JPH03109352U - - Google Patents
Info
- Publication number
- JPH03109352U JPH03109352U JP1990016338U JP1633890U JPH03109352U JP H03109352 U JPH03109352 U JP H03109352U JP 1990016338 U JP1990016338 U JP 1990016338U JP 1633890 U JP1633890 U JP 1633890U JP H03109352 U JPH03109352 U JP H03109352U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- lower surfaces
- package
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図は本考案の半導体装置の実施例を示す平
面図、第２図は第１図の−線に沿つた断面図
、第３図は本実施例半導体装置の分解図である。 １…放熱板、２…ＩＣ、３…基板、５…パツケ
ージ。
面図、第２図は第１図の−線に沿つた断面図
、第３図は本実施例半導体装置の分解図である。 １…放熱板、２…ＩＣ、３…基板、５…パツケ
ージ。
Claims (1)
- 単一のパツケージに複数のＩＣを封入した半導
体装置において、上面及び下面にＩＣ接続手段を
有すると共に上記パツケージから突出する複数の
リードを備えた基板と、上記基板の上面及び下面
に各々配置された第１及び第２のＩＣとを含むこ
とを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016338U JPH03109352U (ja) | 1990-02-21 | 1990-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016338U JPH03109352U (ja) | 1990-02-21 | 1990-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109352U true JPH03109352U (ja) | 1991-11-11 |
Family
ID=31519607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990016338U Pending JPH03109352U (ja) | 1990-02-21 | 1990-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109352U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017011192A (ja) * | 2015-06-25 | 2017-01-12 | アサヒ・エンジニアリング株式会社 | 電子素子の樹脂封止装置および樹脂封止方法 |
-
1990
- 1990-02-21 JP JP1990016338U patent/JPH03109352U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017011192A (ja) * | 2015-06-25 | 2017-01-12 | アサヒ・エンジニアリング株式会社 | 電子素子の樹脂封止装置および樹脂封止方法 |