JPH02722U - - Google Patents
Info
- Publication number
- JPH02722U JPH02722U JP7742588U JP7742588U JPH02722U JP H02722 U JPH02722 U JP H02722U JP 7742588 U JP7742588 U JP 7742588U JP 7742588 U JP7742588 U JP 7742588U JP H02722 U JPH02722 U JP H02722U
- Authority
- JP
- Japan
- Prior art keywords
- ammonia water
- cleaning liquid
- semiconductor wafer
- cleaning apparatus
- wafer cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Description
第１図は、本考案の一実施例の半導体ウエハー
の洗浄装置の概略構成図である。第２図は、該一
実施例の洗浄液中アンモニア水の濃度の経時変化
図、第３図は、従来の装置による洗浄液中アンモ
ニア水の濃度の経時変化図である。
１……洗浄槽、２……洗浄液供給配管、３……
洗浄液排液配管、４……過酸化水素水補充配管、
５……アンモニア水補充配管、６……エア式駆動
弁制御装置、７……エア式駆動弁。
FIG. 1 is a schematic diagram of a semiconductor wafer cleaning apparatus according to an embodiment of the present invention. FIG. 2 is a graph showing the change over time in the concentration of ammonia water in the cleaning liquid according to the embodiment, and FIG. 3 is a graph showing the change over time in the concentration of ammonia water in the cleaning liquid according to the conventional apparatus. 1...Cleaning tank, 2...Cleaning liquid supply piping, 3...
Cleaning liquid drain pipe, 4...Hydrogen peroxide replenishment pipe,
5...Ammonia water replenishment piping, 6...Air-driven valve control device, 7...Air-driven valve.
Claims (1)
として使用する半導体ウエハーの洗浄装置におい
て、洗浄液の中にアンモニア水を定期的又は連続
的に補充する機構を有することを特徴とする半導
体ウエハーの洗浄装置。 A semiconductor wafer cleaning apparatus that uses a mixture of ammonia water and hydrogen peroxide as a cleaning liquid, the semiconductor wafer cleaning apparatus having a mechanism for periodically or continuously replenishing the cleaning liquid with ammonia water. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7742588U JPH02722U (en) | 1988-06-10 | 1988-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7742588U JPH02722U (en) | 1988-06-10 | 1988-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02722U true JPH02722U (en) | 1990-01-05 |
Family
ID=31302410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7742588U Pending JPH02722U (en) | 1988-06-10 | 1988-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02722U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946032A (en) * | 1982-09-09 | 1984-03-15 | Hitachi Ltd | Cleaning device |
| JPS61281532A (en) * | 1985-06-07 | 1986-12-11 | Hitachi Ltd | Method and device for adjusting concentration of semiconductor cleaning liquid |
-
1988
- 1988-06-10 JP JP7742588U patent/JPH02722U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946032A (en) * | 1982-09-09 | 1984-03-15 | Hitachi Ltd | Cleaning device |
| JPS61281532A (en) * | 1985-06-07 | 1986-12-11 | Hitachi Ltd | Method and device for adjusting concentration of semiconductor cleaning liquid |
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