JPH0245672U - - Google Patents

Info

Publication number
JPH0245672U
JPH0245672U JP12352088U JP12352088U JPH0245672U JP H0245672 U JPH0245672 U JP H0245672U JP 12352088 U JP12352088 U JP 12352088U JP 12352088 U JP12352088 U JP 12352088U JP H0245672 U JPH0245672 U JP H0245672U
Authority
JP
Japan
Prior art keywords
insulating substrate
integrated circuit
hybrid integrated
hybrid
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12352088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12352088U priority Critical patent/JPH0245672U/ja
Publication of JPH0245672U publication Critical patent/JPH0245672U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
第1図a,b,cは本考案に係る混成集積回路
の一実施例を示す正面図、背面図および側面図、
第2図a,b,cは本考案の別の実施例を示す基
板表、裏面図およびその組合わせ状態を示す概略
図、第3図は本考案の他の実施例を示す概略図で
ある。 1……絶縁基板、1a……基板表面、1b……
基板裏面、2,3……電子部品、4,4a,4b
……リード(リード端子)、A,A……同一の回
路パターンによるハイブリツド回路。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板上に抵抗素子や導体配線を印刷形成す
    るとともに各種の電子部品を搭載して実装してな
    る混成集積回路において、前記絶縁基板の表、裏
    両面のそれぞれに、同一の回路パターンをもつハ
    イブリツド回路を設けるとともに、これら各ハイ
    ブリツド回路の外部接続用リード端子を、前記絶
    縁基板の側縁部に対称的に配列したことを特徴と
    する混成集積回路。
JP12352088U 1988-09-22 1988-09-22 Pending JPH0245672U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12352088U JPH0245672U (ja) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12352088U JPH0245672U (ja) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0245672U true JPH0245672U (ja) 1990-03-29

Family

ID=31372448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12352088U Pending JPH0245672U (ja) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0245672U (ja)

Similar Documents

Publication Publication Date Title
JPH01113379U (ja)
JPH0245672U (ja)
JPH0245671U (ja)
JPH032669U (ja)
JPH0448661U (ja)
JPH0440558U (ja)
JPH01150378U (ja)
JPS6194376U (ja)
JPS62186459U (ja)
JPH0231175U (ja)
JPH03102764U (ja)
JPS59143059U (ja) 印刷配線基板
JPH0451021U (ja)
JPH01163388U (ja)
JPS62186314U (ja)
JPS62161778U (ja)
JPH01145167U (ja)
JPS5952659U (ja) 混成集積回路
JPS62193797U (ja)
JPS60130674U (ja) 厚膜混成集積回路用基板
JPS60106363U (ja) プリント配線基板
JPH0312461U (ja)
JPS6324832U (ja)
JPS6346873U (ja)
JPS62162850U (ja)