JPH0245652U - - Google Patents
Info
- Publication number
- JPH0245652U JPH0245652U JP12456488U JP12456488U JPH0245652U JP H0245652 U JPH0245652 U JP H0245652U JP 12456488 U JP12456488 U JP 12456488U JP 12456488 U JP12456488 U JP 12456488U JP H0245652 U JPH0245652 U JP H0245652U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- spacer
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の混成集積回路装置の一実施例
の縦断面図、第２図ａ乃至ｃは夫々１層目の混成
集積回路基板、スペーサ用回路基板、及び２層目
の混戦集積回路基板の平面図、第３図は従来の混
成集積回路装置の縦断面図である。
１……ケース、２……カバー、３……気密端子
、４……混成集積回路基板構体、５……接着材、
６……ボンデイングワイヤ、７，８……電子、電
気部品、９……導電性接着材、１１……１層目の
混成集積回路基板、１２……スペーサ用回路基板
、１３……２層目の混成集積回路基板、１１ａ，
１２ａ，１３ａ……電極パツド、１２ｂ，１３ｂ
……メタライズ、２１……ケース、２２……カバ
ー、２３……気密端子、２４……混成集積回路基
板、２５……接着材、２６……ボンデイングワイ
ヤ、２７……電子、電気部品。
FIG. 1 is a vertical cross-sectional view of an embodiment of the hybrid integrated circuit device of the present invention, and FIGS. 2 a to 2 c show a first layer hybrid integrated circuit board, a spacer circuit board, and a second layer hybrid integrated circuit, respectively. The plan view of the substrate and FIG. 3 are longitudinal cross-sectional views of a conventional hybrid integrated circuit device. DESCRIPTION OF SYMBOLS 1... Case, 2... Cover, 3... Airtight terminal, 4... Hybrid integrated circuit board structure, 5... Adhesive material,
6... Bonding wire, 7, 8... Electronic, electrical component, 9... Conductive adhesive, 11... First layer hybrid integrated circuit board, 12... Spacer circuit board, 13... Second layer a hybrid integrated circuit board, 11a,
12a, 13a... Electrode pad, 12b, 13b
. . . Metallization, 21 .
Claims (1)
積回路基板をスペーサ用回路基板を介して上下方
向に積層配置し、該スペーサ用回路基板を通して
上下の混成集積回路基板を相互に電気接続した混
成集積回路基板構体を構成し、この混成集積回路
基板構体をケース及びカバーで封止するとともに
、該ケースに設けた気密端子に電気接続したこと
を特徴とする混成集積回路装置。 A hybrid integrated circuit in which multiple hybrid integrated circuit boards each carrying electronic and electrical components are stacked vertically via a spacer circuit board, and the upper and lower hybrid integrated circuit boards are electrically connected to each other through the spacer circuit board. 1. A hybrid integrated circuit device comprising a circuit board structure, the hybrid integrated circuit board structure being sealed with a case and a cover, and electrically connected to airtight terminals provided in the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12456488U JPH0245652U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12456488U JPH0245652U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245652U true JPH0245652U (en) | 1990-03-29 |
Family
ID=31374409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12456488U Pending JPH0245652U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245652U (en) |
-
1988
- 1988-09-22 JP JP12456488U patent/JPH0245652U/ja active Pending
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