JPH0273733U - - Google Patents
Info
- Publication number
- JPH0273733U JPH0273733U JP15348988U JP15348988U JPH0273733U JP H0273733 U JPH0273733 U JP H0273733U JP 15348988 U JP15348988 U JP 15348988U JP 15348988 U JP15348988 U JP 15348988U JP H0273733 U JPH0273733 U JP H0273733U
- Authority
- JP
- Japan
- Prior art keywords
- holding
- wafer
- rods
- holding device
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims 24
- 230000000903 blocking effect Effects 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 230000001105 regulatory effect Effects 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図及び第２図は本考案の実施例に係る縦型
構造の石英ガラス製ボードを示し第１図はその全
体斜視図、第２図ａ，ｂは正面断面図と横断面図
である。第３図は他の実施例に係る横型構造の石
英ガラス製ボードを示す全体斜視図である。第４
図は従来技術に係る縦型構造の石英ガラス製ボー
ドを示す全体斜視図である。
１，２：ボート、３：ウエーハ、１１，１２，
２１，２２：保持棒、１０，２０：保持溝、１３
，１４，２３〜２５：棒体。
1 and 2 show a quartz glass board with a vertical structure according to an embodiment of the present invention, FIG. 1 is an overall perspective view thereof, and FIGS. 2a and 2b are a front sectional view and a cross sectional view. . FIG. 3 is an overall perspective view showing a horizontally structured quartz glass board according to another embodiment. Fourth
The figure is an overall perspective view showing a vertically structured quartz glass board according to the prior art. 1, 2: Boat, 3: Wafer, 11, 12,
21, 22: Holding rod, 10, 20: Holding groove, 13
, 14, 23-25: Rod body.
Claims (1)
エーハ保持装置において、ウエーハ整列方向への
位置規制を行いつつ所定位置へ位置決め保持を行
う保持手段と、該ウエーハの取り出し方向への移
動を阻止する阻止手段を備え、該阻止手段を着脱
自在に構成した事を特徴とするウエーハ保持装置
。 (2) 複数枚の半導体ウエーハを整列保持するウ
エーハ保持装置において、ウエーハ整列方向への
位置規制を行いつつ所定位置へ位置決め保持を行
う保持手段と、該ウエーハに半径方向に押圧力を
付勢する付勢手段を備え、該付勢手段が付勢力を
解除可能に構成した事を特徴とするウエーハ保持
装置。 (3) 前記保持手段が、軸方向に多数の保持溝を
刻設した複数の保持棒からなり、又前記阻止手段
を、前記保持棒とウエーハ半径方向で交差する少
なくとも一対以上の棒体から構成し、該棒体の内
少なくとも一の棒体を装置本体に対し着脱自在に
構成された棒体である請求項(1)記載のウエーハ
保持装置。 (4) 前記保持手段が、軸方向に多数の保持溝を
刻設した複数の保持棒からなり、又前記付勢手段
がウエーハを挾んで対面可能に配置した一対以上
の棒体であり、そして該一の棒体がウエーハ半径
方向に変位可能に構成した事を特徴とする請求項
(2)記載のウエーハ保持装置。 (5) 複数枚の半導体ウエーハを整列保持するウ
エーハ保持装置において、ウエーハの軸方向の位
置規制と半径方向の位置規制を分離させ、前者の
位置規制を、ウエーハ周縁と対面する複数の保持
棒に刻設した保持溝で行い、一方後者の位置規制
を前記保持棒とともに、該保持棒とウエーハ半径
方向で交差する少なくとも一対以上の棒体で行う
事を特徴とするウエーハ保持装置。 (6) 請求項(3)，(4)、若しくは(5)項に記載した
一対以上の棒体の内、装置本体側に固定されてい
る少なくとも一の棒体に軸方向に多数の保持溝を
刻設した事を特徴とするウエーハ保持装置。[Claims for Utility Model Registration] (1) In a wafer holding device for aligning and holding a plurality of semiconductor wafers, a holding means for positioning and holding a plurality of semiconductor wafers in a predetermined position while regulating the position in the wafer alignment direction, and for taking out the wafers. What is claimed is: 1. A wafer holding device, comprising a blocking means for blocking movement in the direction, and the blocking means is configured to be detachable. (2) A wafer holding device that holds a plurality of semiconductor wafers in alignment, including a holding means that positions and holds the wafers in a predetermined position while regulating their position in the wafer alignment direction, and a holding means that applies a pressing force to the wafers in the radial direction. A wafer holding device comprising a biasing means and configured such that the biasing force of the biasing means can be released. (3) The holding means comprises a plurality of holding rods having a large number of holding grooves carved in the axial direction, and the blocking means comprises at least one pair of rods intersecting the holding rods in the radial direction of the wafer. The wafer holding device according to claim 1, wherein at least one of the rods is configured to be detachably attached to the main body of the device. (4) The holding means is composed of a plurality of holding rods having a large number of holding grooves carved in the axial direction, and the urging means is a pair or more of rods arranged so as to sandwich the wafer so as to face each other, and A claim characterized in that the one rod is configured to be displaceable in the radial direction of the wafer.
The wafer holding device described in (2). (5) In a wafer holding device that aligns and holds multiple semiconductor wafers, the axial position regulation and radial position regulation of the wafer are separated, and the former position regulation is applied to a plurality of holding bars facing the wafer periphery. A wafer holding device characterized in that the holding groove is engraved, and the position of the latter is controlled by at least one pair of rods that intersect with the holding rod in the radial direction of the wafer. (6) Among the pair or more rods described in claim (3), (4), or (5), at least one rod fixed to the device main body has a large number of retaining grooves in the axial direction. A wafer holding device characterized by being engraved with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988153489U JPH0632679Y2 (en) | 1988-11-28 | 1988-11-28 | Wafer holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988153489U JPH0632679Y2 (en) | 1988-11-28 | 1988-11-28 | Wafer holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0273733U true JPH0273733U (en) | 1990-06-05 |
| JPH0632679Y2 JPH0632679Y2 (en) | 1994-08-24 |
Family
ID=31429374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988153489U Expired - Fee Related JPH0632679Y2 (en) | 1988-11-28 | 1988-11-28 | Wafer holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632679Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS434952Y1 (en) * | 1965-03-03 | 1968-03-02 | ||
| JPS5067558A (en) * | 1973-10-15 | 1975-06-06 | ||
| JPS5878423A (en) * | 1981-10-16 | 1983-05-12 | ヘルムト・ザイエル・ゲ−エムベ−ハ− | Method of heat treating semiconductor article and device therefor |
-
1988
- 1988-11-28 JP JP1988153489U patent/JPH0632679Y2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS434952Y1 (en) * | 1965-03-03 | 1968-03-02 | ||
| JPS5067558A (en) * | 1973-10-15 | 1975-06-06 | ||
| JPS5878423A (en) * | 1981-10-16 | 1983-05-12 | ヘルムト・ザイエル・ゲ−エムベ−ハ− | Method of heat treating semiconductor article and device therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0632679Y2 (en) | 1994-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |