherein the cooling structure is made of copper and has a plurality of grooves on the contact surface with the AlN ceramic. 4 Utility model registration claim 1, characterized in that a heat conductive medium having a thermal conductivity of 1 w/m·K or more is interposed and fixed between the AlN ceramics and the cooling structure. , the second term or the third term
A cooling module for semiconductors as described in . 5. The semiconductor cooling module according to claim 4, wherein the heat conductive medium is grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122654U JPH0244345U (en) | 1988-09-21 | 1988-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122654U JPH0244345U (en) | 1988-09-21 | 1988-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244345U true JPH0244345U (en) | 1990-03-27 |
Family
ID=31370784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122654U Pending JPH0244345U (en) | 1988-09-21 | 1988-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244345U (en) |
-
1988
- 1988-09-21 JP JP1988122654U patent/JPH0244345U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0244345U (en) | ||
| GB1204884A (en) | Improvements in thermoelectric devices | |
| JPH0361387U (en) | ||
| JPS6448095U (en) | ||
| JPS60163738U (en) | semiconductor equipment | |
| JPS6262448U (en) | ||
| JPS6037248U (en) | hybrid integrated circuit | |
| JPS62188151U (en) | ||
| JPS61168640U (en) | ||
| JPH01123352U (en) | ||
| JPS6249249U (en) | ||
| JPH0167046U (en) | ||
| JPS6280340U (en) | ||
| JPS63147825U (en) | ||
| JPS6240840U (en) | ||
| JPS6294643U (en) | ||
| JPS60101751U (en) | Heat sink for semiconductor devices | |
| JPS59117165U (en) | Electric circuit heat dissipation structure | |
| JPS592150U (en) | Isolated semiconductor device for power use | |
| JPS6453735U (en) | ||
| JPS61171247U (en) | ||
| JPS60163740U (en) | semiconductor equipment | |
| JPS6130252U (en) | semiconductor equipment | |
| JPS58120664U (en) | heat dissipation fin | |
| JPS63162543U (en) |