JPH0249738Y2 - - Google Patents

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Publication number
JPH0249738Y2
JPH0249738Y2 JP1982013213U JP1321382U JPH0249738Y2 JP H0249738 Y2 JPH0249738 Y2 JP H0249738Y2 JP 1982013213 U JP1982013213 U JP 1982013213U JP 1321382 U JP1321382 U JP 1321382U JP H0249738 Y2 JPH0249738 Y2 JP H0249738Y2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring
wiring board
portions
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982013213U
Other languages
Japanese (ja)
Other versions
JPS58116274U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982013213U priority Critical patent/JPS58116274U/en
Publication of JPS58116274U publication Critical patent/JPS58116274U/en
Application granted granted Critical
Publication of JPH0249738Y2 publication Critical patent/JPH0249738Y2/ja
Granted legal-status Critical Current

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  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【考案の詳細な説明】 本考案は、プリント配線基板の相互の接続構造
に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure for interconnecting printed wiring boards.

第1図は先行技術の可撓性を有するプリント配
線基板1,6の接続構造を説明するための断面図
であり、第2図は第1図に示したプリント配線基
板1,6の接続構造を示す平面図である。プリン
ト配線基板1は、可撓性を有する電気絶縁材料か
ら成る一対のシート体2,4と、それらのシート
体2,4間に印刷された銅箔から成る配線部3と
から構成される。プリント配線基板6は、プリン
ト配線基板1と同様に、シート体8,10と配線
部9とから構成される。プリント配線基板1の接
続すべき部分では、一方のシート体4が予め除か
れ、はんだなどの熱融着性を有した導電性材料か
ら成る接続部材5が固着されている。プリント配
線基板6において、その接続部材5の対向する位
置には、はんだなどの接続部材7が配置されてい
る。それらのプリント配線基板1,6は、加熱ヒ
ータ11を備えたプレス機12によつて矢符13
の方向に押え板14を介して加熱圧着される。こ
れによつて接続部材5,7が溶融されて電気的接
続が行なわれ、加熱圧着が解除され、接続部材
5,7は再び固化し、プリント配線基板1,6は
固着される。
FIG. 1 is a sectional view for explaining the connection structure of the flexible printed wiring boards 1 and 6 according to the prior art, and FIG. 2 is the connection structure of the printed wiring boards 1 and 6 shown in FIG. 1. FIG. The printed wiring board 1 is composed of a pair of sheets 2 and 4 made of a flexible electrically insulating material, and a wiring section 3 made of copper foil printed between the sheets 2 and 4. Like the printed wiring board 1, the printed wiring board 6 is composed of sheet bodies 8, 10 and a wiring section 9. At the portion of the printed wiring board 1 to be connected, one of the sheet members 4 is removed in advance, and a connecting member 5 made of a conductive material having heat-sealing properties such as solder is fixed thereto. In the printed wiring board 6, a connecting member 7 such as solder is arranged at a position facing the connecting member 5. Those printed wiring boards 1 and 6 are heated at arrow 13 by a press machine 12 equipped with a heater 11.
It is heated and pressed in the direction of , via the presser plate 14 . As a result, the connecting members 5, 7 are melted to establish an electrical connection, the heat and pressure bonding is released, the connecting members 5, 7 are solidified again, and the printed wiring boards 1, 6 are fixed.

