JPH02728U - - Google Patents
Info
- Publication number
- JPH02728U JPH02728U JP7837488U JP7837488U JPH02728U JP H02728 U JPH02728 U JP H02728U JP 7837488 U JP7837488 U JP 7837488U JP 7837488 U JP7837488 U JP 7837488U JP H02728 U JPH02728 U JP H02728U
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- die
- heat block
- die island
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000002159 abnormal effect Effects 0.000 description 2
Landscapes
- Wire Bonding (AREA)
Description
第１図ａ，ｂは本考案に係るヒートブロツクの
窪みの一例を示す平面図、切断側面図、第２図ａ
，ｂ，ｃは第１図に示すヒートブロツクのダイア
イランドとの正常時における密着状態を示す平面
図、切断側面図、第３図ａ，ｂ，ｃは第１図に示
すヒートブロツクのダイアイランドとの異常時に
おける密着状態を示す切断側面図、第４図ａ，ｂ
は従来のヒートブロツクの窪みの一例を示す平面
図、切断側面図、第５図ａ，ｂ，ｃは第４図に示
すヒートブロツクのダイアイランドとの正常時に
おける密着状態を示す平面図、側面図、第６図ａ
，ｂ，ｃは第４図に示すヒートブロツクのダイア
イランドとの異常時における密着状態を示す切断
側面図、第７図は本考案の対象のリードフレーム
の一例を示す平面図、第８図ａ，ｂは第７図に示
すリードフレームのダイアイランド部分を示す平
面図、側面図である。
１……フレーム部、２……ダイアイランド、３
……リード部、４……ダイアイランド連結部、１
１……ヒートブロツク、１２……窪み、１２ａ，
１３ａ……窪み１２より深い窪み部分、なお図中
同一符号は同一または相当する部分を示す。
Figures 1a and b are a plan view and a cut side view showing an example of the recess of the heat block according to the present invention, and Figure 2a is a
, b, and c are a plan view and a cut side view showing the state of close contact between the heat block shown in FIG. 1 and the die island under normal conditions. FIGS. 3 a, b, and c are the die islands of the heat block shown in FIG. 1. Cutaway side view showing the state of close contact during an abnormal situation with the
5A, B, and C are plan views and side views showing an example of the recesses of a conventional heat block, and FIGS. Figure 6a
, b, and c are cut-away side views showing the state of close contact between the heat block and the die island shown in FIG. 4 in an abnormal situation, FIG. 7 is a plan view showing an example of the lead frame to which the present invention is applied, and FIG. 8 a , b are a plan view and a side view showing the die island portion of the lead frame shown in FIG. 7. 1...Frame part, 2...Die island, 3
...Lead part, 4...Die island connection part, 1
1... Heat block, 12... Hollow, 12a,
13a...A recessed portion deeper than the recessed portion 12, and the same reference numerals in the drawings indicate the same or corresponding portions.
Claims (1)
イランドの裏面をヒートブロツクの窪みの底面に
重ね、リード部を上から板で押えてクランプし、
上記ダイアイランドの表面に接着したダイスのワ
イヤボンデイングパツドとリード部をワイヤボン
デイングするワイヤボンデイング装置において、
上記ヒートブロツクの窪みの周辺部分及びリード
フレームのダイアイランド連結部が収まる部分を
リードフレームのダイアイランドの裏面が重なる
底面部より低くしたことを特徴とするワイヤボン
デイング装置。 Place the back side of the die island below the frame surface of the lead frame on the bottom of the recess of the heat block, press the lead part from above with a plate, and clamp it.
In a wire bonding device for wire bonding the wire bonding pad and lead portion of the die bonded to the surface of the die island,
A wire bonding apparatus characterized in that the peripheral part of the recess of the heat block and the part where the die island connection part of the lead frame is accommodated are lower than the bottom part where the back surface of the die island of the lead frame overlaps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7837488U JPH0617289Y2 (en) | 1988-06-15 | 1988-06-15 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7837488U JPH0617289Y2 (en) | 1988-06-15 | 1988-06-15 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02728U true JPH02728U (en) | 1990-01-05 |
| JPH0617289Y2 JPH0617289Y2 (en) | 1994-05-02 |
Family
ID=31303303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7837488U Expired - Lifetime JPH0617289Y2 (en) | 1988-06-15 | 1988-06-15 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617289Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931420A (en) * | 2019-11-19 | 2020-03-27 | 苏州日月新半导体有限公司 | Heating block unit and heating device |
-
1988
- 1988-06-15 JP JP7837488U patent/JPH0617289Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931420A (en) * | 2019-11-19 | 2020-03-27 | 苏州日月新半导体有限公司 | Heating block unit and heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617289Y2 (en) | 1994-05-02 |