JPH0260243U - - Google Patents
Info
- Publication number
- JPH0260243U JPH0260243U JP13953088U JP13953088U JPH0260243U JP H0260243 U JPH0260243 U JP H0260243U JP 13953088 U JP13953088 U JP 13953088U JP 13953088 U JP13953088 U JP 13953088U JP H0260243 U JPH0260243 U JP H0260243U
- Authority
- JP
- Japan
- Prior art keywords
- reference hole
- metal plate
- package
- center
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例によるパツケージの
平面図、第２図はその―断面部分図、第３図
は前記パツケージの基準孔形成部の拡大図、第４
図ａ，ｂ、第５図ａ，ｂ，ｃ，ｄ，ｅ、第６図ａ
，ｂ，ｃはそれぞれ基準孔形成部に形成される貫
通孔の他の実施例を示す第３図に相当する図、第
７図は従来のパツケージの平面図、第８図は従来
のパツケージにおける基準孔形成部の斜視図、第
９図は従来の問題点を説明するための平面部分図
である。
１……パツケージ本体、２……金属板、４……
キヤビテイ（素子収納部）、５，６……凹部、８
，９……基準孔形成部、１０，１１……基準孔、
１８，２１〜２９……貫通孔。
FIG. 1 is a plan view of a package according to an embodiment of the present invention, FIG. 2 is a partial sectional view thereof, FIG. 3 is an enlarged view of the reference hole forming part of the package, and FIG.
Figures a, b, Figure 5 a, b, c, d, e, Figure 6 a
, b, and c are views corresponding to FIG. 3 showing other embodiments of through holes formed in the reference hole forming portion, respectively. FIG. 7 is a plan view of a conventional package, and FIG. 8 is a view of a conventional package. FIG. 9 is a perspective view of the reference hole forming section and a partial plan view for explaining the conventional problems. 1...Package body, 2...Metal plate, 4...
Cavity (element housing), 5, 6... recess, 8
, 9... Reference hole forming part, 10, 11... Reference hole,
18, 21-29...Through holes.
Claims (1)
に、中央部に向かつて窪む凹部が周縁部に形成さ
れたパツケージ本体と、 前記パツケージ本体の凹部内に配設固着され、
パツケージ本体の位置決めを行うための基準孔を
有し、かつメツキ処理される金属板とからなる基
準孔付半導体素子用パツケージにおいて、 前記金属板に、前記基準孔とは別の貫通孔を設
けたことを特徴とする基準孔付半導体素子用パツ
ケージ。[Scope of Claim for Utility Model Registration] A package body in which a semiconductor element storage portion is provided in the center and a concave portion concave toward the center is formed at the peripheral edge; ,
A semiconductor device package with a reference hole, which has a reference hole for positioning the package body and includes a metal plate to be plated, wherein the metal plate has a through hole separate from the reference hole. A semiconductor device package with a reference hole, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13953088U JPH069510Y2 (en) | 1988-10-26 | 1988-10-26 | Package for semiconductor device with reference hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13953088U JPH069510Y2 (en) | 1988-10-26 | 1988-10-26 | Package for semiconductor device with reference hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260243U true JPH0260243U (en) | 1990-05-02 |
| JPH069510Y2 JPH069510Y2 (en) | 1994-03-09 |
Family
ID=31402875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13953088U Expired - Lifetime JPH069510Y2 (en) | 1988-10-26 | 1988-10-26 | Package for semiconductor device with reference hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069510Y2 (en) |
-
1988
- 1988-10-26 JP JP13953088U patent/JPH069510Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069510Y2 (en) | 1994-03-09 |