第3図は第2図の切断面線−から見た断面
図であり、第4図は第3図の切断面線−から
見た断面図である。第2図および第4図に示す配
線部3aと配線部3bとを合わせて参照符3を付
し、配線部9aと配線部9bとを合わせて参照符
9を付す。プリント配線基板1の配線部3aとプ
リント配線基板6の配線部9aとは、前記加熱圧
着されることによつて接続され、接続部15aが
形成される。その加熱圧着の際には、加熱ヒータ
11の熱を効率よく接続部材5,7に伝達するた
めに、圧着圧力は高くされる。したがつて第2図
および第4図に示すように、溶融された接続部材
5,7は、接続部材5,7の存在する接続すべき
部分から配線部3,9の延在方向に対して左右に
流出して固化され、プリント配線基板1のシート
体2の表面に橋架部分16が形成される。このよ
うに配線部3aと配線部3bとが近接して設けら
れているときには、これらの配線部3a,3b,
9a,9bは全て接続されてしまう恐れがある。
またプリント配線基板1とプリント配線基板6と
がそのプリント配線基板1の配線部3a,3bの
直角方向(第2図上下方向)にずれて配置された
場合には、配線部9aは配線部3aと配線部3b
とに接続されるか、または配線部9bは配線部3
aと配線部3bとに接続される恐れがある。
3 is a sectional view taken along the section line - in FIG. 2, and FIG. 4 is a sectional view taken along the section line - in FIG. 3. The wiring portion 3a and the wiring portion 3b shown in FIGS. 2 and 4 are collectively designated by the reference numeral 3, and the wiring portion 9a and the wiring portion 9b are collectively designated by the reference numeral 9. The wiring portion 3a of the printed wiring board 1 and the wiring portion 9a of the printed wiring board 6 are connected by the above-mentioned heat and pressure bonding, thereby forming a connecting portion 15a. During the heat compression bonding, the compression pressure is increased in order to efficiently transfer the heat from the heater 11 to the connecting members 5 and 7. Therefore, as shown in FIGS. 2 and 4, the molten connection members 5, 7 are spread from the portions of the connection members 5, 7 that are to be connected in the direction in which the wiring portions 3, 9 extend. It flows out to the left and right and is solidified, forming a bridge portion 16 on the surface of the sheet body 2 of the printed wiring board 1. When the wiring portion 3a and the wiring portion 3b are provided close to each other in this way, these wiring portions 3a, 3b,
9a and 9b may all be connected.
Further, when the printed wiring board 1 and the printed wiring board 6 are disposed so as to be shifted in the direction perpendicular to the wiring parts 3a and 3b of the printed wiring board 1 (in the vertical direction in FIG. 2), the wiring part 9a is shifted from the wiring part 3a. and wiring part 3b
or the wiring part 9b is connected to the wiring part 3.
There is a possibility that it may be connected to the wiring part 3b.

さらに、第3図の構造では、プリント配線基板
1,6に曲げ応力が加わると、その力が接続部1
5aの両端部(接続部材5,7とシート体4,1
0との境界部)付近に集中し、接続部15aに剥
離等が生じ易く、接続の信頼性が低いという問題
があつた。
Furthermore, in the structure shown in FIG. 3, when bending stress is applied to the printed wiring boards 1 and 6, the force is
Both ends of 5a (connecting members 5, 7 and sheet bodies 4, 1
There was a problem that the connection was concentrated in the vicinity of the boundary with 0), and peeling was likely to occur at the connection portion 15a, resulting in low connection reliability.

本考案の目的は、このような先行技術の問題点
を解決し、プリント配線基板の相互の配線部の接
続作業時において、橋架部分の発生による隣接す
る配線部が短絡するような誤接続を防止し、作業
性を向上するとともに、外部応力が集中的に作用
して接続部が剥離等を起こすのを防止し、接続の
信頼性を向上するプリント配線基板の接続構造を
提供することである。
The purpose of the present invention is to solve the problems of the prior art and to prevent erroneous connections such as short-circuiting of adjacent wiring parts due to the formation of bridge parts when connecting wiring parts of printed wiring boards to each other. It is an object of the present invention to provide a connection structure for a printed wiring board, which improves workability, prevents peeling of a connection part due to concentrated external stress, and improves connection reliability.

本考案は、第1のプリント配線基板の配線部の
露出部分と、 第2のプリント配線基板の配線部の露出部分と
が、 熱融着性を有した導電材料から成る接続部材を
介して熱融着より接続されるプリント配線基板の
接続構造であつて、 前記第2のプリント配線基板の配線部の幅は、
前記第1のプリント配線基板の配線部の幅よりも
大きく形成さ、 前記配線部の露出部分にはその全面に予め前記
接続部材が固着され、前記両配線部は前記露出部
分が該両配線部の延在方向に対して離間する方向
にずれた状態で熱融着により接続されることを特
徴とするプリント配線基板の接続構造である。
In the present invention, the exposed portion of the wiring portion of the first printed wiring board and the exposed portion of the wiring portion of the second printed wiring board are heated via a connecting member made of a conductive material having thermal fusion properties. A connection structure of printed wiring boards connected by fusion bonding, wherein the width of the wiring part of the second printed wiring board is:
The connecting member is fixed in advance to the entire surface of the exposed portion of the wiring portion, and the exposed portion of the wiring portion is formed to be larger than the width of the wiring portion of the first printed wiring board. This is a printed wiring board connection structure characterized in that the printed wiring boards are connected by heat fusion in a state where they are shifted in a direction away from the extending direction of the printed wiring boards.

