JPH0642368Y2 - Wiring board joint protection structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a joint protection structure for preventing a joint of a flexible wiring board from being separated from other wiring.

[Conventional technology]

A conventional flexible wiring board such as an FPC (flexible printed circuit) is as shown by reference numeral 1 in FIG.
Multiple adjacent soldering patterns (joint patterns) 1a
These soldering patterns are made to face the same number of soldering patterns 2a on the hard substrate 2 and are joined by soldering. As shown in FIG. 2 (b), soldering is performed with the tip of the soldering pattern 1 a sandwiched between the base material 4 and the coverlay (covering material) 5 and the soldering pattern 2 a on the hard substrate 2. It is performed at the position H between.

The joint portion H thus soldered and joined has a weak mechanical strength, and in particular, it is easily peeled off when a clockwise force is applied to the FPC 1 in FIG. For this reason, some kind of reinforcing means is required for the joint H, and conventionally, the following method has been used as this reinforcing means. For example, there is a method of arranging another electronic component right above the FPC1 near the junction H, but this may not be possible depending on the circuit layout. There is also a method of covering the joint portion H with an adhesive, but it takes time and labor, and workability is poor. There is also a method of screwing both widthwise end portions of the FPC 1 via another overhanging member, but this may force the soldering pattern 1a in the vicinity of the screwing portion to be deformed and damaged. There is also a method of adhering the adhesive tape over the hard substrate 2 from above the FPC 1, but the adhesive strength in the area-to-area ratio is insufficient, and the adhesive tape is deteriorated, and the strength tends to be further insufficient.

It is also possible to increase the width of the soldering pattern 1a in order to increase the bonding strength without using such a reinforcing means, but this increases the size of the FPC 1 and the hard substrate 2. Further, if an attempt is made to increase the strength by increasing the amount of solder, the solder may flow adjacently and short-circuit with the adjacent soldering pattern 1a. In particular, when the width of the soldering pattern 1a and the space between adjacent soldering patterns are reduced to reduce the size of the board, there is a problem that the amount of solder is reduced and the strength is further insufficient.

In addition, such joints have dense patterns, so when shorting both ends of the joint, the through holes
Must be wired on both sides.

〔Purpose〕

Therefore, in the present invention, by using the reinforcing means that protects the joining pattern and also serves as a jumper wire, workability is not deteriorated and the joining strength of the joining portion of the FPC1 is sufficiently reinforced without applying excessive force, Moreover, it is intended to simplify the wiring.

〔Constitution〕

In order to achieve the above object, the present invention comprises a flexible wiring board having a plurality of adjacent bonding patterns, a second wiring board having a bonding pattern that is bonded to face the bonding pattern, and The flexible wiring board is interposed between the wiring board and the second wiring board, and both ends of the flexible wiring board are joined to the other wiring pattern of the second wiring board to short-circuit the other wiring pattern.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a first embodiment of a joint protection structure according to the present invention.

In FIG. 1 (a), 10 is an FPC (flexible wiring board), and this FPC 10 has a plurality of soldering patterns (joint patterns) 10a adjacent to each other, and each of these soldering patterns 10a is It communicates with the wiring 10b. FP
As shown in FIG. 1 (b), the soldering pattern 10a and the wiring 10 of C10 are sandwiched between a base material 12 and a covering material (coverlay) 13 which are two flexible plastic films. The soldering pattern 10a and the wiring 10b are made of copper foil having a thickness of about 35 μm.
For this reason, the FPC 10 is highly flexible as a whole.

15 is a rigid substrate provided in a fixed manner (second non-flexible substrate)
Wiring board), and the hard board 15 has a plurality of soldering patterns (joint patterns) adjacent to each other on its surface.
15a, and these soldering patterns 15a also communicate with the respective wirings 15b formed on the surface of the hard substrate 15.

As shown in FIG. 1 (b), since the covering material 13 of the FPC 10 is shorter than the soldering pattern 10a, the soldering pattern 10a
The lower surface of the tip of the soldering pattern 10a is exposed to the outside, and the exposed lower surface of the tip of the soldering pattern 10a faces the soldering pattern 15a of the hard board 15 and is soldered and joined by the solder H between them. There is.

