JPH0270461U - - Google Patents
Info
- Publication number
- JPH0270461U JPH0270461U JP14987188U JP14987188U JPH0270461U JP H0270461 U JPH0270461 U JP H0270461U JP 14987188 U JP14987188 U JP 14987188U JP 14987188 U JP14987188 U JP 14987188U JP H0270461 U JPH0270461 U JP H0270461U
- Authority
- JP
- Japan
- Prior art keywords
- titanium
- film
- aluminum
- titanium film
- barrier metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本発明半導体装置の一つの実施例を示
す断面図、第２図は従来例を示す断面図である。
符号の説明、１，２……半導体基板、５……チ
タン膜、６……チタンオキシナイトライド膜、７
……チタン膜、８……バリアメタル、９……電極
（Ａ又はＡ合金）。
FIG. 1 is a sectional view showing one embodiment of the semiconductor device of the present invention, and FIG. 2 is a sectional view showing a conventional example. Explanation of symbols, 1, 2...Semiconductor substrate, 5...Titanium film, 6...Titanium oxynitride film, 7
...Titanium film, 8...Barrier metal, 9...Electrode (A or A alloy).
Claims (1)
アルミニウム合金からなる電極との間に、チタン
膜とチタンオキシナイトライド膜とチタン膜から
なる三層構造のバリアメタルを介在させてなる ことを特徴とする半導体装置。[Claims for Utility Model Registration] A three-layered barrier metal consisting of a titanium film, a titanium oxynitride film, and a titanium film is interposed between a silicon semiconductor substrate and an electrode made of aluminum or an aluminum alloy. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14987188U JPH0648880Y2 (en) | 1988-11-16 | 1988-11-16 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14987188U JPH0648880Y2 (en) | 1988-11-16 | 1988-11-16 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0270461U true JPH0270461U (en) | 1990-05-29 |
| JPH0648880Y2 JPH0648880Y2 (en) | 1994-12-12 |
Family
ID=31422499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14987188U Expired - Lifetime JPH0648880Y2 (en) | 1988-11-16 | 1988-11-16 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648880Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04264719A (en) * | 1991-02-19 | 1992-09-21 | Sony Corp | Formation of wiring |
-
1988
- 1988-11-16 JP JP14987188U patent/JPH0648880Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04264719A (en) * | 1991-02-19 | 1992-09-21 | Sony Corp | Formation of wiring |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648880Y2 (en) | 1994-12-12 |