JPH0268521U - - Google Patents
Info
- Publication number
- JPH0268521U JPH0268521U JP14862488U JP14862488U JPH0268521U JP H0268521 U JPH0268521 U JP H0268521U JP 14862488 U JP14862488 U JP 14862488U JP 14862488 U JP14862488 U JP 14862488U JP H0268521 U JPH0268521 U JP H0268521U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- outer case
- component element
- case
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の一実施例を用いたセラミツク
発振子の分解斜視図。第２図は本考案の一実施例
を用いたセラミツク発振子の表面実装の断面図。
第３図は本考案の一実施例の部分図。第４図は本
考案の一実施例の部分図。第５図は本考案の一実
施例の部分図。第６図は従来の表面実装タイプの
セラミツク発振子の斜視図。第７図は従来のセラ
ミツク発振子の表面実装断面図。
１……端子、１ａ……突起部、１ｂ……リード
部、２……内ケース、３……端子、３ａ……突起
部、４……端子、４ｂ……リード部、５……外ケ
ース、６……セラミツク素子、７……シール樹脂
、８……基板。
FIG. 1 is an exploded perspective view of a ceramic oscillator using an embodiment of the present invention. FIG. 2 is a sectional view of a surface-mounted ceramic resonator using an embodiment of the present invention.
FIG. 3 is a partial view of one embodiment of the present invention. FIG. 4 is a partial view of one embodiment of the present invention. FIG. 5 is a partial view of one embodiment of the present invention. FIG. 6 is a perspective view of a conventional surface mount type ceramic resonator. FIG. 7 is a cross-sectional view of a conventional ceramic oscillator surface-mounted. 1...Terminal, 1a...Protrusion, 1b...Lead part, 2...Inner case, 3...Terminal, 3a...Protrusion, 4...Terminal, 4b...Lead part, 5...Outer case , 6...ceramic element, 7...sealing resin, 8...substrate.
Claims (1)
グ性を有する第２の端子とで部品素子を保持した
状態で、第３の端子がインサートモールドされた
外ケースに収納し、上記第２の端子と上記第３の
端子とに電気的導通を持たせ、上記外ケースの開
口部をシール樹脂で充填し封止した電子部品。 With the component element held by the first terminal formed in the inner case and the second terminal having spring properties, the component element is housed in the outer case in which the third terminal is insert-molded, and the second terminal is inserted into the outer case. An electronic component in which the terminal and the third terminal are electrically connected, and the opening of the outer case is filled and sealed with a sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14862488U JPH0268521U (en) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14862488U JPH0268521U (en) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268521U true JPH0268521U (en) | 1990-05-24 |
Family
ID=31420112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14862488U Pending JPH0268521U (en) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268521U (en) |
-
1988
- 1988-11-15 JP JP14862488U patent/JPH0268521U/ja active Pending