JPH02693B2 - - Google Patents
Info
- Publication number
- JPH02693B2 JPH02693B2 JP7826580A JP7826580A JPH02693B2 JP H02693 B2 JPH02693 B2 JP H02693B2 JP 7826580 A JP7826580 A JP 7826580A JP 7826580 A JP7826580 A JP 7826580A JP H02693 B2 JPH02693 B2 JP H02693B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- plate
- aluminum plate
- photosensitive layer
- printing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 47
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 47
- 238000007639 printing Methods 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 238000011282 treatment Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000007743 anodising Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 17
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000007788 liquid Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- -1 flint Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 239000008262 pumice Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical compound O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CPIVYSAVIPTCCX-UHFFFAOYSA-N 4-methylpentan-2-yl acetate Chemical compound CC(C)CC(C)OC(C)=O CPIVYSAVIPTCCX-UHFFFAOYSA-N 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- HRBFQSUTUDRTSV-UHFFFAOYSA-N benzene-1,2,3-triol;propan-2-one Chemical compound CC(C)=O.OC1=CC=CC(O)=C1O HRBFQSUTUDRTSV-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000001045 blue dye Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 229940021013 electrolyte solution Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- RXTNIJMLAQNTEG-UHFFFAOYSA-N methylamyl acetate Natural products CCCCC(C)OC(C)=O RXTNIJMLAQNTEG-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Photoreceptors In Electrophotography (AREA)
Description
本発明は感光性平版印刷版の製造法に関し、特
に感光性平版印刷版の支持体とするアルミニウム
板の処理方法に関するものである。
従来、感光性平版印刷版の支持体としては種々
の材料が用いられているが、特にアルミニウム及
びアルミニウムを主成分とする合金の板状体が最
も広範にしかも大量に使用されている支持体であ
る。そしてアルミニウム系支持体に対しては、通
常その上に設けられる感光層の塗膜が強固に接着
するようにその表面を粗荒にする処理が施されて
いる。そして具体的には化学的、機械的あるいは
電気化学的な手段又はそれらの組合せになる手段
があり、その一つのプロセスとして機械的処理で
ある砂目立て処理を施したのち陽極酸化処理をす
る工程がある。この組合せられた工程は、従来経
験的に完成されたプロセスであつて、この上に感
光層を塗設して平版印刷版とした場合、アルミニ
ウム支持体と感光層との接着強度(当業界では、
“密着性”といつている。)がかなり向上し、印刷
版の耐刷性がよいので、すぐれた方法として長年
実用されてきた。
しかしながらこのようなプロセスによるアルミ
ニウム支持体にいわゆるポジテイブワーキング感
光性組成物であるo―キノンジアジド化合物を用
いた感光層を塗設すると、その平版印刷版を像露
光し、現像した場合、現像により除去されるべき
部分においても感光層の皮膜片が陽極酸化皮膜の
孔中に残存し、多孔性のアルミニウム表面の特質
である親水性を破壊し、印刷版の版面の非画像部
分にインキが付着することとなつて印刷物にはい
わゆる“地汚れ”と称せられている問題が生ずる
ことがしばしばあつた。又上記のごとき地汚れが
生じないまでも感光層成分の有色物質が酸化皮膜
孔中に残留したりあるいは孔壁部に吸着して着色
し、現像後の画像のコントラストを低下させると
いう問題があつた。
そこで従来は、前述したごとくアルミニウム板
を陽極酸化したのち、たとえば米国特許第
2714066号公報に記載されているごときアルカリ
けい酸塩、あるいは米国特許第3440050号公報に
記載されているごときふつ化ジルコニウム酸のア
ルカリ金属塩による親水性化処理を施したことも
あつたが、この場合には、上述したごとき非画像
部分の着色を防止し、又それを印刷版として印刷
機にかけても印刷物に“地汚れ”を発生させない
が、その反面印刷版の耐刷性がこの親水性化処理
を施さない場合の40〜80%に減少するという新た
な問題を生じた。
本発明者らは、上述したごとき従来技術にあつ
た問題点を解決すべく鋭意検討したところ、これ
らの問題点をすべて解決する次のごとき発明を為
したものである。すなわち本発明は、アルミニウ
ム板に砂目立処理、次いで陽極酸化処理を施した
のち、o―キノンジアジド化合物を含む感光層を
塗設する感光性平版印刷版の製造法において、該
陽極酸化処理を施したアルミニウム板の表面に微
粒子状となした水を施してのち該アルミニウム板
を積み重ねて放置し、しかるのち上記の感光層を
塗設することを特徴とする感光性平版印刷版の製
造法である。
以下、本発明を詳細に説明する。
本発明において用いられるアルミニウム板は、
アルミニウムを主成分とする純アルミニウム板や
微量の異原子を含むアルミニウム合金等の板状体
である。この異原子には、珪素、銅、マンガン、
マグネシウム、クロム、亜鉛、ビスマス、ニツケ
ル、鉄、チタンなどがあり、合金組成としては、
高々10重量%以下の含有率のものである。本発明
にとつて好適なアルミニウムは、純アルミニウム
であるが、完全に純粋なアルミニウム板は精練技
術上製造が困難であるので、できるだけ異原子を
含まないものということである。又上述した程度
の含有率のアルミニウム合金であれば、本発明に
