JPH0267642U - - Google Patents

Info

Publication number
JPH0267642U
JPH0267642U JP14579488U JP14579488U JPH0267642U JP H0267642 U JPH0267642 U JP H0267642U JP 14579488 U JP14579488 U JP 14579488U JP 14579488 U JP14579488 U JP 14579488U JP H0267642 U JPH0267642 U JP H0267642U
Authority
JP
Japan
Prior art keywords
view
bonding
wiring
capillary
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14579488U
Other languages
Japanese (ja)
Other versions
JPH0625009Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14579488U priority Critical patent/JPH0625009Y2/en
Publication of JPH0267642U publication Critical patent/JPH0267642U/ja
Application granted granted Critical
Publication of JPH0625009Y2 publication Critical patent/JPH0625009Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第４図は本考案の実施例を示す。第
１図は、本考案によるボンデイングの様子を示す
側面略図、第２図は、同上の逆手順による様子を
示す側面略図、第３図ａは、ボール状ボンデイン
グの縦断側面図、第３図ｂは、ステツチボンデイ
ングの縦断側面図、第４図は、電極面上にステツ
チボンデイングを実施した状態の平面図、第５図
乃至第８図は、従来例を示す。第５図は、ボンデ
イングの様子を示す側面略図、第６図ａは、ボー
ル状ボンデイングの縦断側面図、第６図ｂは、ス
テツチボンデイングの縦断側面図、第７図ａは、
凸凹面にボンデイングする場合の拡大側面図、第
７図ｂは、傾斜面にボンデイングする場合の拡大
側面図、第８図は、電極面にステツチボンデイン
グした状態の平面図である。 １１，１２……基板、２……半導体素子、３…
…電極、４……ワイヤー、５……ボンデイング、
７……キヤピラリー。 1 to 4 show embodiments of the present invention. Fig. 1 is a schematic side view showing the state of bonding according to the present invention, Fig. 2 is a schematic side view showing the state of the same reverse procedure, Fig. 3a is a longitudinal cross-sectional side view of ball-shaped bonding, Fig. 3b FIG. 4 is a plan view of a state in which stitch bonding is performed on an electrode surface, and FIGS. 5 to 8 show a conventional example. Fig. 5 is a schematic side view showing the state of bonding, Fig. 6a is a longitudinal sectional side view of ball-shaped bonding, Fig. 6b is a longitudinal sectional side view of stitch bonding, and Fig. 7a is
FIG. 7b is an enlarged side view showing bonding to an uneven surface, FIG. 7b is an enlarged side view showing bonding to an inclined surface, and FIG. 8 is a plan view showing stitch bonding to an electrode surface. 1 1 , 1 2 ... substrate, 2 ... semiconductor element, 3 ...
...electrode, 4...wire, 5...bonding,
7... Capillary.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体部品とプリント基板上のパターン配線と
の間を配線するワイヤーを案内し且つ超音波によ
つて所定位置にボンデイングするキヤピラリーを
、ワイヤーの張設方向に対し後傾するように支持
せしめたことを特徴とするボンデイング装置。 The capillary, which guides the wiring between the semiconductor component and the pattern wiring on the printed circuit board and bonds it to a predetermined position using ultrasonic waves, is supported so as to be tilted backwards with respect to the direction in which the wire is stretched. Characteristic bonding equipment.
JP14579488U 1988-11-08 1988-11-08 Bonding device Expired - Fee Related JPH0625009Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14579488U JPH0625009Y2 (en) 1988-11-08 1988-11-08 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14579488U JPH0625009Y2 (en) 1988-11-08 1988-11-08 Bonding device

Publications (2)

Publication Number Publication Date
JPH0267642U true JPH0267642U (en) 1990-05-22
JPH0625009Y2 JPH0625009Y2 (en) 1994-06-29

Family

ID=31414698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14579488U Expired - Fee Related JPH0625009Y2 (en) 1988-11-08 1988-11-08 Bonding device

Country Status (1)

Country Link
JP (1) JPH0625009Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067079A (en) * 1973-10-13 1975-06-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067079A (en) * 1973-10-13 1975-06-05

Also Published As

Publication number Publication date
JPH0625009Y2 (en) 1994-06-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees