JPH0247049U - - Google Patents
Info
- Publication number
- JPH0247049U JPH0247049U JP1988126836U JP12683688U JPH0247049U JP H0247049 U JPH0247049 U JP H0247049U JP 1988126836 U JP1988126836 U JP 1988126836U JP 12683688 U JP12683688 U JP 12683688U JP H0247049 U JPH0247049 U JP H0247049U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor element
- insulating frame
- placing part
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……金属基体、１ａ……半導体素子載置部、
１ｂ……金属層、２……絶縁枠体、Ａ……切欠部
。
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……金属基体、１ａ……半導体素子載置部、
１ｂ……金属層、２……絶縁枠体、Ａ……切欠部
。
Claims (1)
- 中央部に半導体素子が載置される載置部を有す
る金属基体上に、前記載置部を囲繞するようにし
て絶縁枠体をロウ付けして成る半導体素子収納用
パツケージにおいて、前記絶縁枠体の下面内周角
部に切欠部を形成したことを特徴とする半導体素
子収納用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126836U JPH0247049U (ja) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126836U JPH0247049U (ja) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247049U true JPH0247049U (ja) | 1990-03-30 |
Family
ID=31378719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126836U Pending JPH0247049U (ja) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247049U (ja) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917271A (ja) * | 1982-07-20 | 1984-01-28 | Nec Corp | セラミツクパツケ−ジ半導体装置 |
| JPS60214546A (ja) * | 1984-04-10 | 1985-10-26 | Hitachi Ltd | 半導体装置 |
| JPS613663A (ja) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | 金属部材の鑞付け前処理方法 |
| JPS6252949A (ja) * | 1985-08-30 | 1987-03-07 | Nec Corp | 積層型セラミツクパツケ−ジ |
-
1988
- 1988-09-27 JP JP1988126836U patent/JPH0247049U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917271A (ja) * | 1982-07-20 | 1984-01-28 | Nec Corp | セラミツクパツケ−ジ半導体装置 |
| JPS60214546A (ja) * | 1984-04-10 | 1985-10-26 | Hitachi Ltd | 半導体装置 |
| JPS613663A (ja) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | 金属部材の鑞付け前処理方法 |
| JPS6252949A (ja) * | 1985-08-30 | 1987-03-07 | Nec Corp | 積層型セラミツクパツケ−ジ |