JPH0245551U - - Google Patents
Info
- Publication number
- JPH0245551U JPH0245551U JP12121888U JP12121888U JPH0245551U JP H0245551 U JPH0245551 U JP H0245551U JP 12121888 U JP12121888 U JP 12121888U JP 12121888 U JP12121888 U JP 12121888U JP H0245551 U JPH0245551 U JP H0245551U
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- conveyance path
- copper
- clad laminate
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す主要部の側断
面図、第２図ａ〜ｅは本考案の実施例を示す動作
概要図、第３図は電子回路板の製造工程における
感光性樹脂の貼り付け状態を示す側断面図、第４
図は従来の感光性樹脂用保護フイルム剥離装置の
側断面図である。
１……銅張積層板、２，３ａ，３ｂ，３ｃ，３
ｄ，３ｆ，３ｇ，３ｈ，３ｉ，６……搬送ローラ
、３ｅ，３ｊ……ベルト、４，７……シリンダ、
５……粘着ローラ、８……押えローラ、９……保
護フイルム、１０……トレー、１１……感光性樹
脂。
Fig. 1 is a side sectional view of the main parts showing an embodiment of the present invention, Fig. 2 a to e are operational schematic diagrams showing an embodiment of the invention, and Fig. 3 shows photosensitivity in the manufacturing process of an electronic circuit board. Side sectional view showing the state of resin attachment, No. 4
The figure is a side sectional view of a conventional protective film peeling device for photosensitive resin. 1...Copper-clad laminate, 2, 3a, 3b, 3c, 3
d, 3f, 3g, 3h, 3i, 6... Conveyance roller, 3e, 3j... Belt, 4, 7... Cylinder,
5... Adhesive roller, 8... Press roller, 9... Protective film, 10... Tray, 11... Photosensitive resin.
Claims (1)
イルムを剥離する保護フイルム剥離装置において
、前記銅張積層板を水平に搬送する第１の搬送路
と、剥離された保護フイルムを排出する第２の搬
送路と、前記保護フイルムを粘着力により周面一
部に係止し前記銅張積層板から離間する方向に後
退しつつ該保護フイルムを剥離する粘着ローラと
、該粘着ローラから保護フイルムを離脱させ該保
護フイルムを前記第２の搬送路に移替える押えロ
ーラとを有することを特徴とする感光性樹脂用保
護フイルム剥離装置。 A protective film peeling device that peels off a protective film covering and protecting a photosensitive resin on a copper-clad laminate includes a first conveyance path for horizontally conveying the copper-clad laminate and a second conveyance path for discharging the peeled protective film. a conveyance path; an adhesive roller that retains the protective film on a part of its circumferential surface with adhesive force and peels off the protective film while moving backward in a direction away from the copper-clad laminate; and removing the protective film from the adhesive roller. A protective film peeling device for a photosensitive resin, comprising a presser roller that detaches the protective film and transfers the protective film to the second conveyance path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121218U JPH0755559Y2 (en) | 1988-09-16 | 1988-09-16 | Protective film peeling device for photosensitive resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121218U JPH0755559Y2 (en) | 1988-09-16 | 1988-09-16 | Protective film peeling device for photosensitive resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0245551U true JPH0245551U (en) | 1990-03-28 |
| JPH0755559Y2 JPH0755559Y2 (en) | 1995-12-20 |
Family
ID=31368026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121218U Expired - Lifetime JPH0755559Y2 (en) | 1988-09-16 | 1988-09-16 | Protective film peeling device for photosensitive resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755559Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108891121A (en) * | 2018-08-13 | 2018-11-27 | 深圳市伟鸿科科技有限公司 | Material stripping mechanism and FPC pretreatment unit |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101477509B1 (en) * | 2013-06-18 | 2014-12-31 | 주식회사 씨엘디 | Film removing apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154447A (en) * | 1983-02-22 | 1984-09-03 | Hitachi Chem Co Ltd | Method for stripping cover film of photosensitive resin film pasted to printed wiring board |
| JPS59154446A (en) * | 1983-02-22 | 1984-09-03 | Hitachi Chem Co Ltd | Method for stripping cover film of photosensitive resin film pasted to printed wiring board |
-
1988
- 1988-09-16 JP JP1988121218U patent/JPH0755559Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154447A (en) * | 1983-02-22 | 1984-09-03 | Hitachi Chem Co Ltd | Method for stripping cover film of photosensitive resin film pasted to printed wiring board |
| JPS59154446A (en) * | 1983-02-22 | 1984-09-03 | Hitachi Chem Co Ltd | Method for stripping cover film of photosensitive resin film pasted to printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108891121A (en) * | 2018-08-13 | 2018-11-27 | 深圳市伟鸿科科技有限公司 | Material stripping mechanism and FPC pretreatment unit |
| CN108891121B (en) * | 2018-08-13 | 2024-05-31 | 深圳市伟鸿科科技有限公司 | Material stripping mechanism and FPC preprocessing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755559Y2 (en) | 1995-12-20 |
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