適用しうる素材ということができる。このように
本発明に適用されるアルミニウム板は、その組成
が特定されるものではなく、従来公知・公用の素
材のものを適宜利用することができる。
すでに説明のあつたごとく、本発明におけるア
ルミニウム板は、板状体である。この板状体とし
てはシート状のものや帯状のものがあり、又シー
ト状物の上面からの形状は、一般的には長方形で
あるが特殊な形状を呈するものでもよい。アルミ
ニウム板の厚さは、およそ0.1mm〜0.4mm程度がよ
い。
上記のアルミニウム板には、砂目立処理が行な
われる。この砂目立処理は、従来アルミニウム材
料に対する一次表面処理として広く行なわれてい
る技術である。これは通常アルミニウム板の処理
すべき表面に液媒を供給しつつ研摩剤を擦りつけ
ることによつて行なわれる。そして研摩剤の擦り
つけにはブラシ、パフ、繊維を束ねたもの、布、
スポンジ、固型面(研摩自体の場合もある。)、鋼
球などをアルミニウム表面上に摺動あるいは衝突
させる。あるいはアルミニウム表面に対して粉末
状研摩剤と共に気体あるいは液体を吹きつける方
法もある。研摩剤としては、工業用研摩剤として
知られているたとえばダイヤモンド、水晶、フリ
ント、花こう岩、アランダム、シリカ、珪藻土、
砂、金剛砂、ガーネツト、タルク、パミス、ドロ
マイト、酸化マグネシウムなどがあり、所望の粒
径のもの、加工のものが用いられる。これらの砂
目立研摩法は、ボール研摩法、ブラシ研摩法、ブ
ラスト研摩法、バフ研摩法などと称せられた公知
の方法であり、いずれも本発明に適用されうる。
上述した砂目立処理ののち、所望により水洗、
あるいは水洗―化学処理を経て、アルミニウム板
には陽極酸化処理が施される。この陽極酸化処理
においては、アルミニウム板は種々の電解質溶液
中に陽極として配置され、電解酸化される。この
電解質としては硫酸、塩酸、硝酸、しゆう酸、ク
ロム酸、りん酸、ベンゼンスルフオン酸、スルフ
アミン酸、ほう酸、ほう酸アンモニウム、炭酸ア
ンモニウム、くえん酸、酒石酸、あるいは特殊な
混酸などがある。電解質の濃度は、電解質の種類
によつて適宜決められる。
陽極酸化の処理条件は使用される電解液によつ
て種々変わるので、一概に特定し得ないが、一般
的には電解質の濃度が1〜80重量%、溶液の液温
は5〜70℃、電流密度0.5〜60アンペア/dm2、
電圧1〜100V、電解時間30秒〜50分の範囲にあ
れば適当である。さらに好ましい処理条件を示す
と次表のようになる。
The present invention relates to a method for producing a photosensitive lithographic printing plate, and more particularly to a method for treating an aluminum plate used as a support for a photosensitive lithographic printing plate. Conventionally, various materials have been used as supports for photosensitive planographic printing plates, but plate-like materials of aluminum and aluminum-based alloys are the most widely used supports in large quantities. be. The aluminum support is usually subjected to a treatment to roughen its surface so that the coating film of the photosensitive layer provided thereon will firmly adhere to it. Specifically, there are chemical, mechanical, or electrochemical means, or a combination thereof, and one of these processes is a mechanical graining process followed by an anodizing process. be. This combined process is a process that has been completed empirically in the past, and when a photosensitive layer is coated on it to form a lithographic printing plate, the adhesive strength between the aluminum support and the photosensitive layer ( ,
It's called "adhesion." ), and the printing plate has good printing durability, so it has been used as an excellent method for many years. However, when a photosensitive layer using an o-quinonediazide compound, which is a so-called positive working photosensitive composition, is coated on an aluminum support by such a process, when the lithographic printing plate is imagewise exposed and developed, it is removed by the development. Film fragments of the photosensitive layer remain in the pores of the anodic oxide film even in areas where they should be removed, destroying the hydrophilic properties of the porous aluminum surface and causing ink to adhere to non-image areas of the printing plate surface. As a result, printed matter often suffers from a problem called "staining." Furthermore, even if the above-mentioned background smudge does not occur, there is a problem in that the colored substances of the photosensitive layer components remain in the pores of the oxide film or are adsorbed to the pore walls and become colored, reducing the contrast of the image after development. Ta. Conventionally, the aluminum plate was anodized as described above, and then the