第5図は、本考案の一実施例の可撓性を有す
る。第1のプリント配線基板18と、第2のプリ
ント配線基板17との接続構造を説明するための
断面図である。第6図は、第5図に示したプリン
ト配線基板17,18の接続構造を示す平面図で
ある。第2のプリント配線基板17は、可撓性を
有する電気絶縁材料から成る一対のシート体1
9,21と、それらのシート体19,21間に印
刷されて形成された銅箔などの導電性材料から成
る第2の配線部20とから構成される。第2のプ
リント配線基板17の配線部20の接続すべき部
分では、配線部20を保護している一方のシート
体21が予め除かれ、このシート体21が除かれ
た第2配線部20の露出部分には接続部材22が
固着されている。その接続部材22は、熱融着性
を有した導電性材料から成り、たとえばはんだか
ら形成されている。
FIG. 5 shows the flexibility of one embodiment of the present invention. 3 is a cross-sectional view for explaining a connection structure between a first printed wiring board 18 and a second printed wiring board 17. FIG. FIG. 6 is a plan view showing the connection structure of printed wiring boards 17 and 18 shown in FIG. 5. The second printed wiring board 17 includes a pair of sheet bodies 1 made of a flexible electrically insulating material.
9 and 21, and a second wiring section 20 made of a conductive material such as copper foil and printed between the sheets 19 and 21. At the part where the wiring part 20 of the second printed wiring board 17 is to be connected, one sheet body 21 protecting the wiring part 20 is removed in advance, and the second wiring part 20 from which this sheet body 21 is removed is A connecting member 22 is fixed to the exposed portion. The connecting member 22 is made of an electrically conductive material having heat-sealing properties, such as solder.

第1のプリント配線基板18は、第2のプリン
ト配線基板17と同様に、シート体23と第1の
シート体25とを含み、プリント配線基板18の
接続すべき部分には接続部材26が固着されてい
る。第2のプリント配線基板17の第2の配線部
20の幅W2は第1のプリント配線基板18の第
1の配線部24の幅W1に比べて大きく形成され
ている。また、第2のプリント配線基板17の接
続部材22と第1のプリント配線基板18の接続
部材26とは、配線部20,24の延在方向(第
5図の左右方向)に対して離間する方向に間隔D
ずらせた位置に対向して配置されている。それら
のプリント配線基板17とプリント配線基板18
とは、加熱ヒータ11を備えたプレス機12によ
つて矢符13の方向に押え板14を介して加熱圧
着される。これによつてプリント配線基板17と
プリント配線基板18とが固着される。その加熱
圧着のときに、第5図に示すように、第2の配線
部20の幅W2が第1の配線部24の幅W1よりも
大きく形成された第2のプリント配線基板17
は、第1のプリント配線基板18の下方(第5図
の下方)に配置される。
Like the second printed wiring board 17, the first printed wiring board 18 includes a sheet body 23 and a first sheet body 25, and a connecting member 26 is fixed to a portion of the printed wiring board 18 to be connected. has been done. The width W2 of the second wiring section 20 of the second printed wiring board 17 is formed larger than the width W1 of the first wiring section 24 of the first printed wiring board 18. Further, the connecting member 22 of the second printed wiring board 17 and the connecting member 26 of the first printed wiring board 18 are spaced apart from each other with respect to the extending direction of the wiring portions 20 and 24 (the left-right direction in FIG. 5). distance D in the direction
They are placed opposite each other in a shifted position. Those printed wiring boards 17 and printed wiring boards 18
is heated and pressed in the direction of arrow 13 via a presser plate 14 by a press machine 12 equipped with a heater 11 . As a result, printed wiring board 17 and printed wiring board 18 are fixedly attached. At the time of the heat compression bonding, as shown in FIG.
is arranged below the first printed wiring board 18 (lower side in FIG. 5).

