JPH0256473U - - Google Patents
Info
- Publication number
- JPH0256473U JPH0256473U JP13565288U JP13565288U JPH0256473U JP H0256473 U JPH0256473 U JP H0256473U JP 13565288 U JP13565288 U JP 13565288U JP 13565288 U JP13565288 U JP 13565288U JP H0256473 U JPH0256473 U JP H0256473U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- pressurized
- covered
- heated
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は、本考案の一実施例を示す縦断面図で
ある。第２図は、第１図の実施例の使用状態を示
す縦断面図である。 １……基板基礎材料、２……パツド、３……異
方性導電フイルム、４……被搭載部品。
ある。第２図は、第１図の実施例の使用状態を示
す縦断面図である。 １……基板基礎材料、２……パツド、３……異
方性導電フイルム、４……被搭載部品。
Claims (1)
- 表面実装部品を搭載するパツドおよび基板の基
体用材料の上面を、加圧、加熱されたとき導電性
となる加圧加熱接着型の異方性導電フイルムで覆
うことを特徴とするプリント配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13565288U JPH0256473U (ja) | 1988-10-18 | 1988-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13565288U JPH0256473U (ja) | 1988-10-18 | 1988-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256473U true JPH0256473U (ja) | 1990-04-24 |
Family
ID=31395471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13565288U Pending JPH0256473U (ja) | 1988-10-18 | 1988-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256473U (ja) |
-
1988
- 1988-10-18 JP JP13565288U patent/JPH0256473U/ja active Pending