In some cases, hydrophilic treatment was performed using an alkali silicate as described in US Pat. In some cases, the above-mentioned coloring of non-image areas is prevented, and even if the printed matter is used as a printing plate in a printing machine, "background staining" does not occur on the printed matter, but on the other hand, the printing durability of the printing plate is affected by this hydrophilic property. A new problem arose in that the amount decreased to 40-80% of that without treatment. The inventors of the present invention have made extensive studies to solve the problems encountered in the prior art as described above, and have come up with the following invention that solves all of these problems. That is, the present invention provides a method for producing a photosensitive lithographic printing plate in which a photosensitive layer containing an o-quinonediazide compound is coated after graining and then anodizing an aluminum plate. A method for producing a photosensitive lithographic printing plate, which comprises applying water in the form of fine particles to the surface of the aluminum plates, stacking the aluminum plates and leaving them to stand, and then coating the above-mentioned photosensitive layer. . The present invention will be explained in detail below. The aluminum plate used in the present invention is
It is a plate-shaped body such as a pure aluminum plate whose main component is aluminum or an aluminum alloy containing a small amount of foreign atoms. These foreign atoms include silicon, copper, manganese,
There are magnesium, chromium, zinc, bismuth, nickel, iron, titanium, etc., and the alloy composition is as follows.
The content is at most 10% by weight or less. The preferred aluminum for the present invention is pure aluminum, but since it is difficult to manufacture a completely pure aluminum plate due to scouring technology, the aluminum should contain as few foreign atoms as possible. Furthermore, any aluminum alloy having the above-mentioned content can be said to be a material that can be applied to the present invention. As described above, the composition of the aluminum plate applied to the present invention is not specified, and conventionally known and publicly used materials can be used as appropriate. As already explained, the aluminum plate in the present invention is a plate-shaped body. This plate-shaped body may be sheet-shaped or band-shaped, and the shape of the sheet-shaped body from the top is generally rectangular, but it may have a special shape. The thickness of the aluminum plate is preferably about 0.1 mm to 0.4 mm. The above aluminum plate is subjected to graining treatment. This graining treatment is a technique that has been widely used as a primary surface treatment for aluminum materials. This is usually done by rubbing an abrasive onto the surface of the aluminum plate to be treated while supplying a liquid medium. For rubbing the abrasive, brushes, puffs, bundles of fibers, cloth, etc.
A sponge, a solid surface (sometimes the abrasive itself), a steel ball, etc. is slid or impinged onto the aluminum surface. Another method is to spray a gas or liquid together with a powdered abrasive onto the aluminum surface. Examples of abrasives include diamond, crystal, flint, granite, alundum, silica, diatomaceous earth, which are known as industrial abrasives.
