JPH0260259U - - Google Patents
Info
- Publication number
- JPH0260259U JPH0260259U JP14007388U JP14007388U JPH0260259U JP H0260259 U JPH0260259 U JP H0260259U JP 14007388 U JP14007388 U JP 14007388U JP 14007388 U JP14007388 U JP 14007388U JP H0260259 U JPH0260259 U JP H0260259U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- lead terminals
- integrated circuit
- metal layers
- insulating container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はフラツトパツケージの平面図、第２図
は第１図の要部拡大斜視図、第３図および第４図
は連結部材の製造過程を示す説明図である。
図中、１……フラツトパツケージ（集積回路パ
ツケージ）、２……パツケージ基盤（絶縁性容器
）、３……外部リード端子、４……連結部材、５
……メタライズ層（金属層）。
FIG. 1 is a plan view of the flat package, FIG. 2 is an enlarged perspective view of the main part of FIG. 1, and FIGS. 3 and 4 are explanatory views showing the manufacturing process of the connecting member. In the figure, 1...Flat package (integrated circuit package), 2...Package base (insulating container), 3...External lead terminal, 4...Connection member, 5
...metalized layer (metal layer).
Claims (1)
るための絶縁性容器と、 (b) 前記絶縁性容器に取り付けられた多数の外
部リード端子と、 (c) 互いに絶縁された多数の金属層が形成され
、該金属層に前記外部リード端子をろう付けする
ことにより前記外部リード端子を連結した電気絶
縁性の連結部材と から成る集積回路パツケージ。[Claims for Utility Model Registration] (a) An insulating container for housing a semiconductor element in which an integrated circuit is formed, (b) A large number of external lead terminals attached to the insulating container, (c) 1. An integrated circuit package comprising a plurality of metal layers insulated from each other and an electrically insulating connecting member to which the external lead terminals are connected by brazing the external lead terminals to the metal layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14007388U JPH0260259U (en) | 1988-10-27 | 1988-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14007388U JPH0260259U (en) | 1988-10-27 | 1988-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260259U true JPH0260259U (en) | 1990-05-02 |
Family
ID=31403912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14007388U Pending JPH0260259U (en) | 1988-10-27 | 1988-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260259U (en) |
-
1988
- 1988-10-27 JP JP14007388U patent/JPH0260259U/ja active Pending