第7図は第6図の切断面線−から見た断面
図であり、第8図は第7図の切断面線−から
見た断面図である。第6図および第8図に示す配
線部20aと配線部20bとを合わせて参照符2
0を付し、配線部24aと配線部24bとを合わ
せて参照符24を付す。前記加熱圧着の際に、加
熱ヒータ11の熱を接続部材22,26に効率よ
く伝達するために、圧着圧力は高くされる。前述
のように、接続部材22と接続部材26とは間隔
Dを有して設けられ、かつ下方に配置された第2
のプリント配線基板17の第2の配線部20の幅
W2が大きく形成されている。このことによつて
加熱圧着の際に、接続部材22,26は溶融され
るけれども、溶融された接続部材22,26は配
線部20,24の延在方向に流れて前記間隔Dの
部分で吸収されるため、先行技術のように接続す
べき部分から配線部20,24の延在方向に対し
て左右に流出することはない。これによつて第2
の配線部20bは接続部27bを介して第1の配
線部24aと電気的に接続され、第2の配線部2
0bは接続部27bを介して第1の配線部24b
と電気的に接続される。
7 is a sectional view taken along the cutting plane line - of FIG. 6, and FIG. 8 is a sectional view taken from the cutting plane line - of FIG. The wiring portion 20a and the wiring portion 20b shown in FIGS. 6 and 8 are collectively referred to as 2.
0, and the wiring portion 24a and the wiring portion 24b are collectively referred to as a reference numeral 24. In order to efficiently transfer the heat from the heater 11 to the connecting members 22 and 26 during the heat compression bonding, the compression pressure is increased. As described above, the connection member 22 and the connection member 26 are provided with a distance D between them, and the second
The width of the second wiring section 20 of the printed wiring board 17 of
W2 is formed large. As a result, although the connecting members 22 and 26 are melted during heat and pressure bonding, the melted connecting members 22 and 26 flow in the extending direction of the wiring portions 20 and 24 and are absorbed in the space D. Therefore, unlike the prior art, the wires do not flow out from the portions to be connected to the left and right with respect to the extending direction of the wiring portions 20 and 24. This results in the second
The wiring section 20b is electrically connected to the first wiring section 24a via the connecting section 27b, and the second wiring section 20b is
0b is connected to the first wiring section 24b via the connection section 27b.
electrically connected to.

また加熱圧着の際に、第2のプリント配線基板
17の第2の配線部20a,20bの幅W2の範
囲内であれば、第1のプリント配線基板18の配
線部24a,24bが第2の配線部20a,20
bの幅方向(第6図上下方向)に少しずれて配置
されても、前述のように第2の配線部20a,2
0bの幅W2が第1の配線部24a,24bの幅
W1よりも大きく形成されているので、配線部2
4a,24bの幅W1を配線部20a,20bの
幅W2と同一にした場合より、さらに誤接続は起
こりにくい。
Further, during heat-press bonding, if the width W2 of the second wiring portions 20a, 20b of the second printed wiring board 17 is within the range, the wiring portions 24a, 24b of the first printed wiring board 18 are connected to the second wiring portions 24a, 24b of the second printed wiring board 17. Wiring parts 20a, 20
Even if the second wiring portions 20a, 2
The width W2 of 0b is the width of the first wiring portions 24a, 24b
Since it is formed larger than W1, the wiring part 2
Misconnections are even less likely to occur than when the width W1 of the wiring portions 4a, 24b is made the same as the width W2 of the wiring portions 20a, 20b.