Examples include sand, diamond sand, garnet, talc, pumice, dolomite, magnesium oxide, etc., and those with the desired particle size and processing are used. These grain polishing methods are known methods such as ball polishing, brush polishing, blast polishing, and buff polishing, and any of them can be applied to the present invention. After the graining treatment described above, washing with water or
Alternatively, after washing with water and undergoing chemical treatment, the aluminum plate is anodized. In this anodizing process, an aluminum plate is placed as an anode in various electrolyte solutions and electrolytically oxidized. Examples of the electrolyte include sulfuric acid, hydrochloric acid, nitric acid, oxalic acid, chromic acid, phosphoric acid, benzenesulfonic acid, sulfamic acid, boric acid, ammonium borate, ammonium carbonate, citric acid, tartaric acid, or special mixed acids. The concentration of the electrolyte is appropriately determined depending on the type of electrolyte. The processing conditions for anodic oxidation vary depending on the electrolyte used, so they cannot be specified, but in general, the electrolyte concentration is 1 to 80% by weight, the solution temperature is 5 to 70°C, Current density 0.5-60 ampere/ dm2 ,
A voltage of 1 to 100 V and an electrolysis time of 30 seconds to 50 minutes are suitable. More preferable processing conditions are shown in the following table.
【表】
この陽極酸化処理は、たとえば上記の範囲内の
諸条件のもとで従来種々の分解において実施され
ているので、当業者は、本発明の工程の一として
陽極酸化を行なうのは容易である。陽極酸化処理
を経たアルミニウム板は所望により適宜水洗等の
処理に付される。
上記のごとく陽極酸化処理を経たアルミニウム
板には、次いで微粒子状となした水が適用され
る。この微粒子状の水は、粒径が0.1〜50μm程度
に微細であり、超音波霧化方法、エアージエツト
法、スプレー法等により製造される。水の粒径が
0.1μmより小さいとアルミニウム板表面に接触、
付着しにくくなり、本発明における効果がほとん
ど生ぜず、又50μmより大であると水粒子と水粒
子が容易に結合して大粒子となり、アルミニウム
板表面をぬらして腐触させる恐れがある。
この微粒子状の水のアルミニウム板への適用の
雰囲気は、温度20〜40℃、相対湿度80〜100%が
好ましく、適用時間は5〜180秒程度がよい。そ
してこの微粒子状の水の適用後、アルミニウム板
を重ねるまでの間、アルミニウム板が外気と接触
する時間は0〜300秒、外気温度が10℃〜50℃の
範囲内であればよい。
微粒子状の水が適用されたアルミニウム板は、
上記の外気接触を適宜経たのち、積み重ねられ、
放置される。この積み重ねは、アルミニウム板が
帯状の場合はロール状に捲回していくことでよ
く、シート状の場合は順次シートを積み重ねてい
くことでよい。積み重ね(ロール状に捲回する場
合も含む)は、各葉、各捲回層が重ね合わされる
ことが必要である。従つてアルミニウム板が帯状
の場合は、同一の巾であることが望ましく、又シ
ート状の場合は各葉が同一の形状をなしているこ
とが望ましい。
積み重ねられたアルミニウム板は、およそ24時
間以上は放置される。放置しておく場所の雰囲気
は、常温、常湿でよいが、多少の高低は許容され
る。
上記の放置を終えたアルミニウム板には、o―
キノンジアジド化合物を含む感光層が塗設され
る。o―キノンジアジド化合物は少なくとも1つ
のo―キノンジアジド基を有する化合物で活性光
線の照射により溶解性が変化するものである。こ
のo―キノンジアジド化合物に関しては、
Jaromir Kosar著“Light−Sensitive
Systems:Chemistry and Application of
Nonsilver Halide Photographic Processes”
(John Wiley &Sons、Inc.)第339〜352頁に詳
細に記載されており、これらはいずれも本発明の
ために適用されうる化合物である。特に種々の芳
香族ポリヒドロキシル化合物あるいはアミン類と
反応させたo―キノンジアジドのスルホン酸エス
テル又はスルホンアミドが好適である。そして特
公昭43−28403号公報に記載されているベンゾキ
ノン―1,2―ジアジドスルホン酸クロリドとポ
リヒドロキシフエニルとのエステル又はナフトキ
ノン―1,2―ジアジドスルホン酸クロリドとピ
ロガール―アセトン樹脂とのエステルが最も好ま
しいものである。その他の比較的好適なo―キノ
ンジアジド化合物としては、米国特許第3046120
号及び同第3188210号の各明細書中に記載されて
いるベンゾキノン―1,2―ジアジドスルホン酸
クロリド又はナフトキノン―1,2―ジアジドス
ルホン酸クロリドとフエノールホルムアルデヒド
樹脂とのエステルがある。
o―キノンジアジド化合物は単独で感光層を構
成するが、アルカリ水に可溶な樹脂を結合剤(バ
インダー)としてこの種の樹脂と共に使用され
る。このアルカリ水に可溶性の樹脂としては、こ
の性質を有するノボラツク樹脂があり、たとえば
フエノールホルムアルデヒド樹脂、クレゾールホ
ルムアルデヒド樹脂、p―t―ブチルフエノール
―ホルムアルデヒド樹脂、フエノール変性キシレ
ン樹脂、フエノール変性キシレン・メジチレン樹
脂などである。その他の有用なアルカリ水可溶性
樹脂としてポリヒドロキシスチレン、ポリハロゲ
ン化ヒドロキシスチレン化(メタ)アクリル酸と
他のビニル化合物とのコポリマーを挙げることが
できる。
