JPH0267657U - - Google Patents
Info
- Publication number
- JPH0267657U JPH0267657U JP14707088U JP14707088U JPH0267657U JP H0267657 U JPH0267657 U JP H0267657U JP 14707088 U JP14707088 U JP 14707088U JP 14707088 U JP14707088 U JP 14707088U JP H0267657 U JPH0267657 U JP H0267657U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- type semiconductor
- mounting board
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは、本考案の一実施例の側面図、第１
図ｂは該一実施例の半導体装置の実装状態の側面
図、第２図ａは本考案の他の実施例の側面図、第
２図ｂは該他の実施例の半導体装置の実装状態の
側面図、第３図ａは従来の半導体装置の側面図、
第３図ｂは該従来の半導体装置の実装状態の側面
図である。
１……リード、２……リード先端部、３……リ
ード底面、４……実装基板、５……実装パツド、
６……半田、７……リード切断面、８……リード
側面、１１……リード、１２……パツケージ、１
３……リード先端部、１４……リード底面、１５
……実装基板、２１……リード、２２……リード
切断面、２３……半田、２４……実装基板。
Figure 1a is a side view of one embodiment of the present invention;
FIG. 2b is a side view of the semiconductor device of this embodiment in a mounted state, FIG. 2a is a side view of another embodiment of the present invention, and FIG. Side view, FIG. 3a is a side view of a conventional semiconductor device,
FIG. 3b is a side view of the conventional semiconductor device in a mounted state. 1...Lead, 2...Lead tip, 3...Lead bottom, 4...Mounting board, 5...Mounting pad,
6...Solder, 7...Lead cut surface, 8...Lead side surface, 11...Lead, 12...Package, 1
3...Lead tip, 14...Lead bottom, 15
... Mounting board, 21 ... Lead, 22 ... Lead cut surface, 23 ... Solder, 24 ... Mounting board.
Claims (1)
いて、リード先端部が実装時に実装基板に接する
水平なリード部分に対して、ほぼ直角で上方に所
定距離延びるように成形されていることを特徴と
する表面実装型半導体装置。 A surface mount type semiconductor device having an external lead, characterized in that the lead tip portion is shaped so as to extend upward for a predetermined distance at a nearly right angle to the horizontal lead portion that contacts the mounting board during mounting. type semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14707088U JPH0267657U (en) | 1988-11-10 | 1988-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14707088U JPH0267657U (en) | 1988-11-10 | 1988-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267657U true JPH0267657U (en) | 1990-05-22 |
Family
ID=31417141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14707088U Pending JPH0267657U (en) | 1988-11-10 | 1988-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267657U (en) |
-
1988
- 1988-11-10 JP JP14707088U patent/JPH0267657U/ja active Pending