JPH03105471U - - Google Patents

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Publication number
JPH03105471U
JPH03105471U JP1478290U JP1478290U JPH03105471U JP H03105471 U JPH03105471 U JP H03105471U JP 1478290 U JP1478290 U JP 1478290U JP 1478290 U JP1478290 U JP 1478290U JP H03105471 U JPH03105471 U JP H03105471U
Authority
JP
Japan
Prior art keywords
carrier tape
release layer
adhesive
base material
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1478290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1478290U priority Critical patent/JPH03105471U/ja
Publication of JPH03105471U publication Critical patent/JPH03105471U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案キヤリヤテープの拡大側面図、
第2図は本考案キヤリヤテープからSMDを取り
出す時の図、第3図は本考案キヤリヤテープから
取り出したSMDをプリント基板に搭載した図で
ある。 1……キヤリアテープ、2……基材、3……剥
離層、4……泡状の粘着剤、5……SMD、6…
…リード、7……プリント基板、8……導電部。
Figure 1 is an enlarged side view of the carrier tape of the present invention.
FIG. 2 is a diagram showing an SMD taken out from the carrier tape of the present invention, and FIG. 3 is a diagram showing the SMD taken out from the carrier tape of the present invention mounted on a printed circuit board. DESCRIPTION OF SYMBOLS 1... Carrier tape, 2... Base material, 3... Peeling layer, 4... Foam adhesive, 5... SMD, 6...
... Lead, 7 ... Printed circuit board, 8 ... Conductive part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キヤリヤテープ本体は基材と剥離層から構成さ
れており、該剥離層上には発泡させた粘着剤が塗
布されているとともに、該粘着剤で電子部品が粘
着されていることを特徴とするキヤリヤテープ。
A carrier tape characterized in that the carrier tape body is composed of a base material and a release layer, a foamed adhesive is coated on the release layer, and an electronic component is adhered with the adhesive.
JP1478290U 1990-02-19 1990-02-19 Pending JPH03105471U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1478290U JPH03105471U (en) 1990-02-19 1990-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1478290U JPH03105471U (en) 1990-02-19 1990-02-19

Publications (1)

Publication Number Publication Date
JPH03105471U true JPH03105471U (en) 1991-10-31

Family

ID=31518128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1478290U Pending JPH03105471U (en) 1990-02-19 1990-02-19

Country Status (1)

Country Link
JP (1) JPH03105471U (en)

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