さらに、第7図の構造では、接続部27aの長
さは、配線部20,24の対向接合面の長さAだ
けでなく、さらに、2・Dであるので(すなわ
ち、A+2・D)、プリント配線基板17,18
に矢符28で示す曲げ応力が加わつても、その力
が接続部27aの前記間隔Dの部分にも分散して
作用するため、接続部27aの剥離等も起こりに
くい。
Furthermore, in the structure shown in FIG. 7, the length of the connecting portion 27a is not only the length A of the opposing bonding surfaces of the wiring portions 20 and 24, but also 2·D (that is, A+2·D). Printed wiring board 17, 18
Even if a bending stress indicated by an arrow 28 is applied to the connecting portion 27a, the force is distributed and acts on the portion of the connecting portion 27a at the distance D, so that peeling of the connecting portion 27a is less likely to occur.

このように第2の配線部20aおよび第1の配
線部24aの接続、ならびに第2の配線部20b
および第1の配線部24bの接続の信頼性が向上
する。
In this way, the connection between the second wiring section 20a and the first wiring section 24a, and the connection between the second wiring section 20b
Also, the reliability of the connection of the first wiring portion 24b is improved.

また第7図のように、配線部20,24との対
向接合面の長さAを一定とした場合には、前記間
隔Dを大きくとつた構成の方が、間隔Dを小さく
した構成に比べて、接続部27aおよび接続部2
7bで、接続部材22,26に充分多くのはんだ
を用いることができるので、プリント配線基板1
7およびプリント配線基板18の接着強度は大き
くなる。
Further, as shown in FIG. 7, when the length A of the opposing joint surfaces with the wiring portions 20 and 24 is constant, the configuration in which the distance D is larger is better than the configuration in which the distance D is smaller. Connecting portion 27a and connecting portion 2
7b, since a sufficient amount of solder can be used for the connecting members 22 and 26, the printed wiring board 1
7 and the printed wiring board 18 become stronger.

上述の実施例では、可撓性を有するプリント配
線基板17と可撓性を有するプリント配線基板1
8との接続について述べたけれども、本考案の他
の実施例として可撓性を有するプリント配線基板
と剛性のプリント配線基板との接続についても、
本考案を実施することは可能である。
In the above embodiment, the flexible printed wiring board 17 and the flexible printed wiring board 1
Although the connection with 8 has been described, as another embodiment of the present invention, the connection between a flexible printed wiring board and a rigid printed wiring board is also described.
It is possible to implement the invention.

以上のように本考案によれば、各配線部のパタ
ーン幅を変えるとともに、配線部の露出部分の全
面に予め接続部材が固着され、露出部分が配線の
延在方向に互いにずれた状態で熱融着により接続
されることによつて、接続部材をたとえば第7図
のように(A+2・D)にわたつて長くして、基
板に作用する曲げ応力等に対する配線部の接続強
度を充分な強度に保ち、かつ熱融着時に接続部材
が隣接する接続部に橋架され配線が短絡するの
を、接続部材の溶融時の露出部分全面にわたる張
力の作用により、溶融した接続部材を前記ずれ部
で、たとえば第7図の参照符29,30で示すよ
うに盛り上がることによつて、また第8図ように
配線部24a,24bの参照符31,32で示す
ように側方にまで、溶融した接続部材が回り込む
ことによつて、吸収して防止することを要旨とす
るものであり、したがつて、先行技術のような接
続部材の橋架部分による誤接続が防止され、プリ
ント配線基板の相互の配線部を接続する作業の作
業性が向上するとともに、配線部の接続の信頼性
が向上することができる。
As described above, according to the present invention, in addition to changing the pattern width of each wiring part, the connecting member is fixed in advance to the entire surface of the exposed part of the wiring part, and the exposed parts are heated while being shifted from each other in the extending direction of the wiring. By connecting by fusion bonding, the connecting member can be lengthened, for example, by (A+2・D) as shown in Fig. 7, and the connection strength of the wiring part can be made strong enough to withstand bending stress, etc. that acts on the board. In order to prevent the connecting member from bridging the adjacent connecting portion and short-circuiting the wiring during heat fusion, the melted connecting member is applied to the entire exposed portion of the connecting member at the misaligned portion. For example, the connection member melts by swelling as shown by reference marks 29 and 30 in FIG. The main purpose of this technology is to absorb and prevent erroneous connections caused by the bridge portion of the connecting member as in the prior art, and prevent the mutual wiring portions of the printed wiring board from occurring. It is possible to improve the workability of connecting the wires and to improve the reliability of the connection of the wiring portions.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は先航技術の可撓性を有するプリント配
線基板1,6の接続構造を説明するための断面
図、第2図は第1図に示したプリント配線基板
1,6の接続構造を示す平面図、第3図は第2図
の切断面線−から見た断面図、第4図は第3
図の切断面線−から見た断面図、第5図は本
考案の一実施例の可撓性を有する配線基板17,
18の接続構造を説明するための断面図、第6図
は第5図に示したプリント配線基板17,18の
接続構造を示す平面図、第7図は第6図の切断面
線−から見た断面図、第8図は第7図の切断
面線−から見た断面図である。 11……ヒータ、12……プレス機、17,1
8……プリント配線基板、19,21,23,2
5……シート体、20,24……配線部、22,
26……接続部材、27a,27b……接続部、
W1,W2……配線部の幅、D……間隔。
Fig. 1 is a cross-sectional view for explaining the connection structure of the printed wiring boards 1 and 6 having the flexibility of advanced technology, and Fig. 2 shows the connection structure of the printed wiring boards 1 and 6 shown in Fig. 1. 3 is a sectional view taken from the cutting plane line - in FIG. 2, and FIG.
FIG. 5 is a sectional view taken from the cutting plane line - in the figure, and FIG. 5 shows a flexible wiring board 17 according to an embodiment of the present invention
6 is a plan view showing the connection structure of printed wiring boards 17 and 18 shown in FIG. 5, and FIG. FIG. 8 is a sectional view taken along the section line - in FIG. 7. 11...Heater, 12...Press machine, 17,1
8...Printed wiring board, 19, 21, 23, 2
5... Sheet body, 20, 24... Wiring part, 22,
26... Connection member, 27a, 27b... Connection part,
W1, W2... Width of wiring section, D... Spacing.