このようなo―キノンジアジド化合物とアルカ
リ水に可溶性の樹脂からなる組成物中のo―キノ
ンジアジド化合物の量は、10〜50重量%の範囲内
にあり、通常20〜40重量%程度の量比とされる。
又o―キノンジアジド化合物からなる組成物中に
は、感度を高めるために環状酸無水物、画像着色
剤としての染料や他の所望の増量剤(フイラー)
などを適宜加えることができる。
感光層を形成させるための塗布液は、上記の諸
成分を、たとえば2―メトキシエタノール、2―
エトキシエタノール、2―メトキシエチルアセテ
ート、2―エトキシエチルアセテート、ジメチル
ホルムアミド、メタノール、エタノール、n―プ
ロパノール、i―プロパノール、塩化メチレン、
二塩化エチレン、トリクロルエタン、モノクロル
ベンゼン、トルエン、アセトン、メチルエチルケ
トン、メチルイソブチルケトン、酢酸メチル、酢
酸エチル、酢酸n―プロピル、酢酸イソプロピ
ル、酢酸n―ブチル、メチルアミルアセテートな
どのエステル、などの有機溶剤あるいはそれらの
混合溶媒に溶解せしめて調製される。塗布液中の
固形成分の量比は、約0.1〜約25重量%、より好
ましくは1〜15重量%程度がよい。
調製した塗布液は、たとえばドクターコート、
ローラーコート、グラビアコート、ビートコー
ト、デイツプコートなどの種々の塗布手段によつ
て前記のごとく処理したアルミニウム板上に塗布
される。塗布液層の乾燥も従来技術を適用するこ
とでよく、室温乃至高温、たとえば20℃〜150℃
といつた範囲の温度の雰囲気内で乾燥させる。乾
燥後の感光層は、約0.1〜7g/m2程度であり、
0.5〜4g/m2がより好ましい量である。
かくして得られた感光性平版印刷版は、カーボ
ンアーク灯、キセノン灯、水銀灯、タングステン
灯、メタルハライドランプなどのごときo―キノ
ンジアジド化合物に対する活性光線を含む光源に
より画像状に露光され、現像されると平版印刷版
となる。
本発明による感光性平版印刷版は、その支持体
たるアルミニウム板とその上に設けられる感光層
との接着強度は高く、耐刷性に優れ、しかも印刷
物には“地汚れ”が全く生じないという優れた性
能を有するので、きわめて有用な印刷版である。
また本発明の製造方法は装置的にも操作上も簡単
であり、経費上も低廉に実施できるので工業的に
有利である。
次に、本発明を実施例に基づいて具体的に説明
する。
実施例 1
純度99.5%のアルミニウムの長尺帯をパミスト
ン(400メツシユ)―水懸濁液を流延しつつナイ
ロン製ブラシで擦り、その表面を砂目立したの
ち、流水をあてて十分に洗浄した。次いで水酸化
ナトリウムの10重量%水溶液(液温50℃)中に20
秒間浸漬してエツチングし、再び流水で水洗し
た。
これを1.5重量%の硝酸水溶液の浴槽に導き、
液温20℃、プラス側電圧13ボルト、マイナス側電
圧6ボルト、デユーテイサイクル0.3の交流電流
を用いるとの条件のもとに20秒間電解グレイニン
グを行なつた。その後、この表面に生成したスマ
ツトを除去するため、15重量%の硫酸浴液(液温
50℃)中に60秒間通してデスマツト処理を行なつ
た。続いて濃度250g/lの硫酸電解液(液温30
℃)を容れた陽極酸化槽中に通し、電流密度
20A/dm2の条件下で陽極酸化し、厚さ2μの酸化
皮膜を形成させた。
次いで水洗、乾燥工程を経たのち、これを出力
1.7Hzの超音波発振器(三洋電機(株)製超音波加湿
器“CFK−400E”)により微粒子化された蒸留水
の雰囲気(温度27℃、相対湿度95%)に約20分間
曝露し、直ちに巻取つた。この巻回した状態で24
時間放置した。その後この巻回物からアルミニウ
ム帯を繰り出して下記の組成の塗布液を塗布して
感光層を形成せしめた。
ナフトキノン−1,2―ジアジド―5―スルフ
オニルクロライドとピロガロール―アセトン樹
脂とのエステル化合物(註1) 0.75部
クレゾールノボラツク樹脂 2.00部
テトラヒドロ無水フタル酸 0.15部
“オイルブル―#603”(註2) 0.04部
オルトキノンジアジド―4―スルホン酸クロラ
イド 0.04部
エチレンジクロライド 16部
酢酸―2―メトキシエチル 12部
註1:米国特許第3635709号明細書中の実施例
に記載されているもの。
註2:オリエント化学(株)製青色染料
感光層の乾燥後の塗布重量は2.5g/m2であつ
た。
このようにして作成した感光性平版印刷版を
PSライト(商品名、富士写真フイルム(株)製露光
装置、メタルハライドランプ(出力2KW)使用)
の光源より1mの距離を隔てた位置に配置して60
秒間露光した後、下記の組成の現像液(液温23
℃)を用いて現像処理を行なつた。
メタけい酸ナトリウム 90部
JIS3号けい酸ナトリウム 4部
水 1000部
現像処理後、版面を肉眼で観察し、非画像部の
着色の有無を判定した。さらにこの印刷版を“ハ
イデルベルクKOR−O”印刷機に取付けて印刷
し、耐刷枚数と地汚れの有無を調べた。第1表に
はそれぞれの結果が示されている。
上記の実施例に対し、本発明の効果を明確にす
るため、上記実施例における微粒子化された蒸留
水の雰囲気への曝露を行なわず、他は実施例の場
合と全く同様にして比較例を実施した。その結果
は実施例のものと並列して第1表に示した。[Table] This anodic oxidation treatment has been conventionally carried out in various decomposition processes under various conditions within the above-mentioned range, so those skilled in the art will easily be able to carry out anodization as one of the steps of the present invention. It is. The aluminum plate that has undergone the anodizing treatment is subjected to appropriate treatments such as washing with water, if desired. Water in the form of fine particles is then applied to the aluminum plate that has undergone the anodizing treatment as described above. This particulate water has a particle size of about 0.1 to 50 μm, and is produced by an ultrasonic atomization method, an air jet method, a spray method, or the like. water particle size
If it is smaller than 0.1μm, it will contact the aluminum plate surface,
