JPH0244518Y2 - - Google Patents

Info

Publication number
JPH0244518Y2
JPH0244518Y2 JP1986121208U JP12120886U JPH0244518Y2 JP H0244518 Y2 JPH0244518 Y2 JP H0244518Y2 JP 1986121208 U JP1986121208 U JP 1986121208U JP 12120886 U JP12120886 U JP 12120886U JP H0244518 Y2 JPH0244518 Y2 JP H0244518Y2
Authority
JP
Japan
Prior art keywords
wire
spool
bonding arm
capillary
horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986121208U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327043U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986121208U priority Critical patent/JPH0244518Y2/ja
Publication of JPS6327043U publication Critical patent/JPS6327043U/ja
Application granted granted Critical
Publication of JPH0244518Y2 publication Critical patent/JPH0244518Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1986121208U 1986-08-07 1986-08-07 Expired JPH0244518Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986121208U JPH0244518Y2 (cs) 1986-08-07 1986-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986121208U JPH0244518Y2 (cs) 1986-08-07 1986-08-07

Publications (2)

Publication Number Publication Date
JPS6327043U JPS6327043U (cs) 1988-02-22
JPH0244518Y2 true JPH0244518Y2 (cs) 1990-11-27

Family

ID=31010261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986121208U Expired JPH0244518Y2 (cs) 1986-08-07 1986-08-07

Country Status (1)

Country Link
JP (1) JPH0244518Y2 (cs)

Also Published As

Publication number Publication date
JPS6327043U (cs) 1988-02-22

Similar Documents

Publication Publication Date Title
US4550871A (en) Four-motion wire bonder
CN1111035A (zh) 超声波引线焊接装置
CN102945813A (zh) 一种用于全自动引线键合设备上的键合头装置
JPS6064955U (ja) 巻線機のテンシヨン装置
CN107248500A (zh) 一种取晶、固晶装置及其采用它的固晶机
US7025243B2 (en) Bondhead for wire bonding apparatus
JPH0244518Y2 (cs)
US4575602A (en) Apparatus for forming bonding balls on bonding wires
US6474538B1 (en) Bonding apparatus and bonding method
KR20030079700A (ko) 본딩장치
JP3856532B2 (ja) ワイヤボンダー用ボール形成装置
JPS629717Y2 (cs)
JPS626651B2 (cs)
JPH0611066B2 (ja) ワイヤボンデイング装置
JPS63293844A (ja) ワイヤボンデイングヘツド
SU499614A1 (ru) Автомат монтажа микросхем
CN115780948A (zh) 一种铜丝线软支架封装设备
JPH09191023A (ja) ワイヤボンディング装置
JP2725102B2 (ja) ワイヤボンディング方法
JP2773541B2 (ja) ワイヤボンディング方法およびその装置
JPH0231434A (ja) 半導体製造装置
JPS61290731A (ja) ワイヤボンデイング装置
JPH0333060Y2 (cs)
JPH0427167Y2 (cs)
JPH0635470Y2 (ja) ワイヤボンデイング装置