JPH0341550B2 - - Google Patents

Info

Publication number: JPH0341550B2
Authority: JP; Japan
Prior art keywords: sodium; potassium; nickel; gold; plating bath
Prior art date: 1988-08-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP20411488A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0254773A (ja

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-08-17

Filing date

1988-08-17

Publication date

1991-06-24

1988-08-17 Application filed filed Critical

1988-08-17 Priority to JP20411488A priority Critical patent/JPH0254773A/ja

1990-02-23 Publication of JPH0254773A publication Critical patent/JPH0254773A/ja

1991-06-24 Publication of JPH0341550B2 publication Critical patent/JPH0341550B2/ja

Status Granted legal-status Critical Current

Links

238000007747 plating Methods 0.000 claims description 33
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
229910052737 gold Inorganic materials 0.000 claims description 16
239000010931 gold Substances 0.000 claims description 16
229910001020 Au alloy Inorganic materials 0.000 claims description 13
239000003353 gold alloy Substances 0.000 claims description 13
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
229910052759 nickel Inorganic materials 0.000 claims description 8
239000008139 complexing agent Substances 0.000 claims description 7
229910052751 metal Inorganic materials 0.000 claims description 7
239000002184 metal Substances 0.000 claims description 7
SIGUVTURIMRFDD-UHFFFAOYSA-M sodium dioxidophosphanium Chemical compound [Na+].[O-][PH2]=O SIGUVTURIMRFDD-UHFFFAOYSA-M 0.000 claims description 7
229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 7
SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims description 6
239000003638 chemical reducing agent Substances 0.000 claims description 5
LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 5
NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 5
229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 4
KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 claims description 4
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 4
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 4
KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 4
229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 4
BTAAXEFROUUDIL-UHFFFAOYSA-M potassium;sulfamate Chemical compound [K+].NS([O-])(=O)=O BTAAXEFROUUDIL-UHFFFAOYSA-M 0.000 claims description 4
239000001509 sodium citrate Substances 0.000 claims description 4
NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 4
QDWYPRSFEZRKDK-UHFFFAOYSA-M sodium;sulfamate Chemical compound [Na+].NS([O-])(=O)=O QDWYPRSFEZRKDK-UHFFFAOYSA-M 0.000 claims description 4
VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 3
MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims description 3
IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 claims description 3
238000007772 electroless plating Methods 0.000 claims description 3
229940078494 nickel acetate Drugs 0.000 claims description 3
235000006408 oxalic acid Nutrition 0.000 claims description 3
235000011056 potassium acetate Nutrition 0.000 claims description 3
229960004109 potassium acetate Drugs 0.000 claims description 3
239000001508 potassium citrate Substances 0.000 claims description 3
229960002635 potassium citrate Drugs 0.000 claims description 3
QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 claims description 3
235000011082 potassium citrates Nutrition 0.000 claims description 3
229940093932 potassium hydroxide Drugs 0.000 claims description 3
239000001632 sodium acetate Substances 0.000 claims description 3
235000017281 sodium acetate Nutrition 0.000 claims description 3
229960004249 sodium acetate Drugs 0.000 claims description 3
229960001790 sodium citrate Drugs 0.000 claims description 3
229940083608 sodium hydroxide Drugs 0.000 claims description 3
ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 claims description 3
229940039790 sodium oxalate Drugs 0.000 claims description 3
150000002739 metals Chemical class 0.000 claims 1
XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 claims 1
239000000203 mixture Substances 0.000 description 4
229910001369 Brass Inorganic materials 0.000 description 3
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
239000010951 brass Substances 0.000 description 3
229960003975 potassium Drugs 0.000 description 3
229910052700 potassium Inorganic materials 0.000 description 3
239000011591 potassium Substances 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 2
238000000151 deposition Methods 0.000 description 2
230000008021 deposition Effects 0.000 description 2
238000006073 displacement reaction Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000001556 precipitation Methods 0.000 description 2
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
OBITVHZFHDIQGH-UHFFFAOYSA-N [Au].[K]C#N Chemical compound [Au].[K]C#N OBITVHZFHDIQGH-UHFFFAOYSA-N 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
238000005034 decoration Methods 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1

Landscapes

Chemically Coating (AREA)

JP20411488A 1988-08-17 1988-08-17 無電解金合金めっき浴 Granted JPH0254773A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP20411488A JPH0254773A (ja)	1988-08-17	1988-08-17	無電解金合金めっき浴

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP20411488A JPH0254773A (ja)	1988-08-17	1988-08-17	無電解金合金めっき浴

Publications (2)

Publication Number	Publication Date
JPH0254773A JPH0254773A (ja)	1990-02-23
JPH0341550B2 true JPH0341550B2 (de)	1991-06-24

Family

ID=16485043

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP20411488A Granted JPH0254773A (ja)	1988-08-17	1988-08-17	無電解金合金めっき浴

Country Status (1)

Country	Link
JP (1)	JPH0254773A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR102345725B1 (ko) *	2020-05-28	2022-01-03	와이엠티 주식회사	전해 니켈 도금 표면개선제 및 이를 포함하는 전해 니켈 도금액
CN116005079A (zh) *	2023-01-09	2023-04-25	西安热工研究院有限公司	一种高导电性能的抗高温氧化涂层及其制备方法

1988
- 1988-08-17 JP JP20411488A patent/JPH0254773A/ja active Granted

Also Published As

Publication number	Publication date
JPH0254773A (ja)	1990-02-23

Publication	Publication Date	Title
US4242180A (en)	1980-12-30	Ammonia free palladium electroplating bath using aminoacetic acid
JPH0230388B2 (de)	1990-07-05
CA1048964A (en)	1979-02-20	Gold plating solutions and method
JPS62109991A (ja)	1987-05-21	電気めつき液
US6020021A (en)	2000-02-01	Method for depositing electroless nickel phosphorus alloys
JP2611364B2 (ja)	1997-05-21	無電解錫めっき浴及び無電解錫めっき方法
KR100366248B1 (ko)	2002-12-31	유색 피막을 갖는 장신구 및 그 제조 방법
JPS648076B2 (de)	1989-02-13
JPH049875B2 (de)	1992-02-21
JPS63203790A (ja)	1988-08-23	シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴
JPS59143084A (ja)	1984-08-16	改良金硫化物めつき浴
JPH0270084A (ja)	1990-03-08	金めっき浴及び金めっき方法
JPH0341550B2 (de)	1991-06-24
US3892638A (en)	1975-07-01	Electrolyte and method for electrodepositing rhodium-ruthenium alloys
JPH0254774A (ja)	1990-02-23	無電解金合金めっき浴
JP2577832B2 (ja)	1997-02-05	白金電鋳浴
JPH0321637B2 (de)	1991-03-25
JP3029948B2 (ja)	2000-04-10	Ｓｎ−Ｃｕ−Ｐｄ合金めっき部材、その製造に用いるめっき浴
JP3208131B2 (ja)	2001-09-10	パラジウム／鉄合金メッキ液及びパラジウム合金メッキ基材
JP3101061B2 (ja)	2000-10-23	白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
JP2560842B2 (ja)	1996-12-04	耐食性皮膜の製造方法
JPS6353278B2 (de)	1988-10-21
US3562120A (en)	1971-02-09	Plating of smooth,semibright gold deposits
JPH06104902B2 (ja)	1994-12-21	無電解銅ニッケル合金めっき方法
JP7436071B1 (ja)	2024-02-21	非シアン真鍮めっき浴およびめっき方法