JPH0270448U - - Google Patents

Info

Publication number
JPH0270448U
JPH0270448U JP1988150471U JP15047188U JPH0270448U JP H0270448 U JPH0270448 U JP H0270448U JP 1988150471 U JP1988150471 U JP 1988150471U JP 15047188 U JP15047188 U JP 15047188U JP H0270448 U JPH0270448 U JP H0270448U
Authority
JP
Japan
Prior art keywords
substrate
semiconductor element
wiring pattern
electrode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988150471U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988150471U priority Critical patent/JPH0270448U/ja
Publication of JPH0270448U publication Critical patent/JPH0270448U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案による半導体素子の実装構造の
断面図であり、第２図は従来の半導体素子の実装
構造の断面図である。 １……配線基板、２……配線パターン、３……
樹脂、４……金属突起、５……電極パツド、６…
…半導体素子、７……導電粒子、８……異方性導
電膜、１０……絶縁樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電極上に金属突起を有する半導体素子と、前記
    電極と相対する配線パターンを有する基板との間
    には樹脂が存在し、前記半導体素子と前記基板と
    がフエースダウンにて実装されている半導体素子
    の実装構造において、前記樹脂が前記半導体素子
    と前記基板との間以外の前記基板上の前記配線パ
    ターン上にも存在することを特徴とする半導体素
    子の実装構造。
JP1988150471U 1988-11-18 1988-11-18 Pending JPH0270448U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988150471U JPH0270448U (ja) 1988-11-18 1988-11-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988150471U JPH0270448U (ja) 1988-11-18 1988-11-18

Publications (1)

Publication Number Publication Date
JPH0270448U true JPH0270448U (ja) 1990-05-29

Family

ID=31423649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988150471U Pending JPH0270448U (ja) 1988-11-18 1988-11-18

Country Status (1)

Country Link
JP (1) JPH0270448U (ja)

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