JPH0246032Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a resin-sealed lead frame for chip electronic components.

2. Description of the Related Art The shape of a lead frame used in a resin-sealed electronic component, such as a solid electrolytic capacitor, is shown below with reference to FIGS. 3 and 4. FIG. 3 shows a partial plan view of the lead frame 1, and FIG. 4 shows a partial perspective view thereof. In the figure, 2 is a first lead part, 3 is a second lead part, 4 is a first tie bar part,
5 is a second tie bar section. First lead part 2
is a land portion 2a on which the main body portion 6 of the electronic component is placed;
The leads 2b are integrally molded with steps and are arranged in parallel.
Leads 3b are arranged in parallel to each lead 2b of the lead portion 2, facing each other via a land portion 2a. The first tie bar portion 4 is orthogonal to the first and second lead portions 2 and 3 to connect and connect each lead end.
The second tie bar portion 5 is arranged in parallel with the first and second lead portions 2 and 3 at a constant pitch, and bridges and connects each tie bar of the first tie bar portion 4.

The structure of a resin-sealed electronic component using the lead frame 1 is shown in the order of manufacture with reference to FIGS. 4 to 7. First, as shown in FIG. 5, after applying silver paste 6 to the land portion 2a of the first lead portion 2,
As shown in FIG. 6, the main body part 6 of the capacitor element is placed on the land part 2a, and the lead part 6 of the capacitor element is placed on the land part 2a.
a is placed on the lead 3b of the second lead portion 3. After welding the lead part 6a of this element to the lead 3b of the second lead part 3, the lead frame 1 is set in upper and lower molds, and the main body part 6 is housed in the cavity of the mold, although not shown. Molten resin 1
Inject 0. Next, after the resin 10 has hardened, the lead frame 1 is taken out from the mold and the first and second tie bar parts 4 and 5 are removed from the first and second lead parts 2 and 3, as shown in FIG. Then, a resin-sealed electronic component 7 is obtained.

Problems to be Solved by the Invention By the way, when applying the silver paste 6 to the land portion 2a of the lead frame 1 in manufacturing the above-mentioned resin-sealed electronic component 7, as shown in FIG. The silver paste 6 is applied by moving the coating head 8 linearly along the land portion 2a that appears.
Apply. However, since second tie bar parts 5 of different heights are interposed at regular intervals in the row of land parts 2a, the vertical movement mechanism and the second tie bar that allow the second tie bar parts 5 to straddle the coating head 8 are not connected to each other. A mechanism for stopping the coating at section 5 is required, which complicates the equipment. Moreover, the coating intervals become irregular, which tends to cause coating unevenness.

Means for Solving the Problems In the present invention, the land portion on which the main body of a chip-shaped electronic component is placed has a first lead portion in which leads integrally molded with steps are arranged in parallel; a second lead part in which leads are arranged in parallel with each lead of the first lead part, facing each other with the land part in between;
A first tie bar section that is perpendicular to the first and second lead sections and connects and integrates the respective lead ends; and a first tie bar section that is parallel and arranged at a constant pitch to the first and second lead sections. In a lead frame including a second tie bar section that bridges and connects each tie bar, a step is provided in a part of the second tie bar section along the direction in which the land sections are lined up to be approximately at the same height as the land section. It is characterized by:

Effect: Obstacles in the alignment direction of the land portions are eliminated by the step partially provided in the second tie bar portion of the lead frame along the alignment direction of the land portions.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 shows a partial perspective view of a lead frame 9 for electronic components according to the present invention. The same reference numerals as in FIGS. 3 and 4 indicate the same components, and the explanation thereof will be omitted. In the figure, 2 is the first lead part,
2b is a lead of the first lead part 2 integrally molded with the land part 2a, 3 is a second lead part, 3b is a lead of the second lead part 3, 4 is a first tie bar part,
5 is a second tie bar portion, and 5a is a step of the second tie bar portion 5. The feature of the present invention is that the second tie bar portion 5
This is because a step 5a is provided in a part of the land portion 2a along the alignment direction of the land portion 2a at the same height as the land portion 2a.

The operation of the present invention based on the above configuration will be described below. That is, as shown in FIG. 2, when the coating head 8 is linearly moved along the land portions 2a arranged in a row in order to apply silver paste to the land portions 2a of the lead frame 9, the second Due to the step difference in the tie bar portion 5, there are no obstacles in the direction of movement of the tube 8 toward the coating. Therefore, the upper and lower parts of the coating head 8 and the coating stop mechanism are not required, and the second tie bar part 5 can also be coated at the same intervals as the land part 2a, so that a smooth and stable coating state can be obtained.

Effects of the invention According to the invention, in a resin-sealed lead frame for electronic components, the land portion of the lead on which the main body of the electronic component is placed is placed on a part of the tie bar portion that is parallel to and arranged in the lead. Since we have provided a step at the same height as the land along the alignment direction, when the coating head is moved linearly to coat the land, there is no obstacle to the coating head on the tie bar, and the top and bottom of the coating head can be easily moved. Also, a coating stop mechanism is not required, which simplifies the equipment. Furthermore, since the tie bar portions can be coated at the same intervals as the land portions, smooth and stable coating can be achieved and uneven coating can be eliminated.

[Brief explanation of the drawing]

Fig. 1 is a partial perspective view of a lead frame for electronic components according to the present invention, Fig. 2 is a side view of the work of applying silver paste to the land portion of the lead frame shown in Fig. 1;
Fig. 3 is a partial plan view of a conventional lead frame for electronic components, Fig. 4 is a partial perspective view of the lead frame shown in Fig. 3, and Figs. FIG. 8 is a side view of the process of manufacturing the resin-sealed electric component, and FIG. 8 is a side view of the process of applying silver paste to the land portions of the lead frames shown in FIGS. 3 and 4. 2...First lead part, 2a...Land part, 2
b...Lead of the first lead part, 3...Lead of the second lead part, 3a...Lead of the second lead part, 4...
...First tie bar part, 5...Second tie bar part, 5a
……Step.

Claims (1)

[Scope of utility model registration request] a first lead part in which a land part on which a main body part of an electronic component is placed is formed in a stepped manner; a second lead part disposed opposite to the first lead part with the land part sandwiched therebetween; A lead frame having a pair of first tie bar parts that connect and integrate the respective lead ends of the second lead part, and a second tie bar part that bridges and connects the first tie bars. A lead frame for an electronic component, characterized in that a part of the second tie bar part is provided with a step lined up at substantially the same height as the land part along the alignment direction of the land part.