JPH0252465U - - Google Patents
Info
- Publication number
- JPH0252465U JPH0252465U JP13210488U JP13210488U JPH0252465U JP H0252465 U JPH0252465 U JP H0252465U JP 13210488 U JP13210488 U JP 13210488U JP 13210488 U JP13210488 U JP 13210488U JP H0252465 U JPH0252465 U JP H0252465U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- lead frame
- lens
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Description
第１図は本考案に係る発光ダイオードを示す正
面図である。第２図は従来の発光ダイオードを示
す正面図である。
１０……ＬＥＤ；１２，１３……リードフレー
ム；１４……ＬＥＤチツプ；１４ａ……接合部；
１６……レンズ；１７，１８……放熱部。
FIG. 1 is a front view showing a light emitting diode according to the present invention. FIG. 2 is a front view of a conventional light emitting diode. 10...LED; 12, 13...lead frame; 14...LED chip; 14a...junction;
16... Lens; 17, 18... Heat dissipation section.
Claims (1)
ードフレームと、該リードフレームの少なくとも
１本の上端面に取り付けられ且つ他のリードフレ
ームに対してワイヤボンデイングされている発光
ダイオードチツプと、該発光ダイオードチツプ及
びリードフレームの上部領域を覆うように透明樹
脂モールドにより成形されたレンズとから成る発
光ダイオードにおいて、 上記各リードフレームのレンズから露出した下
方部分を幅広面に形成することにより、放熱部と
したことを特徴とする発光ダイオード。[Claims for Utility Model Registration] At least two lead frames arranged substantially in parallel, attached to the upper end surface of at least one of the lead frames and wire bonded to the other lead frame. In a light emitting diode consisting of a light emitting diode chip and a lens molded with a transparent resin to cover the upper area of the light emitting diode chip and lead frame, the lower portion of each lead frame exposed from the lens is formed into a wide surface. A light-emitting diode characterized in that it serves as a heat dissipation part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13210488U JPH0252465U (en) | 1988-10-09 | 1988-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13210488U JPH0252465U (en) | 1988-10-09 | 1988-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252465U true JPH0252465U (en) | 1990-04-16 |
Family
ID=31388764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13210488U Pending JPH0252465U (en) | 1988-10-09 | 1988-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252465U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117759B2 (en) * | 1977-11-28 | 1986-05-09 | Mitsubishi Electric Corp |
-
1988
- 1988-10-09 JP JP13210488U patent/JPH0252465U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117759B2 (en) * | 1977-11-28 | 1986-05-09 | Mitsubishi Electric Corp |