JPH0256945A - Electronic parts mounting device - Google Patents

Abstract

PURPOSE:To precisely perform mounting on a board by reversing the inside and outside of a flip chip equipped to a chip supply part and mounting the flip chip on the board after a detected position discrepancy is corrected by a visual inspection device. CONSTITUTION:XY directional moving devices 8, 9 are driven to move a camera 17 upward of a board 4 and a position discrepancy of a printed is detected, pattern. When an suction part 27 of an edge part of an arm 26 approaches a wafer 5, a pin 7a projects to push up a flip chip F, the flip chip F is taken up by the suction part 27, and the inside and outside of the flip chip F is reversed by the arm 26 to take up. Next, a transfer head 6 is moved to a visual inspection device 21 to observe a position discrepancy of a previously detected xytheta-direction of the flip chip F and XY directional moving devices 8, 9 and a theta directional driving device 18 are controlled so that the xytheta-directional position discrepancy of a printed pattern of the board 4 can be corrected. Thereby mounting can precisely be performed on the board 4.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electronic component mounting apparatus, in which a flip chip is turned upside down, its positional deviation is corrected, and then the flip chip is transferred and mounted on a board. be.

(Conventional technology) As a type of electronic component, bumps (
Flip chips with protruding electrodes are known.

FIG. 4 shows a conventional means for mounting this type of flip chip on a substrate, in which a flip chip 102 is mounted on the bottom surface of a wafer 101 with the surface on which bumps 103 are formed facing up, and an operator can push it. Hold the stick 104 in your hand,
While visually checking the work point with the microscope 105, press the pin 106.
The chip 102 is pushed down and mounted on the substrate 107.

(Problems to be Solved by the Invention) However, since the above-mentioned conventional means is performed manually, there is a problem that mounting efficiency and mounting accuracy cannot be improved.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an apparatus that can automatically and accurately mount a flip chip mounted on a wafer or the like with the bump formation surface facing up onto a substrate.

(Means for Solving the Problems) To this end, the present invention provides a chip supply section equipped with a flip chip with the bump forming surface facing up, a front-back reversing device for ticking up the flip chip and reversing the flip chip,
There is a transfer head that adsorbs the non-bump-formed surface of the flipped flip chip, picks it up, and transfers and mounts it on the board. An electronic component mounting apparatus is composed of an appearance inspection device that observes deviations and a control device that controls a positional deviation correction device based on the observation results.

(Function) In the above configuration, the front-back reversing device ticks up a flip chip installed in a chip supply unit such as a wafer and reverses the flip chip. Next, a transfer head approaches this flipped chip, ticks it up by adsorbing it to the non-bump-formed surface, and transfers it to a visual inspection device, where a positional shift of the flip chip is detected. Next, the positional deviation correction device is driven to correct this positional deviation, and then the flip chip is mounted on the substrate.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus, where 1 is a table and 2 is a main body box placed on the table. 3 is a conveyance path for a board 4 consisting of an endless chain;
A board 4 on which electronic components are mounted is carried onto a table and taken out from there. 14 is a substrate 4 provided on the conveyance path 3
The positioning part consists of a clamp plate. 5
is a wafer serving as a chip supply unit placed on a platform 13 in front of the conveyor 3, and a large number of flip chips are mounted on the upper surface of the wafer. 6 is a transfer head,
A nozzle 6a protrudes to attract the flip chip.

8°9 is an X point for moving the transfer head 6 in the XY force direction.
The Y direction moving device, 10.11 is its driving motor. 18 is a θ direction drive device installed in the transfer head 6, and is composed of a motor 18a and a bell l-18b.
The nozzle 6a is rotated in the θ direction around its axis. 1
7 is a camera integrally equipped with the transfer head 6;
It moves together with the transfer head 6 to observe the positional deviation of the printed pattern on the substrate 4. Reference numeral 7 denotes a die ejector disposed below the wafer 5, and 7a denotes a bottle thereof. The flip chip on the wafer 5 is pushed up by this pin 7a.

Reference numeral 20 is a box located on the side of the wafer 5 in which a flip-chip reversing device is housed, and 21 is an appearance inspection device.Next, these will be described in detail with reference to FIG.

Reference numeral 22 denotes a front-back reversing device disposed inside the box 20, 23 a fan-shaped gear, 24 a gear that meshes with and rotates along this gear 23, and 25 a rotation rod. Reference numeral 26 denotes an arm extending from the gear 24, and a suction section 27 is attached to the tip end of the arm. F is a flip chip mounted on the wafer 5, B is a bump thereof, and the flip chips F are arranged in parallel on the wafer 5 with the bump forming surface facing up.