It becomes difficult to adhere, and the effect of the present invention is hardly produced, and if it is larger than 50 μm, water particles easily combine with each other to form large particles, which may wet the surface of the aluminum plate and cause corrosion. The atmosphere in which this particulate water is applied to the aluminum plate is preferably a temperature of 20 to 40°C and a relative humidity of 80 to 100%, and the application time is preferably about 5 to 180 seconds. After the application of this particulate water and until the aluminum plates are stacked, the aluminum plate should be in contact with the outside air for 0 to 300 seconds, and the outside air temperature should be within the range of 10°C to 50°C. The aluminum plate to which particulate water has been applied is
After being exposed to the outside air as described above, they are stacked,
left alone. This stacking may be done by winding the aluminum plate into a roll when it is in the form of a band, or by stacking the sheets one after another when the aluminum plate is in the form of a sheet. Stacking (including winding into a roll) requires that each leaf and each wound layer be overlapped. Therefore, if the aluminum plate is in the form of a band, it is desirable that the width be the same, and if it is in the form of a sheet, it is desirable that each leaf has the same shape. The stacked aluminum plates are left alone for approximately 24 hours or more. The atmosphere in the place where it is left may be at room temperature and humidity, but some elevation is acceptable. O-
A photosensitive layer containing a quinonediazide compound is applied. The o-quinonediazide compound is a compound having at least one o-quinonediazide group, and its solubility changes upon irradiation with actinic rays. Regarding this o-quinonediazide compound,
“Light−Sensitive” by Jaromir Kosar
Systems:Chemistry and Application of
Nonsilver Halide Photographic Processes”
(John Wiley & Sons, Inc.) pages 339-352, and all of these are compounds that can be applied for the present invention. Particularly suitable are sulfonic acid esters or sulfonamides of o-quinonediazide reacted with various aromatic polyhydroxyl compounds or amines. And the ester of benzoquinone-1,2-diazide sulfonic acid chloride and polyhydroxyphenyl or the naphthoquinone-1,2-diazide sulfonic acid chloride and pyrogal-acetone resin described in Japanese Patent Publication No. 43-28403. esters are most preferred. Other relatively suitable o-quinonediazide compounds include US Pat. No. 3,046,120
There are esters of benzoquinone-1,2-diazide sulfonic acid chloride or naphthoquinone-1,2-diazide sulfonic acid chloride and phenol formaldehyde resin described in the specifications of No. 1 and No. 3188210. Although the o-quinonediazide compound constitutes the photosensitive layer by itself, it is used together with this type of resin using a resin soluble in alkaline water as a binder. Examples of resins soluble in alkaline water include novolac resins having this property, such as phenol formaldehyde resin, cresol formaldehyde resin, pt-butylphenol-formaldehyde resin, phenol-modified xylene resin, and phenol-modified xylene/meditylene resin. It is. Other useful alkaline water-soluble resins include polyhydroxystyrene, copolymers of polyhalogenated hydroxystyrenated (meth)acrylic acid and other vinyl compounds. The amount of the o-quinonediazide compound in the composition comprising the o-quinonediazide compound and the resin soluble in alkaline water is within the range of 10 to 50% by weight, and the ratio is usually about 20 to 40% by weight. be done.