Solder pattern 15a, wiring 15b on the surface of the hard substrate 15
Other wirings 17 and 18 are formed on both sides of the wiring, and the left ends of these wirings 17 and 18 in the figure are connected to terminals 20 and 21 that have a predetermined height and are firmly fixed to the hard substrate 15. There is. Terminal
Between 20 and 21, a jumper wire (regulating member) 23 having a predetermined thickness and rigidity and formed of a conductive material is bridged between the FPC 10 and the hard substrate 15. The jumper wire 23 is for connecting the wirings 17 and 18, and thus, by interposing the FPC 10 with respect to the hard substrate 15, the soldering pattern 15a, the wiring 15b, or the soldering pattern 10a can be short-circuited. Is being prevented. Base material of FPC10
This is because 12 is formed of an insulating material. Incidentally, conventionally, as shown in FIG. 2, a jumper wire 8 for connecting the wiring terminals 6 and 7 on both sides of the soldering pattern 2a of the hard substrate 2 is used.
Was configured to pass through the back side of the hard substrate 2 so as not to short-circuit with the soldering pattern 2a and its wiring.

In the protective structure for the joint portion according to the first embodiment as described above, the tip of the soldering pattern 10a of the FPC 10 is soldered to the soldering pattern 15a of the hard substrate 15 and further pressed onto the FPC 10. Since the jumper wire 23 having a predetermined thickness and rigidity is provided as described above, even if the FPC 10 is pulled away from the hard substrate 15, the jumper wire 23
It is possible to reliably prevent the soldering pattern 10a of the FPC 10 from being separated from the soldering pattern 15a of the hard substrate 15 by being regulated by. Further, since the jumper wire 23 has a predetermined thickness and rigidity, it can press the FPC 10 with a uniform force in the width direction, and an unreasonable force is not applied to the soldering pattern 10a. Furthermore, by using the jumper wire 23 as a regulating member, the degree of freedom in pattern circuit design can be improved.

In addition, in the above-mentioned embodiment, the case where the FPC 10 is joined by soldering has been described, but a flexible wiring board such as a so-called anisotropic conductive tape that energizes only in one direction and in a specific range is a hard substrate. The present invention may be used when joining on top.

Further, although the second wiring board is described as a hard board in the above embodiment, the present invention is not limited to this, and the second wiring board may be a flexible wiring board.

[Effect of device]

As described above, according to the present invention, since the regulating member short-circuits the pattern of the second wiring board at both ends of the joining pattern, the wiring of the second wiring board is simplified and the flexible wiring board is formed. The joint pattern can prevent the second wiring board from being separated from the joint pattern by the restricting member,
The joint strength of those joints can be sufficiently reinforced.

[Brief description of drawings]

FIG. 1 is a view showing a first embodiment of a joint protection structure according to the present invention. FIG. 1 (a) is a plan view thereof, FIG. 1 (b) is a side sectional view thereof, and FIG. It is a figure which shows the conventional protective structure of a junction part, FIG.2 (a) is the top view, FIG.
FIG. 1B is a side sectional view thereof. 10 ... FPC (flexible wiring board) 10a, 15a ... Soldering pattern (joint pattern) 10b, 15b, 17, 18 ... Wiring 12 ... Base material 13 ... Coating material 15 ... Hard board (second wiring board) 15c … Grooves 20, 21… Terminals 23… Jumper wires (restriction member)

Continuation of the front page (56) References Open 60-964 (JP, U) Open 60-63976 (JP, U) Open 60-179063 (JP, U) Open 61-201364 (JP) , U) Actually open 62-101263 (JP, U) Actually open 62-107478 (JP, U)

Claims (1)

[Scope of utility model registration request] 1. A flexible wiring board having a plurality of adjacent bonding patterns, a second wiring board having a bonding pattern bonded to face the bonding pattern, and the flexible wiring board interposed therebetween. And a regulating member that is joined to the other wiring pattern of the second wiring board at both ends and short-circuits the other wiring pattern.