JPH0254773A - 無電解金合金めっき浴 - Google Patents

無電解金合金めっき浴

Info

Publication number: JPH0254773A
Authority: JP; Japan
Prior art keywords: gold; potassium; nickel; sodium; plating bath
Prior art date: 1988-08-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP20411488A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0341550B2 (de

Inventor

Kozo Ueki

植木　浩蔵

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Seiko Instruments Inc

Original Assignee

Seiko Instruments Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-08-17

Filing date

1988-08-17

Publication date

1990-02-23

1988-08-17 Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc

1988-08-17 Priority to JP20411488A priority Critical patent/JPH0254773A/ja

1990-02-23 Publication of JPH0254773A publication Critical patent/JPH0254773A/ja

1991-06-24 Publication of JPH0341550B2 publication Critical patent/JPH0341550B2/ja

Status Granted legal-status Critical Current

Links

238000007747 plating Methods 0.000 title claims abstract description 40
229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 17
239000003353 gold alloy Substances 0.000 title claims abstract description 17
PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 22
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 15
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 14
229910052737 gold Inorganic materials 0.000 claims abstract description 14
239000010931 gold Substances 0.000 claims abstract description 14
239000008139 complexing agent Substances 0.000 claims abstract description 10
SIGUVTURIMRFDD-UHFFFAOYSA-M sodium dioxidophosphanium Chemical compound [Na+].[O-][PH2]=O SIGUVTURIMRFDD-UHFFFAOYSA-M 0.000 claims abstract description 9
229910001379 sodium hypophosphite Inorganic materials 0.000 claims abstract description 9
239000003638 chemical reducing agent Substances 0.000 claims abstract description 7
LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims abstract description 6
NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims abstract description 6
229910021586 Nickel(II) chloride Inorganic materials 0.000 claims abstract description 5
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims abstract description 5
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims abstract description 5
KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims abstract description 5
229910000363 nickel(II) sulfate Inorganic materials 0.000 claims abstract description 5
238000007772 electroless plating Methods 0.000 claims abstract description 4
239000003002 pH adjusting agent Substances 0.000 claims abstract description 4
MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims abstract description 3
229940078494 nickel acetate Drugs 0.000 claims abstract description 3
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
229910052759 nickel Inorganic materials 0.000 claims description 9
229910052751 metal Inorganic materials 0.000 claims description 6
239000002184 metal Substances 0.000 claims description 6
SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims description 6
KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 claims description 4
BTAAXEFROUUDIL-UHFFFAOYSA-M potassium;sulfamate Chemical compound [K+].NS([O-])(=O)=O BTAAXEFROUUDIL-UHFFFAOYSA-M 0.000 claims description 4
239000001509 sodium citrate Substances 0.000 claims description 4
NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 4
QDWYPRSFEZRKDK-UHFFFAOYSA-M sodium;sulfamate Chemical compound [Na+].NS([O-])(=O)=O QDWYPRSFEZRKDK-UHFFFAOYSA-M 0.000 claims description 4
VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 3
IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 claims description 3
235000006408 oxalic acid Nutrition 0.000 claims description 3
235000011056 potassium acetate Nutrition 0.000 claims description 3
229960004109 potassium acetate Drugs 0.000 claims description 3
239000001508 potassium citrate Substances 0.000 claims description 3
229960002635 potassium citrate Drugs 0.000 claims description 3
QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 claims description 3
235000011082 potassium citrates Nutrition 0.000 claims description 3
229940093932 potassium hydroxide Drugs 0.000 claims description 3
239000001632 sodium acetate Substances 0.000 claims description 3
235000017281 sodium acetate Nutrition 0.000 claims description 3
229960004249 sodium acetate Drugs 0.000 claims description 3
229960001790 sodium citrate Drugs 0.000 claims description 3
229940083608 sodium hydroxide Drugs 0.000 claims description 3
ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 claims description 3
229940039790 sodium oxalate Drugs 0.000 claims description 3
-1 50-3 00g Substances 0.000 claims 1
ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 claims 1
239000011591 potassium Substances 0.000 claims 1
229960003975 potassium Drugs 0.000 claims 1
229910052700 potassium Inorganic materials 0.000 claims 1
OBITVHZFHDIQGH-UHFFFAOYSA-N [Au].[K]C#N Chemical compound [Au].[K]C#N OBITVHZFHDIQGH-UHFFFAOYSA-N 0.000 abstract description 5
239000000203 mixture Substances 0.000 description 4
229910001369 Brass Inorganic materials 0.000 description 3
244000175448 Citrus madurensis Species 0.000 description 3
235000017317 Fortunella Nutrition 0.000 description 3
239000010951 brass Substances 0.000 description 3
238000006073 displacement reaction Methods 0.000 description 3
238000001556 precipitation Methods 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 2
230000002378 acidificating effect Effects 0.000 description 1
238000005034 decoration Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
238000005303 weighing Methods 0.000 description 1