In addition, the composition comprising the o-quinonediazide compound may contain a cyclic acid anhydride, a dye as an image coloring agent, and other desired extenders (fillers) to increase sensitivity.
etc. can be added as appropriate. The coating liquid for forming the photosensitive layer contains the above-mentioned components, for example, 2-methoxyethanol, 2-
Ethoxyethanol, 2-methoxyethyl acetate, 2-ethoxyethyl acetate, dimethylformamide, methanol, ethanol, n-propanol, i-propanol, methylene chloride,
Organic solvents such as esters such as ethylene dichloride, trichloroethane, monochlorobenzene, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, and methyl amyl acetate. Alternatively, it is prepared by dissolving it in a mixed solvent thereof. The amount ratio of solid components in the coating liquid is about 0.1 to about 25% by weight, more preferably about 1 to 15% by weight. The prepared coating solution can be used, for example, as a doctor coat,
The coating is applied onto the aluminum plate treated as described above by various coating means such as roller coating, gravure coating, beat coating, and dip coating. Drying of the coating liquid layer can also be done by applying conventional techniques, such as at room temperature to high temperature, for example 20°C to 150°C.
Dry in an atmosphere at a temperature within the specified range. The photosensitive layer after drying has a weight of about 0.1 to 7 g/ m2 ,
A more preferred amount is 0.5-4 g/ m2 . The photosensitive lithographic printing plate thus obtained is imagewise exposed to light from a light source containing active light for o-quinonediazide compounds, such as a carbon arc lamp, xenon lamp, mercury lamp, tungsten lamp, metal halide lamp, etc., and is developed to form a lithographic plate. It will be a printed version. The photosensitive lithographic printing plate according to the present invention has high adhesion strength between the support aluminum plate and the photosensitive layer provided thereon, has excellent printing durability, and is said to have no "background stain" on printed matter. It is an extremely useful printing plate due to its excellent performance.
Further, the manufacturing method of the present invention is industrially advantageous because it is simple in terms of equipment and operation, and can be carried out at low cost. Next, the present invention will be specifically explained based on examples. Example 1 A long strip of aluminum with a purity of 99.5% was rubbed with a nylon brush while pouring a pumice stone (400 mesh) water suspension to make the surface grainy, and then thoroughly washed with running water. did. Then, in a 10% by weight aqueous solution of sodium hydroxide (liquid temperature 50°C),
It was etched by dipping for a second, and then washed again with running water. This was introduced into a bath of 1.5% by weight nitric acid aqueous solution.