The nozzle 6a of the transfer head 6 is connected to this front-back reversing device 2.
2, it approaches the flip chip F which has been turned upside down, sticks to the bump-free surface, and ticks up.

The appearance inspection device 21 includes a camera 21a and an eyepiece 21b.
and a light source section 21c. The transfer head 6 that has picked up the flip chip F is transferred to an XY direction moving device 8.
9, moves onto the eyepiece section 21b, stops there, observes the flip chip F from below, and determines its xyθ.
Detect positional deviation in the direction. Reference numeral 30 denotes a control device such as a computer, which is connected to the cameras 17 and 21a, and based on the observation results, controls the respective motors 10 and 11.18a as a positional deviation correction device for the flip chip F.
control.

This device has the above-mentioned configuration, and its operation will be explained next.

First, the XY direction moving device 8.9 is driven to move the camera 17 above the substrate 4 positioned by the positioning section 14, and the positional shift of the print pattern printed on the substrate 4 is detected. Now, in FIG. 2, when the arm 26 is rotated clockwise by the drive of the motor M and the suction part 27 at the tip approaches the wafer 5, the pin 7a of the lower Guinigieftuff protrudes and is placed on the wafer 5. The flip chip F is pushed up, and the suction unit 27 attracts the bump forming surface to tick up the flip chip F (indicated by the symbol ■ in the figure).
). Next, the arm 26 rotates counterclockwise to turn the flip chip F upside down (symbol ■). Then the transfer head 6
The nozzle 6a approaches this and ticks up this flip chip F (symbol ■).

In this case, since the flip chip F is turned over as described above, the nozzle 6a is inserted with the bump forming surface facing downward.
is adsorbed to.

Next, the transfer head 6 moves to the visual inspection device 21 and temporarily stops above the eyepiece 21b, and in this state, the positional shift in the xyθ directions of the flip chip F adsorbed by the nozzle 6a is observed (symbol ■ .

■). Next, the transfer head 6 moves onto the substrate 4 positioned by the positioning section 14, and transfers the flip chip F onto the substrate 4.
(symbol ■). In this case, the XY direction moving device is configured to correct the positional deviation in the xyθ directions detected by the appearance inspection device 21 as described above and the positional deviation in the xyθ directions of the printed pattern of the substrate 4 detected in advance by the camera 17. 8, 9 and the motor 10 of the θ direction drive device 18,
11 and 18a to mount the flip chip 6 on the substrate 4. As described above, according to the present means, the flip chip F mounted on the wafer 5 with the bump forming surface facing up
After correcting the position by reversing the front and back sides of the flip chip F, the flip chip F can be mounted on the substrate 4 with high accuracy.The flip chip F may be mounted on a tray 28 as shown in FIG.

(Effects of the Invention) As described above, the present invention includes a chip supply unit that is equipped with a flip chip with the bump forming surface facing up, a front-back reversing device that picks up the flip chip and flips it inside out, and a flip-chip that is turned upside down. There is a transfer head that adsorbs the non-bumped surface of the flip chip, picks it up, and transfers and mounts it on the substrate, and a transfer head that is located in the middle of the transfer path from the above-mentioned flipping device to the substrate to prevent misalignment of the flip chip. The electronic component mounting equipment consists of an external appearance inspection device that performs observation and a control device that controls the misalignment correction device based on the observation results. Flip chips can be mounted on a board with high accuracy by flipping them upside down.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is an overall perspective view of an electronic component mounting apparatus, Fig. 2 is a developed view showing a working state, and Fig. 3 is another embodiment of a chip supply section. FIG. 4 is a side view of a conventional means. 4... Substrate 5.28... Chip supply unit 6... Transfer head 10.11.18a... Positional deviation correction device 21...
Appearance inspection device 22...Front/back reversing device 30...Control device B...Hump F...Flip chip

Claims (1)

[Claims] A chip supply unit that equips a flip chip with the bump forming side facing up; a flipping device that takes up the flip chip and flips it inside out; and a flip chip that attracts the flipped chip to the non-bumped side and takes it up. A transfer head that transfers and mounts the flip chip onto the substrate, an appearance inspection device that is located on the transfer path from the above-mentioned flipping device to the substrate, and that observes the positional deviation of the flip chip; An electronic component mounting apparatus comprising: a control device that controls a correction device;