JPH0312429U - - Google Patents

Info

Publication number
JPH0312429U
JPH0312429U JP1989072739U JP7273989U JPH0312429U JP H0312429 U JPH0312429 U JP H0312429U JP 1989072739 U JP1989072739 U JP 1989072739U JP 7273989 U JP7273989 U JP 7273989U JP H0312429 U JPH0312429 U JP H0312429U
Authority
JP
Japan
Prior art keywords
semiconductor chip
package
semiconductor
mounting
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989072739U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989072739U priority Critical patent/JPH0312429U/ja
Publication of JPH0312429U publication Critical patent/JPH0312429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例によるＦ−ＴＡＢ
実装を用いた半導体素子を示す断面図、第２図ａ
，ｂは従来のＦ−ＴＡＢ実装を用いた半導体素子
を示す断面図である。１……半導体チツプ、２…
…パツケージ、３……ＴＡＢリード、４……樹脂
材料、５……パツケージピン、６……パツケージ
フタ、７……冷却フイン、８……導電性樹脂、９
……パツケージフタの溝である。なお、図中同一
符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. テープを用いて半導体チツプの表面をパツケー
    ジに向けて実装する方法によつて上記半導体チツ
    プを実装した半導体素子において、上記半導体チ
    ツプを導電性樹脂によつてダイボンドする上記パ
    ツケージのふたに溝を設けたことを特徴とする半
    導体素子。
JP1989072739U 1989-06-21 1989-06-21 Pending JPH0312429U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989072739U JPH0312429U (ja) 1989-06-21 1989-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989072739U JPH0312429U (ja) 1989-06-21 1989-06-21

Publications (1)

Publication Number Publication Date
JPH0312429U true JPH0312429U (ja) 1991-02-07

Family

ID=31610943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989072739U Pending JPH0312429U (ja) 1989-06-21 1989-06-21

Country Status (1)

Country Link
JP (1) JPH0312429U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003052527A (ja) * 2001-08-08 2003-02-25 Sutooku:Kk 一対の授与品の保管方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003052527A (ja) * 2001-08-08 2003-02-25 Sutooku:Kk 一対の授与品の保管方法

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