Electrolytic graining was carried out for 20 seconds under the following conditions: a liquid temperature of 20° C., a positive voltage of 13 volts, a negative voltage of 6 volts, and an alternating current with a duty cycle of 0.3. After that, in order to remove the smut generated on this surface, a 15% by weight sulfuric acid bath solution (liquid temperature
Desmat treatment was carried out by passing the sample through a temperature of 50°C for 60 seconds. Next, add a sulfuric acid electrolyte with a concentration of 250 g/l (solution temperature: 30
) into an anodizing tank containing a current density of
Anodic oxidation was performed under conditions of 20 A/dm 2 to form an oxide film with a thickness of 2 μm. This is then output after going through a washing and drying process.
Exposure for approximately 20 minutes to an atmosphere of distilled water (temperature 27℃, relative humidity 95%) that has been atomized by a 1.7Hz ultrasonic oscillator (Sanyo Electric Co., Ltd. ultrasonic humidifier "CFK-400E"), and immediately Winding ivy. 24 in this rolled state
I left it for a while. Thereafter, the aluminum strip was unwound from the wound material and a coating solution having the composition shown below was applied to form a photosensitive layer. Ester compound of naphthoquinone-1,2-diazide-5-sulfonyl chloride and pyrogallol-acetone resin (Note 1) 0.75 parts Cresol novolak resin 2.00 parts Tetrahydrophthalic anhydride 0.15 parts "Oil Blue-#603" (Note 2) ) 0.04 parts Orthoquinone diazide-4-sulfonic acid chloride 0.04 parts Ethylene dichloride 16 parts 2-methoxyethyl acetate 12 parts Note 1: As described in the examples in US Pat. No. 3,635,709. Note 2: Blue dye manufactured by Orient Chemical Co., Ltd. The coating weight of the photosensitive layer after drying was 2.5 g/m 2 . The photosensitive lithographic printing plate created in this way is
PS light (product name, exposure equipment manufactured by Fuji Photo Film Co., Ltd., using metal halide lamp (output 2KW))
60 by placing it 1m away from the light source.
After exposure for seconds, use a developer with the following composition (solution temperature: 23℃).
℃). Sodium metasilicate 90 parts JIS No. 3 Sodium silicate 4 parts Water 1000 parts After development, the plate surface was observed with the naked eye to determine the presence or absence of coloring in the non-image area. Furthermore, this printing plate was attached to a "Heidelberg KOR-O" printing machine and printed, and the number of printed sheets and the presence or absence of scumming were examined. Table 1 shows the respective results. In order to clarify the effects of the present invention, a comparative example was prepared in the above example, except that the exposure to the atomized distilled water atmosphere in the above example was not carried out, and the other conditions were the same as in the example. carried out. The results are shown in Table 1 in parallel with those of the Examples.
【表】
第1表に示された結果からも、本発明の効果が
著しいことが明らかであつた。[Table] From the results shown in Table 1, it was clear that the effects of the present invention were remarkable.
Claims (1)
化処理を施したのち、o―キノンジアジド化合物
を含む感光層を塗設する感光性平版印刷版の製造
法において、該陽極酸化処理を施したアルミニウ
ム板の表面に微粒子状となした水を施してのち該
アルミニウム板を積み重ねて放置し、しかるのち
上記の感光層を塗設することを特徴とする感光性
平版印刷版の製造法。1. In a method for producing a photosensitive lithographic printing plate in which a photosensitive layer containing an o-quinonediazide compound is coated after graining and then anodizing an aluminum plate, the aluminum plate subjected to the anodizing treatment is 1. A method for producing a photosensitive lithographic printing plate, which comprises applying water in the form of fine particles to the surface, stacking the aluminum plates and leaving them to stand, and then coating the above photosensitive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7826580A JPS574048A (en) | 1980-06-10 | 1980-06-10 | Manufacture of photosensitive lithographic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7826580A JPS574048A (en) | 1980-06-10 | 1980-06-10 | Manufacture of photosensitive lithographic plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS574048A JPS574048A (en) | 1982-01-09 |
| JPH02693B2 true JPH02693B2 (en) | 1990-01-09 |
Family
ID=13657142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7826580A Granted JPS574048A (en) | 1980-06-10 | 1980-06-10 | Manufacture of photosensitive lithographic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS574048A (en) |
-
1980
- 1980-06-10 JP JP7826580A patent/JPS574048A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS574048A (en) | 1982-01-09 |
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