JPH0252464U - - Google Patents
Info
- Publication number
- JPH0252464U JPH0252464U JP13210388U JP13210388U JPH0252464U JP H0252464 U JPH0252464 U JP H0252464U JP 13210388 U JP13210388 U JP 13210388U JP 13210388 U JP13210388 U JP 13210388U JP H0252464 U JPH0252464 U JP H0252464U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light
- lead frame
- lens
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Description
第１図は本考案に係る発光ダイオードを示す正
面図であり、第２図は第１図の要部を示す側面図
である。第３図は従来の発光ダイオードを示す正
面図である。
１０……ＬＥＤ；１２，１３……リードフレー
ム；１４……ＬＥＤチツプ；１５……金線；１６
……レンズ；１７，１８……放熱管。
FIG. 1 is a front view showing a light emitting diode according to the present invention, and FIG. 2 is a side view showing the main parts of FIG. FIG. 3 is a front view of a conventional light emitting diode. 10... LED; 12, 13... Lead frame; 14... LED chip; 15... Gold wire; 16
... Lens; 17, 18 ... Heat sink.
Claims (1)
ードフレームと、該リードフレームの少なくとも
１本の上端面に取り付けられ且つ他のリードフレ
ームに対してワイヤボンデイングされている発光
ダイオードチツプと、該発光ダイオードチツプ及
びリードフレームの上部領域を覆うように透明樹
脂モールドにより成形されたレンズとから成る発
光ダイオードにおいて、 上記各リードフレームのレンズから露出した下
方部分に、金属製の放熱管を取り付けたことを特
徴とする発光ダイオード。[Claims for Utility Model Registration] At least two lead frames arranged substantially in parallel, and attached to the upper end surface of at least one of the lead frames and wire bonded to the other lead frame. In a light-emitting diode consisting of a light-emitting diode chip and a lens molded with a transparent resin to cover the upper region of the light-emitting diode chip and lead frame, the lower portion exposed from the lens of each lead frame is provided with a metal A light emitting diode characterized by being equipped with a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13210388U JPH0252464U (en) | 1988-10-09 | 1988-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13210388U JPH0252464U (en) | 1988-10-09 | 1988-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252464U true JPH0252464U (en) | 1990-04-16 |
Family
ID=31388762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13210388U Pending JPH0252464U (en) | 1988-10-09 | 1988-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252464U (en) |
-
1988
- 1988-10-09 JP JP13210388U patent/JPH0252464U/ja active Pending