Landscapes

Chemically Coating (AREA)

JP20411488A 1988-08-17 1988-08-17 無電解金合金めっき浴 Granted JPH0254773A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP20411488A JPH0254773A (ja)	1988-08-17	1988-08-17	無電解金合金めっき浴

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP20411488A JPH0254773A (ja)	1988-08-17	1988-08-17	無電解金合金めっき浴

Publications (2)

Publication Number	Publication Date
JPH0254773A true JPH0254773A (ja)	1990-02-23
JPH0341550B2 JPH0341550B2 (de)	1991-06-24

Family

ID=16485043

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP20411488A Granted JPH0254773A (ja)	1988-08-17	1988-08-17	無電解金合金めっき浴

Country Status (1)

Country	Link
JP (1)	JPH0254773A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN115667589A (zh) *	2020-05-28	2023-01-31	宏维科技有限公司	电解镀镍表面改性剂和包含其的电解镀镍溶液
JP2025535792A (ja) *	2023-01-09	2025-10-28	西安熱工研究院有限公司	高導電性の耐高温酸化性コーティング、およびその製造方法

1988
- 1988-08-17 JP JP20411488A patent/JPH0254773A/ja active Granted

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN115667589A (zh) *	2020-05-28	2023-01-31	宏维科技有限公司	电解镀镍表面改性剂和包含其的电解镀镍溶液
JP2023528821A (ja) *	2020-05-28	2023-07-06	ワイエムティーカンパニーリミテッド	電解ニッケルめっき用表面改質剤及びそれを含むニッケル電気めっき溶液
JP2025535792A (ja) *	2023-01-09	2025-10-28	西安熱工研究院有限公司	高導電性の耐高温酸化性コーティング、およびその製造方法

Also Published As

Publication number	Publication date
JPH0341550B2 (de)	1991-06-24

Publication	Publication Date	Title
US4242180A (en)	1980-12-30	Ammonia free palladium electroplating bath using aminoacetic acid
US3032436A (en)	1962-05-01	Method and composition for plating by chemical reduction
JPS599189A (ja)	1984-01-18	パラジウムメツキ浴とメツキ層の形成方法
US3230098A (en)	1966-01-18	Immersion plating with noble metals
JPS62109991A (ja)	1987-05-21	電気めつき液
JP2611364B2 (ja)	1997-05-21	無電解錫めっき浴及び無電解錫めっき方法
JP3203247B2 (ja)	2001-08-27	有色被膜を有する装身具およびその製造方法
JPH049875B2 (de)	1992-02-21
JPS61157693A (ja)	1986-07-17	りん酸塩処理性に優れたＡｌ板
JPWO2000008233A1 (ja)	2001-10-09	有色被膜を有する装身具およびその製造方法
JPS591668A (ja)	1984-01-07	改良無電解金めつき浴及びめつき方法
JPH0254773A (ja)	1990-02-23	無電解金合金めっき浴
JPH0257153B2 (de)	1990-12-04
US3892638A (en)	1975-07-01	Electrolyte and method for electrodepositing rhodium-ruthenium alloys
JP2577832B2 (ja)	1997-02-05	白金電鋳浴
JPH0254774A (ja)	1990-02-23	無電解金合金めっき浴
JP3029948B2 (ja)	2000-04-10	Ｓｎ−Ｃｕ−Ｐｄ合金めっき部材、その製造に用いるめっき浴
JP2003096592A (ja)	2003-04-03	時計用外装部品
JP3208131B2 (ja)	2001-09-10	パラジウム／鉄合金メッキ液及びパラジウム合金メッキ基材
JP2560842B2 (ja)	1996-12-04	耐食性皮膜の製造方法
JP3074369B2 (ja)	2000-08-07	金合金メッキ液
JPH05509360A (ja)	1993-12-22	金析出のための安定性無電解水性酸性金浴及び該浴使用下での方法
JP2595168B2 (ja)	1997-03-26	時計の外装部品およびその製造方法
JPH05222543A (ja)	1993-08-31	白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
JPS59185774A (ja)	1984-10-22	硬質金合金被覆層の形成方法