Claims (1)

【実用新案登録請求の範囲】 第1のプリント配線基板の配線部の露出部分
と、 第2のプリント配線基板の配線部の露出部分と
が、 熱融着性を有した導電材料から成る接続部材を
介して熱融着により接続されるプリント配線基板
の接続構造であつて、 前記第2のプリント配線基板の配線部の幅は、
前記第1のプリント配線基板の配線部の幅よりも
大きく形成され、 前記両配線部の露出部分にはその全面に予め前
記接続部材が固着され、前記両配線部は前記露出
部分が該両配線部の延在方向に対して離間する方
向にずれた状態で熱融着により接続されることを
特徴とするプリント配線基板の接続構造。
[Claims for Utility Model Registration] A connecting member in which the exposed portion of the wiring portion of the first printed wiring board and the exposed portion of the wiring portion of the second printed wiring board are made of a conductive material having thermal fusion properties. A connection structure of printed wiring boards connected by heat fusion through a wiring board, wherein the width of the wiring part of the second printed wiring board is:
The connecting member is fixed in advance to the entire surface of the exposed portions of both wiring portions, and the exposed portions of both wiring portions are formed to be larger than the width of the wiring portions of the first printed wiring board. A connection structure for a printed wiring board, characterized in that the connection is made by heat fusion in a state where the parts are shifted in a direction in which they are separated from each other with respect to the extending direction of the parts.
JP1982013213U 1982-02-01 1982-02-01 Connection structure of printed wiring board Granted JPS58116274U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982013213U JPS58116274U (en) 1982-02-01 1982-02-01 Connection structure of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982013213U JPS58116274U (en) 1982-02-01 1982-02-01 Connection structure of printed wiring board

Publications (2)

Publication Number Publication Date
JPS58116274U JPS58116274U (en) 1983-08-08
JPH0249738Y2 true JPH0249738Y2 (en) 1990-12-27

Family

ID=30025738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982013213U Granted JPS58116274U (en) 1982-02-01 1982-02-01 Connection structure of printed wiring board

Country Status (1)

Country Link
JP (1) JPS58116274U (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51107666U (en) * 1975-02-27 1976-08-27

Also Published As

Publication number Publication date
JPS58116274U (en) 1983-08-08

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